Class information for: |
Basic class information |
ID | Publications | Average number of references |
Avg. shr. active ref. in WoS |
---|---|---|---|
10693 | 975 | 21.8 | 54% |
Classes in level above (level 2) |
ID, lev. above |
Publications | Label for level above |
---|---|---|
2847 | 2446 | INTERFACIAL SHEARS//MICROBENDING LOSS//RAPID THERMAL PROCESSING RTP |
Terms with highest relevance score |
Rank | Term | Type of term | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
---|---|---|---|---|---|---|
1 | PARASITIC REACTION | Author keyword | 5 | 60% | 1% | 6 |
2 | CVD REACTOR | Author keyword | 4 | 50% | 1% | 6 |
3 | MOCVD REACTOR | Author keyword | 3 | 100% | 0% | 3 |
4 | VERTICAL ROTATING DISK REACTOR | Author keyword | 3 | 100% | 0% | 3 |
5 | SILICON EPITAXIAL GROWTH | Author keyword | 2 | 38% | 1% | 5 |
6 | BARREL REACTOR | Author keyword | 2 | 67% | 0% | 2 |
7 | CLOSE SPACED VERTICAL REACTOR | Author keyword | 2 | 67% | 0% | 2 |
8 | EQUIPMENT SIMULATION | Author keyword | 2 | 67% | 0% | 2 |
9 | FUNDAMENTAL SCI DEF WIDE BAND G SE | Address | 2 | 67% | 0% | 2 |
10 | LPCVD FURNACE | Author keyword | 2 | 67% | 0% | 2 |
Web of Science journal categories |
Author Key Words |
Rank | Web of Science journal category | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
LCSH search | Wikipedia search |
---|---|---|---|---|---|---|---|
1 | PARASITIC REACTION | 5 | 60% | 1% | 6 | Search PARASITIC+REACTION | Search PARASITIC+REACTION |
2 | CVD REACTOR | 4 | 50% | 1% | 6 | Search CVD+REACTOR | Search CVD+REACTOR |
3 | MOCVD REACTOR | 3 | 100% | 0% | 3 | Search MOCVD+REACTOR | Search MOCVD+REACTOR |
4 | VERTICAL ROTATING DISK REACTOR | 3 | 100% | 0% | 3 | Search VERTICAL+ROTATING+DISK+REACTOR | Search VERTICAL+ROTATING+DISK+REACTOR |
5 | SILICON EPITAXIAL GROWTH | 2 | 38% | 1% | 5 | Search SILICON+EPITAXIAL+GROWTH | Search SILICON+EPITAXIAL+GROWTH |
6 | BARREL REACTOR | 2 | 67% | 0% | 2 | Search BARREL+REACTOR | Search BARREL+REACTOR |
7 | CLOSE SPACED VERTICAL REACTOR | 2 | 67% | 0% | 2 | Search CLOSE+SPACED+VERTICAL+REACTOR | Search CLOSE+SPACED+VERTICAL+REACTOR |
8 | EQUIPMENT SIMULATION | 2 | 67% | 0% | 2 | Search EQUIPMENT+SIMULATION | Search EQUIPMENT+SIMULATION |
9 | LPCVD FURNACE | 2 | 67% | 0% | 2 | Search LPCVD+FURNACE | Search LPCVD+FURNACE |
10 | MULTIWAFER REACTOR | 2 | 67% | 0% | 2 | Search MULTIWAFER+REACTOR | Search MULTIWAFER+REACTOR |
Key Words Plus |
Rank | Web of Science journal category | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
---|---|---|---|---|---|
1 | MOCVD REACTORS | 54 | 75% | 4% | 39 |
2 | WALL TUBULAR REACTORS | 32 | 85% | 2% | 17 |
3 | HORIZONTAL REACTORS | 19 | 80% | 1% | 12 |
4 | COMPLEX FLOW PHENOMENA | 17 | 79% | 1% | 11 |
5 | CVD REACTORS | 17 | 72% | 1% | 13 |
6 | LPCVD REACTORS | 15 | 88% | 1% | 7 |
