Class information for: |
Basic class information |
| ID | Publications | Average number of references |
Avg. shr. active ref. in WoS |
|---|---|---|---|
| 8520 | 1175 | 20.0 | 82% |
Classes in level above (level 2) |
Terms with highest relevance score |
| Rank | Term | Type of term | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
|---|---|---|---|---|---|---|
| 1 | P GAN | Author keyword | 23 | 41% | 4% | 44 |
| 2 | OHMIC CONTACT | Author keyword | 22 | 18% | 10% | 112 |
| 3 | OHMIC CONTACTS | Author keyword | 18 | 19% | 7% | 86 |
| 4 | AG REFLECTOR | Author keyword | 15 | 88% | 1% | 7 |
| 5 | CHIP DEV GRP | Address | 13 | 62% | 1% | 13 |
| 6 | SPECIFIC CONTACT RESISTANCE | Author keyword | 5 | 21% | 2% | 21 |
| 7 | LED BUSINESS | Address | 4 | 28% | 1% | 13 |
| 8 | FCLED | Author keyword | 4 | 75% | 0% | 3 |
| 9 | I V AND C V TECHNIQUES | Author keyword | 4 | 75% | 0% | 3 |
| 10 | P TYPE GAN | Author keyword | 3 | 26% | 1% | 10 |
Web of Science journal categories |
Author Key Words |
| Rank | Web of Science journal category | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
LCSH search | Wikipedia search |
|---|---|---|---|---|---|---|---|
| 1 | P GAN | 23 | 41% | 4% | 44 | Search P+GAN | Search P+GAN |
| 2 | OHMIC CONTACT | 22 | 18% | 10% | 112 | Search OHMIC+CONTACT | Search OHMIC+CONTACT |
| 3 | OHMIC CONTACTS | 18 | 19% | 7% | 86 | Search OHMIC+CONTACTS | Search OHMIC+CONTACTS |
| 4 | AG REFLECTOR | 15 | 88% | 1% | 7 | Search AG+REFLECTOR | Search AG+REFLECTOR |
| 5 | SPECIFIC CONTACT RESISTANCE | 5 | 21% | 2% | 21 | Search SPECIFIC+CONTACT+RESISTANCE | Search SPECIFIC+CONTACT+RESISTANCE |
| 6 | FCLED | 4 | 75% | 0% | 3 | Search FCLED | Search FCLED |
| 7 | I V AND C V TECHNIQUES | 4 | 75% | 0% | 3 | Search I+V+AND+C+V+TECHNIQUES | Search I+V+AND+C+V+TECHNIQUES |
| 8 | P TYPE GAN | 3 | 26% | 1% | 10 | Search P+TYPE+GAN | Search P+TYPE+GAN |
| 9 | TI AL NI AU | 3 | 60% | 0% | 3 | Search TI+AL+NI+AU | Search TI+AL+NI+AU |
| 10 | ELECTRICAL AND STRUCTURAL PROPERTIES | 2 | 29% | 1% | 7 | Search ELECTRICAL+AND+STRUCTURAL+PROPERTIES | Search ELECTRICAL+AND+STRUCTURAL+PROPERTIES |
Key Words Plus |
| Rank | Web of Science journal category | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
|---|---|---|---|---|---|
| 1 | LOW RESISTANCE | 93 | 47% | 13% | 147 |
| 2 | NI AU | 54 | 60% | 5% | 59 |
| 3 | TI AL | 51 | 45% | 7% | 85 |
| 4 | P TYPE GAN | 50 | 27% | 13% | 156 |
| 5 | OXIDIZED NI AU | 45 | 94% | 1% | 16 |
| 6 | TI AL CONTACTS | 38 | 84% | 2% | 21 |
| 7 | RESISTANCE OHMIC CONTACTS | 37 | 61% | 3% | 39 |
| 8 | OHMIC CONTACTS | 31 | 16% | 16% | 185 |
| 9 | N GAN | 31 | 30% | 7% | 85 |
| 10 | N TYPE GAN | 28 | 18% | 12% | 138 |
Journals |
Reviews |
| Title | Publ. year | Cit. | Active references | % act. ref. to same field |
|---|---|---|---|---|
| Ohmic-Contact Technology for GaN-Based Light-Emitting Diodes: Role of P-Type Contact | 2010 | 52 | 180 | 66% |
| A review of the metal-GaN contact technology | 1998 | 210 | 70 | 56% |
| Preparation of metallized GaN/sapphire cross sections for TEM analysis using wedge polishing | 2002 | 4 | 2 | 100% |
| Beyond CMOS: heterogeneous integration of III-V devices, RF MEMS and other dissimilar materials/devices with Si CMOS to create intelligent microsystems | 2014 | 2 | 12 | 17% |
| Advanced processing of GaN for electronic devices | 2000 | 14 | 87 | 26% |
| Ohmic contacts for compound semiconductors | 1998 | 35 | 59 | 15% |
Address terms |
| Rank | Address term | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
|---|---|---|---|---|---|
| 1 | CHIP DEV GRP | 13 | 62% | 1.1% | 13 |
| 2 | LED BUSINESS | 4 | 28% | 1.1% | 13 |
| 3 | LED TEAM | 3 | 60% | 0.3% | 3 |
| 4 | ARTIFICIAL MICROSTRUCT MESOSCOP PH | 2 | 38% | 0.4% | 5 |
| 5 | CORP ADV TECHNOL GRP | 2 | 38% | 0.4% | 5 |
| 6 | AG ELEKTR MAT | 2 | 67% | 0.2% | 2 |
| 7 | PHOTON PROJECT TEAM | 2 | 31% | 0.4% | 5 |
| 8 | OPTO SYST | 1 | 31% | 0.3% | 4 |
| 9 | LIGHT EMITTING DIODE DEV | 1 | 100% | 0.2% | 2 |
| 10 | OPT DEVICES RD | 1 | 50% | 0.2% | 2 |
Related classes at same level (level 1) |
| Rank | Relatedness score | Related classes |
|---|---|---|
| 1 | 0.0000184553 | SOCIOTECHNO SCI TECHNOL//N GAN//GALLIUM HYDROXIDE |
| 2 | 0.0000178226 | LIGHT EXTRACTION EFFICIENCY//LIGHT EMITTING DIODE LED//PATTERNED SAPPHIRE SUBSTRATE PSS |
| 3 | 0.0000162464 | P INGAN//GAN SIC HETEROJUNCTION//COMMON EMITTER |
| 4 | 0.0000157667 | GAN SURFACES//INTERDISCIPLINARY MODELLING//INTERDISCIPLINARY MAT MODELLING |
| 5 | 0.0000148209 | OBNINSK BRANCH FED STATE UNITARY ENTERPRISE//YELLOW LUMINESCENCE//MRS INTERNET JOURNAL OF NITRIDE SEMICONDUCTOR RESEARCH |
| 6 | 0.0000143768 | ALGAN GAN//HIGH ELECTRON MOBILITY TRANSISTOR HEMT//CURRENT COLLAPSE |
| 7 | 0.0000132160 | METAL SEMICONDUCTOR METAL MSM//ULTRAVIOLET UV DETECTOR//PHOTODETECTORS PDS |
| 8 | 0.0000098345 | NANOMETER SIZED SCHOTTKY CONTACT//METAL DOT ARRAY//NANO DIODE |
| 9 | 0.0000085942 | SOLID PHASE REGROWTH//PD GE//OHMIC CONTACTS |
| 10 | 0.0000077373 | SERIES RESISTANCE//BARRIER INHOMOGENEITY//IDEALITY FACTOR |