Class information for: |
Basic class information |
| ID | Publications | Average number of references |
Avg. shr. active ref. in WoS |
|---|---|---|---|
| 28345 | 170 | 13.2 | 43% |
Classes in level above (level 2) |
| ID, lev. above |
Publications | Label for level above |
|---|---|---|
| 1792 | 5778 | DIFFUSION BARRIER//ELECTROMIGRATION//CU METALLIZATION |
Terms with highest relevance score |
| Rank | Term | Type of term | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
|---|---|---|---|---|---|---|
| 1 | CROSS BRIDGE KELVIN RESISTOR CBKR | Author keyword | 6 | 80% | 2% | 4 |
| 2 | CROSS KELVIN RESISTOR CKR | Author keyword | 6 | 100% | 2% | 4 |
| 3 | CROSS BRIDGE KELVIN RESISTOR | Author keyword | 1 | 50% | 1% | 1 |
| 4 | DRAM CELL | Author keyword | 1 | 50% | 1% | 1 |
| 5 | ELEVATED S D | Author keyword | 1 | 50% | 1% | 1 |
| 6 | ELEVATED SOURCE DRAIN MOSFET | Author keyword | 1 | 50% | 1% | 1 |
| 7 | PARASITIC JUNCTION CAPACITANCE | Author keyword | 1 | 50% | 1% | 1 |
| 8 | POLYSILICON GATE DEPLETION EFFECT | Author keyword | 1 | 50% | 1% | 1 |
| 9 | POWER TECHNOLOGY | Author keyword | 1 | 50% | 1% | 1 |
| 10 | SPECIFIC CONTACT RESISTIVITY | Author keyword | 1 | 13% | 3% | 5 |
Web of Science journal categories |
Author Key Words |
Key Words Plus |
| Rank | Web of Science journal category | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
|---|---|---|---|---|---|
| 1 | BRIDGE KELVIN RESISTOR | 3 | 60% | 2% | 3 |
| 2 | CROSS KELVIN RESISTOR | 1 | 100% | 1% | 2 |
| 3 | ADVANCED MODEL | 1 | 25% | 2% | 4 |
| 4 | ALUMINUM GERMANIUM ALLOYS | 1 | 50% | 1% | 1 |
| 5 | DIFFUSION SOURCES | 1 | 50% | 1% | 1 |
| 6 | NANOMETER REGIME | 1 | 12% | 2% | 4 |
| 7 | CONTACT RESISTIVITY | 0 | 13% | 1% | 2 |
Journals |
Reviews |
Address terms |
| Rank | Address term | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
|---|---|---|---|---|---|
| 1 | ADV LOG | 0 | 25% | 0.6% | 1 |
| 2 | NXP TSMC | 0 | 25% | 0.6% | 1 |
| 3 | CHAIR SEMICOND CPDS | 0 | 100% | 0.6% | 1 |
Related classes at same level (level 1) |
| Rank | Relatedness score | Related classes |
|---|---|---|
| 1 | 0.0000208691 | W TI THIN FILMS//WTI THIN FILMS//SURFACE LASER TREATMENT |
| 2 | 0.0000170490 | ULTRAVIOLET LIGHT DETECTORS//ORIENTATION OF MOLECULES//BORON CHEMICAL VAPOR DEPOSITION |
| 3 | 0.0000134654 | TISI2//SALICIDE//NICKEL SILICIDE |
| 4 | 0.0000133982 | SCHOTTKY BARRIER SB//DOPANT SEGREGATION DS//SCHOTTKY BARRIER SB MOSFET |
| 5 | 0.0000109105 | SOLID PHASE REGROWTH//PD GE//OHMIC CONTACTS |
| 6 | 0.0000090689 | RADIATION INDUCED CHARGES//AF IOFFE PTI//RETAINED POLARIZATION |
| 7 | 0.0000087593 | CVD W//FEATURE SCALE MODEL//FOCUS NEW YORK |
| 8 | 0.0000075870 | A AXIS ORIENTED YBCO FILM//ARGON BEAM SPUTTERING//ELECTRODE RESISTIVITY |
| 9 | 0.0000073731 | PASSIVATED CONTACT//POLYSILICON EMITTER//CLOCK ACCESS TIME |
| 10 | 0.0000059966 | OHMIC CONTACT//OHMIC CONTACTS//P TYPE SIC |