7 | OMVPE REACTOR | 15 | 88% | 1% | 7 |
8 | VAPOR DEPOSITION REACTOR | 13 | 51% | 2% | 18 |
9 | DISK OMVPE REACTORS | 11 | 78% | 1% | 7 |
10 | SINGLE WAFER REACTOR | 9 | 40% | 2% | 17 |
Journals |
Reviews |
Title | Publ. year | Cit. | Active references | % act. ref. to same field |
---|---|---|---|---|
FLOW PHENOMENA IN CHEMICAL VAPOR-DEPOSITION OF THIN-FILMS | 1991 | 108 | 63 | 67% |
DESIGN AND MODELING OF CHEMICAL VAPOR-DEPOSITION REACTORS | 1992 | 28 | 96 | 75% |
MODELING AND CONTROL OF MICROELECTRONICS MATERIALS PROCESSING | 1995 | 31 | 105 | 34% |
Metal organic vapour phase epitaxy of AlN, GaN, InN and their alloys: A key chemical technology for advanced device applications | 2013 | 12 | 159 | 13% |
Kinetic approach to materials synthesis by gas-phase deposition | 1998 | 11 | 60 | 57% |
Fluid-dynamics during vapor epitaxy and modeling | 2003 | 6 | 34 | 94% |
Chemical vapour deposition of coatings | 2003 | 524 | 205 | 6% |
The metal organic vapour phase epitaxy of ZnTe .2. Analysis of growth conditions | 1995 | 8 | 27 | 33% |
Chemical engineering aspects of advanced ceramic materials | 1996 | 39 | 84 | 20% |
Process modelling in metal-organic vapour phase epitaxy | 1997 | 0 | 13 | 69% |
Address terms |
Rank | Address term | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
---|---|---|---|---|---|
1 | FUNDAMENTAL SCI DEF WIDE BAND G SE | 2 | 67% | 0.2% | 2 |
2 | DIPARTIMENTO CHIM FIS PLICATA | 2 | 14% | 1.1% | 11 |
3 | EPITAXIAL SILICON TECHNOL | 1 | 100% | 0.2% | 2 |
4 | TOURISM DESIGN | 1 | 100% | 0.2% | 2 |
5 | ISOBE RD | 1 | 25% | 0.4% | 4 |
6 | CHIM MAT INGN CHIM | 1 | 33% | 0.2% | 2 |
7 | PARALLEL COMPUTAT SCI | 1 | 23% | 0.3% | 3 |
8 | CHIM MAT INGN CHIM G NATTA | 1 | 17% | 0.4% | 4 |
9 | CNRS UPR 8001 | 1 | 50% | 0.1% | 1 |
10 | CORPORATE MFG ENGN | 1 | 50% | 0.1% | 1 |
Related classes at same level (level 1) |
Rank | Relatedness score | Related classes |
---|---|---|
1 | 0.0000147232 | TRIMETHYLINDIUM//CHEMICAL BEAM EPITAXY CBE//MOLECULAR LAYER EPITAXY |
2 | 0.0000139095 | ATOMIC LAYER DOPING//SI EPITAXIAL GROWTH//GERMANIUM SILICON COMPOUNDS |
3 | 0.0000133474 | CVD W//FEATURE SCALE MODEL//FOCUS NEW YORK |
4 | 0.0000119104 | RAPID THERMAL PROCESSING RTP//RAPID THERMAL PROCESSING//CTOD FRACTURE TOUGHNESS TESTING |
5 | 0.0000100666 | ELECTROCHEMICAL VAPOR DEPOSITION//BETA DIKETONE METAL CHELATES//COLD PLASMA PROCESS |
6 | 0.0000093787 | MIXED CONVECTION//VERTICAL FLAT CHANNEL//INCLINED DUCT |
7 | 0.0000080816 | ISOTHERMAL CHEMICAL VAPOR INFILTRATION//PRESSURE PULSED CHEMICAL VAPOR INFILTRATION//3D IMAGE BASED MODELING |
8 | 0.0000079874 | SIPOS//MSOS O P STRUCTURE//SEMI INSULATING POLYCRYSTALLINE SILICON |
9 | 0.0000076838 | ING ELECT SEES//SECC PUEBLA//ALLOY SOURCE |
10 | 0.0000068606 | 1 3 DISILACYCLOBUTANE//LASER CHEM GRP//SPIRO SI HETEROCYCLIC RING COMPOUND |