Class information for: |
Basic class information |
| ID | Publications | Average number of references |
Avg. shr. active ref. in WoS |
|---|---|---|---|
| 824 | 11237 | 24.3 | 61% |
Classes in level above (level 3) |
| ID, lev. above |
Publications | Label for level above |
|---|---|---|
| 216 | 47094 | PLASMA SOURCES SCIENCE & TECHNOLOGY//DIELECTRIC BARRIER DISCHARGE//NON THERMAL PLASMA |
Classes in level below (level 1) |
Terms with highest relevance score |
| Rank | Term | Type of term | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
|---|---|---|---|---|---|---|
| 1 | PLASMA POLYMERIZATION | Author keyword | 471 | 56% | 5% | 571 |
| 2 | PLASMA PROCESSES AND POLYMERS | Journal | 142 | 29% | 4% | 414 |
| 3 | LOW K | Author keyword | 109 | 44% | 2% | 187 |
| 4 | SIOC H FILMS | Author keyword | 94 | 97% | 0% | 28 |
| 5 | PLASMA TREATMENT | Author keyword | 70 | 21% | 3% | 298 |
| 6 | PLASMA PROC TECHNOL | Address | 61 | 82% | 0% | 36 |
| 7 | PLASMA POLYMER | Author keyword | 61 | 56% | 1% | 74 |
| 8 | HMDSO | Author keyword | 48 | 63% | 0% | 48 |
| 9 | PLASMA POLYMERISATION | Author keyword | 47 | 57% | 0% | 56 |
| 10 | PLASMA POLYMERS | Author keyword | 44 | 59% | 0% | 50 |
Web of Science journal categories |
Author Key Words |
| Rank | Web of Science journal category | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
LCSH search | Wikipedia search |
|---|---|---|---|---|---|---|---|
| 1 | PLASMA POLYMERIZATION | 471 | 56% | 5% | 571 | Search PLASMA+POLYMERIZATION | Search PLASMA+POLYMERIZATION |
| 2 | LOW K | 109 | 44% | 2% | 187 | Search LOW+K | Search LOW+K |
| 3 | SIOC H FILMS | 94 | 97% | 0% | 28 | Search SIOC+H+FILMS | Search SIOC+H+FILMS |
| 4 | PLASMA TREATMENT | 70 | 21% | 3% | 298 | Search PLASMA+TREATMENT | Search PLASMA+TREATMENT |
| 5 | PLASMA POLYMER | 61 | 56% | 1% | 74 | Search PLASMA+POLYMER | Search PLASMA+POLYMER |
| 6 | HMDSO | 48 | 63% | 0% | 48 | Search HMDSO | Search HMDSO |
| 7 | PLASMA POLYMERISATION | 47 | 57% | 0% | 56 | Search PLASMA+POLYMERISATION | Search PLASMA+POLYMERISATION |
| 8 | PLASMA POLYMERS | 44 | 59% | 0% | 50 | Search PLASMA+POLYMERS | Search PLASMA+POLYMERS |
| 9 | LOW K MATERIALS | 38 | 62% | 0% | 39 | Search LOW+K+MATERIALS | Search LOW+K+MATERIALS |
| 10 | LOW K DIELECTRICS | 37 | 46% | 1% | 59 | Search LOW+K+DIELECTRICS | Search LOW+K+DIELECTRICS |
Key Words Plus |
| Rank | Web of Science journal category | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
|---|---|---|---|---|---|
| 1 | LOW DIELECTRIC CONSTANT | 177 | 49% | 2% | 263 |
| 2 | INTERLAYER DIELECTRICS | 137 | 92% | 0% | 55 |
| 3 | LOW K | 122 | 66% | 1% | 113 |
| 4 | HEXAMETHYLDISILOXANE | 106 | 62% | 1% | 109 |
| 5 | PLASMA POLYMERIZATION | 106 | 53% | 1% | 139 |
| 6 | POLYTETRAFLUOROETHYLENE FILMS | 68 | 54% | 1% | 88 |
| 7 | ICVD | 67 | 68% | 1% | 58 |
| 8 | FLUORINATED AMORPHOUS CARBON | 65 | 76% | 0% | 45 |
| 9 | SIOF FILMS | 64 | 88% | 0% | 30 |
| 10 | METHYLSILSESQUIOXANE | 60 | 79% | 0% | 38 |
Journals |
| Rank | Web of Science journal category | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
|---|---|---|---|---|---|
