Class information for:
Level 1: CHEMICAL MECHANICAL POLISHING//CHEMICAL MECHANICAL PLANARIZATION//CMP

Basic class information
ID Publications Average number
of references		 Avg. shr. active
ref. in WoS
2892 2045 20.7 55%


Bar chart of Publication_year

Last years might be incomplete

Classes in level above (level 2)


ID, lev.
above		 Publications Label for level above
2776 2621 CHEMICAL MECHANICAL POLISHING//CHEMICAL MECHANICAL PLANARIZATION//CMP

Terms with highest relevance score


Rank Term Type of term Relevance score
(tfidf)		 Class's shr.
of term's tot.
occurrences		 Shr. of publ.
in class containing
term		 Num. of
publ. in
class
1 CHEMICAL MECHANICAL POLISHING Author keyword 278 55% 17% 348
2 CHEMICAL MECHANICAL PLANARIZATION Author keyword 93 65% 4% 88
3 CMP Author keyword 83 31% 11% 220
4 CHEMICAL MECHANICAL POLISHING CMP Author keyword 72 48% 5% 111
5 CHEMICAL MECHANICAL PLANARIZATION CMP Author keyword 39 60% 2% 43
6 DISHING Author keyword 30 68% 1% 27
7 NANO SOI PROC Address 26 55% 2% 33
8 FAB Address 25 77% 1% 17
9 POST CMP CLEANING Author keyword 17 55% 1% 21
10 COPPER CMP Author keyword 17 75% 1% 12

Web of Science journal categories

Author Key Words


Rank Web of Science journal category Relevance score
(tfidf)		 Class's shr.
of term's tot.
occurrences		 Shr. of publ.
in class containing
term		 Num. of
publ. in
class		 LCSH search Wikipedia search
1 CHEMICAL MECHANICAL POLISHING 278 55% 17% 348 Search CHEMICAL+MECHANICAL+POLISHING Search CHEMICAL+MECHANICAL+POLISHING
2 CHEMICAL MECHANICAL PLANARIZATION 93 65% 4% 88 Search CHEMICAL+MECHANICAL+PLANARIZATION Search CHEMICAL+MECHANICAL+PLANARIZATION
3 CMP 83 31% 11% 220 Search CMP Search CMP
4 CHEMICAL MECHANICAL POLISHING CMP 72 48% 5% 111 Search CHEMICAL+MECHANICAL+POLISHING+CMP Search CHEMICAL+MECHANICAL+POLISHING+CMP
5 CHEMICAL MECHANICAL PLANARIZATION CMP 39 60% 2% 43 Search CHEMICAL+MECHANICAL+PLANARIZATION+CMP Search CHEMICAL+MECHANICAL+PLANARIZATION+CMP
6 DISHING 30 68% 1% 27 Search DISHING Search DISHING
7 POST CMP CLEANING 17 55% 1% 21 Search POST+CMP+CLEANING Search POST+CMP+CLEANING
8 COPPER CMP 17 75% 1% 12 Search COPPER+CMP Search COPPER+CMP
9 DIAMOND CONDITIONER 17 75% 1% 12 Search DIAMOND+CONDITIONER Search DIAMOND+CONDITIONER
10 WITHIN WAFER NON UNIFORMITY 17 100% 0% 8 Search WITHIN+WAFER+NON+UNIFORMITY Search WITHIN+WAFER+NON+UNIFORMITY

Key Words Plus


Rank Web of Science journal category Relevance score
(tfidf)		 Class's shr.
of term's tot.
occurrences		 Shr. of publ.
in class containing
term		 Num. of
publ. in
class
1 CMP 538 77% 18% 367
2 CHEMICAL MECHANICAL PLANARIZATION 209 71% 8% 169
3 PLANARIZATION 192 53% 12% 251
4 COPPER CMP 82 92% 2% 33
5 CMP PROCESS 49 82% 1% 28
6 CMP SLURRIES 44 100% 1% 16
7 REMOVAL RATE 43 62% 2% 45
8 IODATE BASED SLURRIES 24 91% 0% 10
9 MICRO CONTACT 23 79% 1% 15
10 SLURRY 21 12% 8% 172

Journals

Reviews


Title Publ. year Cit. Active references % act. ref.
to same field
Chemical Mechanical Planarization: Slurry Chemistry, Materials, and Mechanisms 2010 73 86 70%
Chemical mechanical planarization for microelectronics applications 2004 214 141 62%
Review on copper chemical-mechanical polishing (CMP) and post-CMP cleaning in ultra large system integrated (ULSI) - An electrochemical perspective 2007 49 54 80%
Colloid aspects of chemical-mechanical planarization 2008 33 55 65%
Mechanical properties of nanoparticles: basics and applications 2014 14 249 14%
Hydrodynamics of slurry flow in chemical mechanical polishing - A review 2006 27 26 92%
Progress in material removal mechanisms of surface polishing with ultra precision 2004 23 27 85%
Particle Technology in Chemical Mechanical Planarization 2007 4 23 87%
A comprehensive review of endpoint detection in chemical mechanical planarization for deep-submicron integrated circuits manufacturing 2003 4 11 100%
Shallow Trench Isolation Chemical Mechanical Planarization: A Review 2015 0 71 80%

Address terms


Rank Address term Relevance score
(tfidf)		 Class's shr.
of term's tot.
occurrences		 Shr. of publ.
in class containing
term		 Num. of
publ. in
class
1 NANO SOI PROC 26 55% 1.6% 33
2 FAB 25 77% 0.8% 17
3 ENERGY OURCES TECHNOL 14 46% 1.1% 23
4 ADV SEMICOND MAT DEVICE DEV 8 50% 0.5% 11
5 SEMICOND DISPLAY 6 80% 0.2% 4
6 ADV SEMICOND MAT DEVICES DEV 6 41% 0.5% 11
7 GP TECHNOL 6 100% 0.2% 4
8 SEE TEAM 4 67% 0.2% 4
9 ELECT RD GRP 4 75% 0.1% 3
10 SHENZHEN MICRO NANO MFG 3 43% 0.3% 6

Related classes at same level (level 1)


Rank Relatedness score Related classes
1 0.0000120376 HYDRODYNAMIC POLISHING PROCESS//ULTR RECIS SCI TECHNOL//JOINT OPTOMECHATRON DESIGN ENGN
2 0.0000074994 INTERNAL FINISHING//ABRASIVE FLOW MACHINING//MAGNETIC ABRASIVE FINISHING
3 0.0000057027 MAKYOH TOPOGRAPHY//WIRE SAWING//WAFER PRODUCTION
4 0.0000049224 SIDEWALL OXIDATION//COMPUTAT ELECT//MEMORY DEVICE BUSINESS
5 0.0000035066 DIFFUSION BARRIER//CU METALLIZATION//TANTALUM NITRIDE
6 0.0000034217 SELF ANNEALING//COPPER ELECTRODEPOSITION//COPPER ELECTROPLATING
7 0.0000027914 CERIUM OXIDE NANOPARTICLES//CERIUM OXIDE//NANOCERIA
8 0.0000027801 BURR SIZE//DEBURRING TOOL//BURR FORMATION
9 0.0000027280 TOY GAME DESIGN//ELECTROCHEMICAL MACHINING//ELECTROCHEMICAL MACHINING ECM
10 0.0000027172 TIGHT BINDING QUANTUM CHEMICAL MOLECULAR DYNAMICS//TIGHT BINDING QUANTUM CHEMICAL MOLECULAR DYNAMICS METHOD//QUANTUM CHEMICAL MOLECULAR DYNAMICS