Class information for: |
Basic class information |
| ID | Publications | Average number of references |
Avg. shr. active ref. in WoS |
|---|---|---|---|
| 3544 | 966 | 19.8 | 29% |
Classes in level above (level 3) |
| ID, lev. above |
Publications | Label for level above |
|---|---|---|
| 396 | 27964 | IEEE TRANSACTIONS ON RELIABILITY//MICROELECTRONICS AND RELIABILITY//RELIABILITY ENGINEERING & SYSTEM SAFETY |
Classes in level below (level 1) |
| ID, lev. below | Publications | Label for level below |
|---|---|---|
| 22621 | 319 | ELECTROCHEMICAL MIGRATION//MECHANICAL RELIABILITY PREDICTION//CONDUCTIVE ANODIC FILAMENT |
| 23934 | 275 | PLASTIC ENCAPSULATED MICROCIRCUIT//NONHERMETIC//DORMANT STORAGE |
| 25555 | 230 | COMMERCIAL RELIABILITY PROGRAM//ELECTRONIC COMPONENT RELIABILITY//INTERNET CALIBRATION |
| 34267 | 75 | SECT PROD PROC QUAL//MATURITY INDEX ON RELIABILITY MIR//FAST FIELD FEEDBACK |
| 34596 | 67 | BAYESIAN SEQUENTIAL TEST//INGENIOUS MICROMFG SYST GRP//PROJECTION PURSUIT TYPE STATISTIC |
Terms with highest relevance score |
| Rank | Term | Type of term | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
|---|---|---|---|---|---|---|
| 1 | ELECTROCHEMICAL MIGRATION | Author keyword | 28 | 60% | 3% | 31 |
| 2 | SECT PROD PROC QUAL | Address | 17 | 79% | 1% | 11 |
| 3 | MECHANICAL RELIABILITY PREDICTION | Author keyword | 15 | 88% | 1% | 7 |
| 4 | CONDUCTIVE ANODIC FILAMENT | Author keyword | 11 | 100% | 1% | 6 |
| 5 | MATURITY INDEX ON RELIABILITY MIR | Author keyword | 9 | 83% | 1% | 5 |
| 6 | ELECTROCHEMICAL MIGRATION ECM | Author keyword | 8 | 60% | 1% | 9 |
| 7 | CS MANAGEMENT | Address | 7 | 64% | 1% | 7 |
| 8 | PLASTIC ENCAPSULATED MICROCIRCUIT | Author keyword | 7 | 67% | 1% | 6 |
| 9 | SOLDER FLUX | Author keyword | 6 | 80% | 0% | 4 |
| 10 | SURFACE INSULATION RESISTANCE SIR | Author keyword | 4 | 67% | 0% | 4 |
Web of Science journal categories |
Author Key Words |
Key Words Plus |
| Rank | Web of Science journal category | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
|---|---|---|---|---|---|
| 1 | ELECTROCHEMICAL MIGRATION | 14 | 64% | 1% | 14 |
| 2 | SILVER MIGRATION | 5 | 41% | 1% | 9 |
| 3 | ANODIC FILAMENT FORMATION | 3 | 100% | 0% | 3 |
| 4 | CONDUCTOR SYSTEMS | 3 | 100% | 0% | 3 |
| 5 | NA2SO4 SOLUTIONS | 3 | 45% | 1% | 5 |
| 6 | NEUROLOGICAL PROSTHESES | 3 | 38% | 1% | 6 |
| 7 | NONHERMETIC ALUMINUM SICS | 2 | 67% | 0% | 2 |
| 8 | SURFACE INSULATION RESISTANCE | 2 | 67% | 0% | 2 |
| 9 | FAILURE MECHANISM MODELS | 2 | 50% | 0% | 3 |
| 10 | HUMIDITY BIAS BEHAVIOR | 2 | 43% | 0% | 3 |
Journals |
Reviews |
| Title | Publ. year | Cit. | Active references |
% act. ref. to same field |
|---|---|---|---|---|
