Class information for: |
Basic class information |
Hierarchy of classes |
The table includes all classes above and classes immediately below the current class. |
Cluster id | Level | Cluster label | #P |
---|---|---|---|
21 | 4 | THERMODYNAMICS//MECHANICS//ENGINEERING, MECHANICAL | 471779 |
232 | 3 | THERMODYNAMICS//INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER//NANOFLUID | 48476 |
970 | 2 | HEAT EXCHANGER//THERMODYNAMICS//HEAT TRANSFER ENHANCEMENT | 10950 |
5126 | 1 | MICROCHANNEL HEAT SINK//HEAT SINK//MICROCHANNEL | 1698 |
Terms with highest relevance score |
rank | Category | termType | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
---|---|---|---|---|---|---|
1 | MICROCHANNEL HEAT SINK | authKW | 835583 | 5% | 54% | 83 |
2 | HEAT SINK | authKW | 779763 | 9% | 27% | 158 |
3 | MICROCHANNEL | authKW | 585473 | 17% | 11% | 291 |
4 | PIN FIN | authKW | 291281 | 3% | 35% | 45 |
5 | LIQUID COOLING | authKW | 288125 | 2% | 41% | 38 |
6 | PIN FIN HEAT SINK | authKW | 231978 | 1% | 63% | 20 |
7 | PLATE FIN HEAT SINK | authKW | 184940 | 1% | 59% | 17 |
8 | ELECTRONICS COOLING | authKW | 177124 | 4% | 16% | 60 |
9 | MICRO PIN FINS | authKW | 175958 | 1% | 59% | 16 |
10 | MICROCHANNEL COOLING | authKW | 160402 | 1% | 79% | 11 |
Web of Science journal categories |
chi_square_rank | Category | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
---|---|---|---|---|---|
1 | Thermodynamics | 111553 | 65% | 1% | 1108 |
2 | Engineering, Mechanical | 58402 | 59% | 0% | 1010 |
3 | Mechanics | 35121 | 50% | 0% | 845 |
4 | Energy & Fuels | 1682 | 11% | 0% | 187 |
5 | Engineering, Electrical & Electronic | 650 | 14% | 0% | 235 |
6 | Physics, Fluids & Plasmas | 513 | 5% | 0% | 81 |
7 | Engineering, Manufacturing | 380 | 3% | 0% | 49 |
8 | Nanoscience & Nanotechnology | 346 | 6% | 0% | 100 |
9 | Instruments & Instrumentation | 272 | 5% | 0% | 82 |
10 | Materials Science, Characterization, Testing | 127 | 1% | 0% | 21 |
Address terms |
chi_square_rank | term | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
---|---|---|---|---|---|
1 | HEAT REFRIGERAT TECHNOL | 77329 | 0% | 83% | 5 |
2 | ARCHITECTURE ENVIRONM EQUIPMENT ENGN | 55678 | 0% | 100% | 3 |
3 | THERMAL MACHINES TRANSPORTAT | 53487 | 0% | 41% | 7 |
4 | THERMAL ANAL MICROFLUID FUEL CELL | 42418 | 0% | 57% | 4 |
5 | ENERGY BIOTHERMAL SYST | 41757 | 0% | 75% | 3 |
6 | MICROELECT HEAT TRANSFER | 38650 | 1% | 21% | 10 |
7 | DESIGN ASSURANCE | 37119 | 0% | 100% | 2 |
8 | EXPT COMPUTAT HEAT TRANSFER | 37119 | 0% | 100% | 2 |
9 | PROCESSOR IA64 | 37119 | 0% | 100% | 2 |
10 | REFRIGERAT AIR CONDITIONING ENGN TECH | 37119 | 0% | 100% | 2 |
Journals |
chi_square_rank | term | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
---|---|---|---|---|---|
1 | INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER | 100885 | 18% | 2% | 313 |
2 | HEAT TRANSFER ENGINEERING | 68525 | 5% | 5% | 82 |
3 | JOURNAL OF ELECTRONIC PACKAGING | 65681 | 4% | 5% | 67 |
4 | IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES | 45272 | 3% | 5% | 53 |
5 | APPLIED THERMAL ENGINEERING | 29670 | 8% | 1% | 129 |
6 | MICROSCALE THERMOPHYSICAL ENGINEERING | 20748 | 1% | 7% | 15 |
7 | INTERNATIONAL JOURNAL OF THERMAL SCIENCES | 20282 | 4% | 2% | 61 |
8 | INTERNATIONAL COMMUNICATIONS IN HEAT AND MASS TRANSFER | 20107 | 4% | 2% | 68 |
9 | HEAT AND MASS TRANSFER | 19060 | 3% | 2% | 55 |
10 | JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME | 18696 | 5% | 1% | 81 |
Author Key Words |
chi_square_rank | term | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass | LCSH search | Wikipedia search |
---|---|---|---|---|---|---|---|
1 | MICROCHANNEL HEAT SINK | 835583 | 5% | 54% | 83 | Search MICROCHANNEL+HEAT+SINK | Search MICROCHANNEL+HEAT+SINK |
2 | HEAT SINK | 779763 | 9% | 27% | 158 | Search HEAT+SINK | Search HEAT+SINK |
3 | MICROCHANNEL | 585473 | 17% | 11% | 291 | Search MICROCHANNEL | Search MICROCHANNEL |
4 | PIN FIN | 291281 | 3% | 35% | 45 | Search PIN+FIN | Search PIN+FIN |
5 | LIQUID COOLING | 288125 | 2% | 41% | 38 | Search LIQUID+COOLING | Search LIQUID+COOLING |
6 | PIN FIN HEAT SINK | 231978 | 1% | 63% | 20 | Search PIN+FIN+HEAT+SINK | Search PIN+FIN+HEAT+SINK |
7 | PLATE FIN HEAT SINK | 184940 | 1% | 59% | 17 | Search PLATE+FIN+HEAT+SINK | Search PLATE+FIN+HEAT+SINK |
8 | ELECTRONICS COOLING | 177124 | 4% | 16% | 60 | Search ELECTRONICS+COOLING | Search ELECTRONICS+COOLING |
9 | MICRO PIN FINS | 175958 | 1% | 59% | 16 | Search MICRO+PIN+FINS | Search MICRO+PIN+FINS |
10 | MICROCHANNEL COOLING | 160402 | 1% | 79% | 11 | Search MICROCHANNEL+COOLING | Search MICROCHANNEL+COOLING |
Core articles |
The table includes core articles in the class. The following variables is taken into account for the relevance score of an article in a cluster c: (1) Number of references referring to publications in the class. (2) Share of total number of active references referring to publications in the class. (3) Age of the article. New articles get higher score than old articles. (4) Citation rate, normalized to year. |
Classes with closest relation at Level 1 |