| Class information for:  | 
| Basic class information | 
| ID | Publications | Average number of references | Avg. shr. active ref. in WoS | 
|---|---|---|---|
| 7831 | 1245 | 22.6 | 57% | 
| Classes in level above (level 2) | 
| ID, lev. above | Publications | Label for level above | 
|---|---|---|
| 824 | 11237 | PLASMA POLYMERIZATION//PLASMA PROCESSES AND POLYMERS//LOW K | 
| Terms with highest relevance score | 
| Rank | Term | Type of term | Relevance score (tfidf) | Class's shr. of term's tot. occurrences | Shr. of publ. in class containing term | Num. of publ. in class | 
|---|---|---|---|---|---|---|
| 1 | FLEXIBLE COPPER CLAD LAMINATE | Author keyword | 8 | 70% | 1% | 7 | 
| 2 | FLEXIBLE COPPER CLAD LAMINATE FCCL | Author keyword | 6 | 80% | 0% | 4 | 
| 3 | SILANE MODIFIED POLYVINYLIMIDAZOLE | Author keyword | 6 | 100% | 0% | 4 | 
| 4 | PMDA ODA | Author keyword | 5 | 54% | 1% | 7 | 
| 5 | CU ADHESION | Author keyword | 4 | 75% | 0% | 3 | 
| 6 | ELECTROLESS PLATED NI | Author keyword | 4 | 75% | 0% | 3 | 
| 7 | PEEL STRENGTH | Author keyword | 3 | 10% | 2% | 31 | 
| 8 | INKJET PRINTED AG | Author keyword | 3 | 100% | 0% | 3 | 
| 9 | IMIDIZATION TEMPERATURE | Author keyword | 2 | 67% | 0% | 2 | 
| 10 | METAL POLYIMIDE | Author keyword | 2 | 67% | 0% | 2 | 
| Web of Science journal categories | 
| Author Key Words | 
| Rank | Web of Science journal category | Relevance score (tfidf) | Class's shr. of term's tot. occurrences | Shr. of publ. in class containing term | Num. of publ. in class | LCSH search | Wikipedia search | 
|---|---|---|---|---|---|---|---|
| 1 | FLEXIBLE COPPER CLAD LAMINATE | 8 | 70% | 1% | 7 | Search FLEXIBLE+COPPER+CLAD+LAMINATE | Search FLEXIBLE+COPPER+CLAD+LAMINATE | 
| 2 | FLEXIBLE COPPER CLAD LAMINATE FCCL | 6 | 80% | 0% | 4 | Search FLEXIBLE+COPPER+CLAD+LAMINATE+FCCL | Search FLEXIBLE+COPPER+CLAD+LAMINATE+FCCL | 
| 3 | SILANE MODIFIED POLYVINYLIMIDAZOLE | 6 | 100% | 0% | 4 | Search SILANE+MODIFIED+POLYVINYLIMIDAZOLE | Search SILANE+MODIFIED+POLYVINYLIMIDAZOLE | 
| 4 | PMDA ODA | 5 | 54% | 1% | 7 | Search PMDA+ODA | Search PMDA+ODA | 
| 5 | CU ADHESION | 4 | 75% | 0% | 3 | Search CU+ADHESION | Search CU+ADHESION | 
| 6 | ELECTROLESS PLATED NI | 4 | 75% | 0% | 3 | Search ELECTROLESS+PLATED+NI | Search ELECTROLESS+PLATED+NI | 
| 7 | PEEL STRENGTH | 3 | 10% | 2% | 31 | Search PEEL+STRENGTH | Search PEEL+STRENGTH | 
| 8 | INKJET PRINTED AG | 3 | 100% | 0% | 3 | Search INKJET+PRINTED+AG | Search INKJET+PRINTED+AG | 
| 9 | IMIDIZATION TEMPERATURE | 2 | 67% | 0% | 2 | Search IMIDIZATION+TEMPERATURE | Search IMIDIZATION+TEMPERATURE | 
| 10 | METAL POLYIMIDE | 2 | 67% | 0% | 2 | Search METAL+POLYIMIDE | Search METAL+POLYIMIDE | 
| Key Words Plus | 
| Rank | Web of Science journal category | Relevance score (tfidf) | Class's shr. of term's tot. occurrences | Shr. of publ. in class containing term | Num. of publ. in class | 
|---|---|---|---|---|---|
| 1 | POLYIMIDE INTERFACE | 46 | 67% | 3% | 41 | 
| 2 | SINGLE STAGE SYNTHESIS | 38 | 93% | 1% | 14 | 
| 3 | KAPTON FILM | 33 | 83% | 2% | 19 | 
| 4 | CR POLYIMIDE | 24 | 82% | 1% | 14 | 
| 5 | CU CR FILMS | 15 | 82% | 1% | 9 | 
| 6 | ALUMINUM POLYIMIDE INTERFACE | 15 | 71% | 1% | 12 | 
| 7 | 1 VINYL IMIDAZOLE | 12 | 86% | 0% | 6 | 