| Corrosion-induced degradation of microelectronic devices | 1996 | 21 | 4 | 100% |
| A system view of the No Fault Found (NFF) phenomenon | 2007 | 16 | 8 | 75% |
| Corrosion of silicon integrated circuits and lifetime predictions in implantable electronic devices | 2013 | 3 | 33 | 58% |
| No-fault-found and intermittent failures in electronic products | 2008 | 20 | 11 | 27% |
| TUTORIAL - ELECTROLYTIC MODELS FOR METALLIC ELECTROMIGRATION FAILURE MECHANISMS | 1995 | 11 | 12 | 83% |
| No Fault Found events in maintenance engineering Part 2: Root causes, technical developments and future research | 2014 | 1 | 39 | 33% |
| Plastic packages survive where hermetic packages fail | 1996 | 3 | 1 | 100% |
| No Fault Found events in maintenance engineering Part 1: Current trends, implications and organizational practices | 2014 | 0 | 30 | 47% |
| FAILURE PHYSICS OF INTEGRATED-CIRCUITS - A REVIEW | 1983 | 24 | 18 | 67% |
| THE CHALLENGES FOR HERMETIC ENCAPSULATION OF IMPLANTED DEVICES - A REVIEW | 1994 | 28 | 27 | 26% |
Address terms |
| Rank | Address term | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
|---|---|---|---|---|---|
| 1 | SECT PROD PROC QUAL | 17 | 79% | 1.1% | 11 |
| 2 | CS MANAGEMENT | 7 | 64% | 0.7% | 7 |
| 3 | CALCE ELECT PROD SYST | 2 | 10% | 1.6% | 15 |
| 4 | BOUWDIENST RIJKSWATERSTAAT | 1 | 100% | 0.2% | 2 |
| 5 | BRITISH HEART FDN SKELETAL MUSCLE ASSIST GRP | 1 | 50% | 0.2% | 2 |
| 6 | PROD PROC QUAL SECT | 1 | 100% | 0.2% | 2 |
| 7 | SYST PACKAGING 3D | 1 | 33% | 0.3% | 3 |
| 8 | IMPLANTED DEVICES GRP | 1 | 21% | 0.5% | 5 |
| 9 | EPRC | 1 | 25% | 0.3% | 3 |
| 10 | CALCE ELECT PACKAGING | 1 | 23% | 0.3% | 3 |
Related classes at same level (level 2) |
| Rank | Relatedness score | Related classes |
|---|---|---|
| 1 | 0.0000019834 | LEAD FREE SOLDER//SOLDERING & SURFACE MOUNT TECHNOLOGY//PB FREE SOLDER |
| 2 | 0.0000017248 | ATMOSPHERIC CORROSION//GREEN RUST//WEATHERING STEEL |
| 3 | 0.0000013804 | ULTRASONIC WELDING//WIRE BONDING//ULTRASONIC CONSOLIDATION |
| 4 | 0.0000013133 | IEEE TRANSACTIONS ON RELIABILITY//RELIABILITY ENGINEERING & SYSTEM SAFETY//MICROELECTRONICS AND RELIABILITY |
| 5 | 0.0000009911 | TINPLATE//ABHURITE//MAT PROC TERMOMECAN |
| 6 | 0.0000008988 | SYSTEMS ENGINEERING//INTEGRATION READINESS LEVEL IRL//SYSTEM READINESS LEVEL SRL |
| 7 | 0.0000008251 | NANOELECT GIGASCALE SYST//ELECTROSTATIC DISCHARGE ESD//SILICON CONTROLLED RECTIFIER SCR |
| 8 | 0.0000007508 | FUNCTIONAL ELECTRICAL STIMULATION//RETINAL PROSTHESIS//VISUAL PROSTHESIS |
| 9 | 0.0000007359 | IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY//ARC EROSION//AG SNO2 |
| 10 | 0.0000005969 | DIFFUSION BARRIER//ELECTROMIGRATION//CU METALLIZATION |