Class information for: |
Basic class information |
| ID | Publications | Average number of references |
Avg. shr. active ref. in WoS |
|---|---|---|---|
| 33359 | 93 | 14.6 | 23% |
Classes in level above (level 2) |
| ID, lev. above |
Publications | Label for level above |
|---|---|---|
| 688 | 12395 | LEAD FREE SOLDER//SOLDERING & SURFACE MOUNT TECHNOLOGY//PB FREE SOLDER |
Terms with highest relevance score |
| Rank | Term | Type of term | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
|---|---|---|---|---|---|---|
| 1 | INNER LEAD BONDING ILB | Author keyword | 3 | 60% | 3% | 3 |
| 2 | INNER LEAD BONDING | Author keyword | 2 | 43% | 3% | 3 |
| 3 | LASER SOLDERING | Author keyword | 1 | 11% | 8% | 7 |
| 4 | CONVECTION FAN | Author keyword | 1 | 50% | 1% | 1 |
| 5 | INFRARED MEASURING | Author keyword | 1 | 50% | 1% | 1 |
| 6 | QFP DEVICE | Author keyword | 1 | 50% | 1% | 1 |
| 7 | SN PB EUTECTIC SOLDER BALL | Author keyword | 1 | 50% | 1% | 1 |
| 8 | SPECIAL PROJECT GRP | Address | 1 | 50% | 1% | 1 |
| 9 | TAPE CARRIER PACKAGE TCP | Author keyword | 1 | 50% | 1% | 1 |
| 10 | ACCEPTABILITY RATINGS | Author keyword | 0 | 33% | 1% | 1 |
Web of Science journal categories |
Author Key Words |
| Rank | Web of Science journal category | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
LCSH search | Wikipedia search |
|---|---|---|---|---|---|---|---|
| 1 | INNER LEAD BONDING ILB | 3 | 60% | 3% | 3 | Search INNER+LEAD+BONDING+ILB | Search INNER+LEAD+BONDING+ILB |
| 2 | INNER LEAD BONDING | 2 | 43% | 3% | 3 | Search INNER+LEAD+BONDING | Search INNER+LEAD+BONDING |
| 3 | LASER SOLDERING | 1 | 11% | 8% | 7 | Search LASER+SOLDERING | Search LASER+SOLDERING |
| 4 | CONVECTION FAN | 1 | 50% | 1% | 1 | Search CONVECTION+FAN | Search CONVECTION+FAN |
| 5 | INFRARED MEASURING | 1 | 50% | 1% | 1 | Search INFRARED+MEASURING | Search INFRARED+MEASURING |
| 6 | QFP DEVICE | 1 | 50% | 1% | 1 | Search QFP+DEVICE | Search QFP+DEVICE |
| 7 | SN PB EUTECTIC SOLDER BALL | 1 | 50% | 1% | 1 | Search SN+PB+EUTECTIC+SOLDER+BALL | Search SN+PB+EUTECTIC+SOLDER+BALL |
| 8 | TAPE CARRIER PACKAGE TCP | 1 | 50% | 1% | 1 | Search TAPE+CARRIER+PACKAGE+TCP | Search TAPE+CARRIER+PACKAGE+TCP |
| 9 | ACCEPTABILITY RATINGS | 0 | 33% | 1% | 1 | Search ACCEPTABILITY+RATINGS | Search ACCEPTABILITY+RATINGS |
| 10 | ROUTINE DOSIMETER | 0 | 33% | 1% | 1 | Search ROUTINE+DOSIMETER | Search ROUTINE+DOSIMETER |
Key Words Plus |
| Rank | Web of Science journal category | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
|---|---|---|---|---|---|
| 1 | SURFACE MOUNTED DEVICES | 0 | 33% | 1% | 1 |
| 2 | SOLDERING PROCESS | 0 | 20% | 1% | 1 |
| 3 | AU SN | 0 | 14% | 1% | 1 |
| 4 | ILB | 0 | 100% | 1% | 1 |
Journals |
Reviews |
Address terms |
| Rank | Address term | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
|---|---|---|---|---|---|
| 1 | SPECIAL PROJECT GRP | 1 | 50% | 1.1% | 1 |
| 2 | NUMER MODELING PROC ANAL | 0 | 20% | 1.1% | 1 |
| 3 | LCDD PROJECT ENGN | 0 | 100% | 1.1% | 1 |
| 4 | SPORTS HIGH RIO MAIOR | 0 | 100% | 1.1% | 1 |
| 5 | TEST FIELD QUAL ASSURANCE | 0 | 100% | 1.1% | 1 |
Related classes at same level (level 1) |
| Rank | Relatedness score | Related classes |
|---|---|---|
| 1 | 0.0000156015 | FLUXLESS BONDING//AU SN SOLDER//MAT MFG TECHNOL PROGRAM |
| 2 | 0.0000143599 | PLATED THROUGH HOLE//ENDICOTT ELECT PACKAGING//THREE DIMENSIONAL 3 D CHIP STACKING |
| 3 | 0.0000123198 | SENSORS SUR E TECHNOL PARTNERSHIP//SMART MAT MEMS//THIN FILM THERMOCOUPLES |
| 4 | 0.0000117743 | ANISOTROPIC CONDUCTIVE ADHESIVE ACA//ANISOTROPIC CONDUCTIVE FILM ACF//ANISOTROPIC CONDUCTIVE FILM |
| 5 | 0.0000095249 | ELECTROCHEMICAL MIGRATION//MECHANICAL RELIABILITY PREDICTION//CONDUCTIVE ANODIC FILAMENT |
| 6 | 0.0000079241 | UNDERFILL FLOW//WIRE SWEEP//BUMP PITCH |
| 7 | 0.0000077913 | POTASSIUM LITHIUM NIOBATE//MICRO PULLING DOWN GROWTH//KLN |
| 8 | 0.0000067760 | W TI THIN FILMS//WTI THIN FILMS//SURFACE LASER TREATMENT |
| 9 | 0.0000066720 | PULSED FIELD MAGNETOMETER//DEMAGNETIZING CORRECTION//FLUXMETRIC DEMAGNETIZING FACTOR |
| 10 | 0.0000064560 | PIPE FREEZING//LOW TEMP ENGN GRP//NON CIRCULAR SECTIONS |