| 8 | CURED POLYIMIDE | 12 | 86% | 0% | 6 | 
| 9 | POLYMERIC AGENTS | 12 | 86% | 0% | 6 | 
| 10 | POLYVINYLIMIDAZOLES | 12 | 86% | 0% | 6 | 
| Journals | 
| Reviews | 
| Title | Publ. year | Cit. | Active references | % act. ref. to same field | 
|---|---|---|---|---|
| Diffusion of metals in polymers | 1998 | 133 | 95 | 44% | 
| Inhibition of the corrosion of stainless steel by poly-N-vinylimidazole and N-vinylimidazole | 2011 | 9 | 45 | 42% | 
| Reflective and electrically conductive surface silvered polyimide films and coatings prepared via unusual single-stage self-metallization techniques | 2001 | 33 | 31 | 42% | 
| Synthesis of Dual Nanoparticles Embedded in Polyimide and Their Optical Properties | 2014 | 1 | 44 | 27% | 
| Role of polymer chain end groups in plasma modification for surface metallization of polymeric materials | 2009 | 1 | 20 | 50% | 
| CHARACTERIZATION OF COBALT(II) CHLORIDE-MODIFIED CONDENSATION POLYIMIDE FILMS - PROPERTIES BEFORE AND AFTER SOLVENT-EXTRACTION | 1988 | 1 | 3 | 100% | 
| DETERMINING THE STRUCTURE OF POLYIMIDE - METAL INTERFACES USING FOURIER-TRANSFORM IR AND RAMAN-SPECTROSCOPY | 1995 | 1 | 15 | 47% | 
| MATERIALS IN MICROELECTRONICS | 1993 | 0 | 6 | 50% | 
| CORROSION PROTECTION ON COPPER BY POLYVINYLIMIDAZOLE | 1986 | 0 | 5 | 40% | 
| SURFACE-ENHANCED RAMAN-SPECTROSCOPY AS A METHOD FOR DETERMINING SURFACE-STRUCTURES - ONE-DIMENSIONAL AND 2-DIMENSIONAL POLYMERIC COPPER AZOLES | 1993 | 0 | 24 | 17% | 
| Address terms | 
| Rank | Address term | Relevance score (tfidf) | Class's shr. of term's tot. occurrences | Shr. of publ. in class containing term | Num. of publ. in class | 
|---|---|---|---|---|---|
| 1 | ADV MICROSYST INTEGRAT | 1 | 100% | 0.2% | 2 | 
| 2 | PRINTING PROC BIOINSPIRED | 1 | 100% | 0.2% | 2 | 
| 3 | LEHRSTUHL MAT VERBUNDE | 1 | 12% | 0.6% | 8 | 
| 4 | NANOMECHAN SYST | 1 | 33% | 0.2% | 2 | 
| 5 | BOHR SOLID STATE PHYS | 1 | 50% | 0.1% | 1 | 
| 6 | CREAT DESIGN STUDIO TECHNOL | 1 | 50% | 0.1% | 1 | 
| 7 | EDUC ESTAB | 1 | 50% | 0.1% | 1 | 
| 8 | ELECT PACKAGING MAT TECHNOL | 1 | 50% | 0.1% | 1 | 
| 9 | OPTO ELECT S | 1 | 50% | 0.1% | 1 | 
| 10 | POLYCONDENSAT THERMOSTABLE POLYMERS | 1 | 50% | 0.1% | 1 | 
| Related classes at same level (level 1) | 
| Rank | Relatedness score | Related classes | 
|---|---|---|
| 1 | 0.0000196362 | POLYMERIC LEDS//WEBSTER TECHNOL//ELECTROLUMINESCENT COPOLYMER | 
| 2 | 0.0000136776 | FUNCT LASER TERAHERTZ TECHNOL//BEARING AREA CURVE//CRYSTALLINE PLATES | 
| 3 | 0.0000122932 | PHOTOGRAFTING//ADV PACKAGING DEV SUPPORT//PHOTOGRAFTING POLYMERIZATION | 
| 4 | 0.0000122390 | THERMAL ENGN TECHNOL//J AN MARINE SCI TECHNOL//INP WAFERS | 
| 5 | 0.0000111242 | BLISTER TEST//SHAFT LOADED BLISTER TEST//FIXED ARM PEEL | 
| 6 | 0.0000090168 | PERFLUOROSULFONATE IONOMERS//POLYACRYLAMIDE ADSORPTION//POLYACRYLIC ACID ADSORPTION | 
| 7 | 0.0000085122 | ELECTROLESS COPPER PLATING//ELECTROLESS COPPER DEPOSITION//ELECTROLESS DEPOSITION | 
| 8 | 0.0000080153 | PLATED THROUGH HOLE//ENDICOTT ELECT PACKAGING//THREE DIMENSIONAL 3 D CHIP STACKING | 
| 9 | 0.0000079246 | LEHRSTUHL MAT VERBUNDE//CHAIR MULTICOMPONENT MAT//BULK AND SURFACE DIFFUSION | 
| 10 | 0.0000072532 | POLYIMIDES//FLUORINATED POLYIMIDES//AROMATIC POLYAMIDES |