| 1 | PLASMA PROCESSES AND POLYMERS | 142 | 29% | 4% | 414 |
| 2 | APPLIED POLYMER SYMPOSIA | 4 | 26% | 0% | 15 |
Reviews |
| Title | Publ. year | Cit. | Active references | % act. ref. to same field |
|---|---|---|---|---|
| Plasma methods for the generation of chemically reactive surfaces for biomolecule immobilization and cell colonization - A review | 2006 | 380 | 156 | 71% |
| Low dielectric constant materials for microelectronics | 2003 | 848 | 147 | 61% |
| Mechanisms of Plasma Polymerization - Reviewed from a Chemical Point of View | 2011 | 83 | 47 | 77% |
| Low Dielectric Constant Materials | 2010 | 186 | 384 | 54% |
| Progress in the development and understanding of advanced low k and ultralow k dielectrics for very large-scale integrated interconnects-State of the art | 2014 | 13 | 22 | 55% |
| Developments and new applications of UV-induced surface graft polymerizations | 2009 | 172 | 369 | 35% |
| Porous pSiCOH Ultralow-k Dielectrics for Chip Interconnects Prepared by PECVD | 2009 | 58 | 26 | 96% |
| Plasma Surface Modification of Biodegradable Polymers: A Review | 2011 | 83 | 143 | 37% |
| Nonthermal Plasma Technology as a Versatile Strategy for Polymeric Biomaterials Surface Modification: A Review | 2009 | 167 | 358 | 33% |
| PLASMA SURFACE MODIFICATION OF POLYMERS FOR IMPROVED ADHESION - A CRITICAL-REVIEW | 1993 | 473 | 53 | 60% |
Address terms |
| Rank | Address term | Relevance score (tfidf) |
Class's shr. of term's tot. occurrences |
Shr. of publ. in class containing term |
Num. of publ. in class |
|---|---|---|---|---|---|
| 1 | PLASMA PROC TECHNOL | 61 | 82% | 0.3% | 36 |
| 2 | SUR E SCI PLASMA TECHNOL | 36 | 49% | 0.5% | 54 |
| 3 | NANO THIN FILM MAT | 35 | 74% | 0.2% | 26 |
| 4 | RUPT | 23 | 62% | 0.2% | 24 |
| 5 | XPEQT | 21 | 90% | 0.1% | 9 |
| 6 | NANOTHIN FILM MAT | 17 | 79% | 0.1% | 11 |
| 7 | SCI ANALYT INTER IAL CHEM | 17 | 72% | 0.1% | 13 |
| 8 | LOG TECHNOL DEV | 16 | 39% | 0.3% | 33 |
| 9 | LEHRSTUHL MAT VERBUNDE | 13 | 40% | 0.2% | 26 |
| 10 | SUR E INTER E ANAL | 13 | 55% | 0.1% | 16 |
Related classes at same level (level 2) |
| Rank | Relatedness score | Related classes |
|---|---|---|
| 1 | 0.0000015834 | RADIATION GRAFTING//RADIATION INDUCED GRAFTING//RADIATION INDUCED GRAFT COPOLYMERIZATION |
| 2 | 0.0000011314 | PROTEIN ADSORPTION//PHOSPHOLIPID POLYMER//2 METHACRYLOYLOXYETHYL PHOSPHORYLCHOLINE POLYMER |
| 3 | 0.0000010744 | ELECT DEVICES MAT TECHNOL//PLASMA ETCHING//SIO2 ETCHING |
| 4 | 0.0000010090 | MODERN PLASTICS//CHLORINATED POLYOLEFIN//LATENT ACID CATALYST |
| 5 | 0.0000009444 | DIFFUSION BARRIER//ELECTROMIGRATION//CU METALLIZATION |
| 6 | 0.0000009421 | INTERFACIAL SILICON EMISSION//SILICON OXIDATION//GENIE URBAIN ENVIRONM |
| 7 | 0.0000009013 | NON THERMAL PLASMA//DIELECTRIC BARRIER DISCHARGE//PLASMA MEDICINE |
| 8 | 0.0000008478 | DIAMOND LIKE CARBON//CARBON NITRIDE//DIAMOND AND RELATED MATERIALS |
| 9 | 0.0000007589 | INVERSE GAS CHROMATOGRAPHY//INTER IAL PHENOMENA//SURFACE FREE ENERGY |
| 10 | 0.0000007492 | MATERIALS SCIENCE, TEXTILES//JOURNAL OF THE SOCIETY OF DYERS AND COLOURISTS//DYEING |