Class information for:
Level 1: MICROBENDING LOSS//OPTICAL FIBER MECHANICAL FACTORS//AEM GRP

Basic class information
ID Publications Average number
of references		 Avg. shr. active
ref. in WoS
18318 492 18.6 44%


Bar chart of Publication_year

Last years might be incomplete

Classes in level above (level 2)


ID, lev.
above		 Publications Label for level above
2847 2446 INTERFACIAL SHEARS//MICROBENDING LOSS//RAPID THERMAL PROCESSING RTP

Terms with highest relevance score


Rank Term Type of term Relevance score
(tfidf)		 Class's shr.
of term's tot.
occurrences		 Shr. of publ.
in class containing
term		 Num. of
publ. in
class
1 MICROBENDING LOSS Author keyword 12 63% 2% 12
2 OPTICAL FIBER MECHANICAL FACTORS Author keyword 3 50% 1% 4
3 AEM GRP Address 2 67% 0% 2
4 HOT AIR STREAM Author keyword 1 100% 0% 2
5 THERMAL CHEMICAL VAPOR DEPOSITION Author keyword 1 10% 2% 10
6 GRADED INTERLAYER Author keyword 1 25% 1% 3
7 LUCENT TECHNOL INC Address 1 17% 1% 4
8 AMPLITUDE FLUCTUATION ELECTRONIC SPECKLE PATTERN INTERFEROMETRY AF ESPI Author keyword 1 50% 0% 1
9 BASIC PHYS SCI ENGN Address 1 50% 0% 1
10 BIMATERIAL STRUCTURES Author keyword 1 50% 0% 1

Web of Science journal categories

Author Key Words


Rank Web of Science journal category Relevance score
(tfidf)		 Class's shr.
of term's tot.
occurrences		 Shr. of publ.
in class containing
term		 Num. of
publ. in
class		 LCSH search Wikipedia search
1 MICROBENDING LOSS 12 63% 2% 12 Search MICROBENDING+LOSS Search MICROBENDING+LOSS
2 OPTICAL FIBER MECHANICAL FACTORS 3 50% 1% 4 Search OPTICAL+FIBER+MECHANICAL+FACTORS Search OPTICAL+FIBER+MECHANICAL+FACTORS
3 HOT AIR STREAM 1 100% 0% 2 Search HOT+AIR+STREAM Search HOT+AIR+STREAM
4 THERMAL CHEMICAL VAPOR DEPOSITION 1 10% 2% 10 Search THERMAL+CHEMICAL+VAPOR+DEPOSITION Search THERMAL+CHEMICAL+VAPOR+DEPOSITION
5 GRADED INTERLAYER 1 25% 1% 3 Search GRADED+INTERLAYER Search GRADED+INTERLAYER
6 AMPLITUDE FLUCTUATION ELECTRONIC SPECKLE PATTERN INTERFEROMETRY AF ESPI 1 50% 0% 1 Search AMPLITUDE+FLUCTUATION+ELECTRONIC+SPECKLE+PATTERN+INTERFEROMETRY+AF+ESPI Search AMPLITUDE+FLUCTUATION+ELECTRONIC+SPECKLE+PATTERN+INTERFEROMETRY+AF+ESPI
7 BIMATERIAL STRUCTURES 1 50% 0% 1 Search BIMATERIAL+STRUCTURES Search BIMATERIAL+STRUCTURES
8 COATED OPTICS 1 50% 0% 1 Search COATED+OPTICS Search COATED+OPTICS
9 DIFFERENT UNIFORM TEMPERATURE MODEL 1 50% 0% 1 Search DIFFERENT+UNIFORM+TEMPERATURE+MODEL Search DIFFERENT+UNIFORM+TEMPERATURE+MODEL
10 ELASTIC PLASTIC ANALYSES 1 50% 0% 1 Search ELASTIC+PLASTIC+ANALYSES Search ELASTIC+PLASTIC+ANALYSES

Key Words Plus


Rank Web of Science journal category Relevance score
(tfidf)		 Class's shr.
of term's tot.
occurrences		 Shr. of publ.
in class containing
term		 Num. of
publ. in
class
1 INDUCED MICROBENDING LOSSES 31 92% 2% 12
2 INDUCED STRESS VOIDS 30 84% 3% 16
3 CVD CARBON 23 100% 2% 10
4 BIMETAL THERMOSTATS 11 35% 5% 26
5 COATED OPTICAL FIBERS 10 61% 2% 11
6 MECHANICAL STRIP FORCES 8 100% 1% 5
7 END PROBLEM 4 67% 1% 4
8 LAMINATED ELASTIC STRIP 4 67% 1% 4
9 ADHESIVELY BONDED ASSEMBLIES 3 100% 1% 3
10 MICROBENDING LOSS 3 45% 1% 5

Journals

Reviews


Title Publ. year Cit. Active
references		 % act. ref.
to same field
Predictive Analytical Thermal Stress Modeling in Electronics and Photonics 2009 5 59 61%
Effect of temperature rise and hydrostatic pressure on microbending loss and refractive index change in double-coated optical fiber 2006 2 12 83%
Historical review: The development of multicomponent glass fibres for optical communications by Toshiba 2004 0 6 67%
ORIENTED POLYMERS OBTAINED BY UV POLYMERIZATION OF ORIENTED LOW-MOLECULAR-WEIGHT SPECIES 1987 3 4 100%
POLYMER-COATINGS FOR OPTICAL FIBERS 1985 2 9 44%
REVIEW OF GLASS-FIBERS FOR OPTICAL COMMUNICATIONS 1980 26 1 100%

Address terms


Rank Address term Relevance score
(tfidf)		 Class's shr.
of term's tot.
occurrences		 Shr. of publ.
in class containing
term		 Num. of
publ.
in class
1 AEM GRP 2 67% 0.4% 2
2 LUCENT TECHNOL INC 1 17% 0.8% 4
3 BASIC PHYS SCI ENGN 1 50% 0.2% 1
4 IBARAKI ELECT COMMUN S OUTSIDE PLANT DEV 1 50% 0.2% 1
5 WASHINGTON CTY 1 50% 0.2% 1
6 UB ELECT PACKAGING 1 19% 0.6% 3
7 ADV CIRCUIT INTERCONNECT RD 0 33% 0.2% 1
8 INFORMAT SCI TECHNOL A FAEDO 0 25% 0.2% 1
9 MICRO NANO TECHNOL SYST LIAO NING PROV 0 20% 0.2% 1
10 OFS 0 20% 0.2% 1

Related classes at same level (level 1)


Rank Relatedness score Related classes
1 0.0000191420 INTERFACIAL SHEARS//NON LOCAL STRESS CURVATURE RELATIONS//NON UNIFORM MISFIT STRAIN
2 0.0000158918 REVIEW OF THE ELECTRICAL COMMUNICATIONS LABORATORIES//IBARAKI ELECT COMMUN S TRANSMISS LINE//ATSUGI ELECT COMMUN S INTEGRATED ELE
3 0.0000123665 LARMAUR//DCDC SPECIMEN//GLASS SCI TECHNOL
4 0.0000068983 JOURNAL OF ELECTRONIC PACKAGING//SOLDERING & SURFACE MOUNT TECHNOLOGY//SOLDER JOINT
5 0.0000068879 ABEL INVERSION//OPTICAL FIBER REFRACTIVE INDEX//TOMOGRAPHIC INTERFEROMETRY
6 0.0000066795 HEAT TRANSFER INSTABILITY//INDIUM JOINT//INFRARED IR EMISSIONS
7 0.0000062335 INTERLAMINAR STRESSES//FREE EDGE EFFECT//FREE CORNER EFFECT
8 0.0000056467 PLATED THROUGH HOLE//ENDICOTT ELECT PACKAGING//THREE DIMENSIONAL 3 D CHIP STACKING
9 0.0000054402 UNDERFILL FLOW//WIRE SWEEP//BUMP PITCH
10 0.0000050340 AMERG//PHYS PROCEDES VIDE//INTRINSIC STRESS