Recent publications

Below is a list of the 50 most recent publications from the Division of Electronics.

[1]
Y. Li, L. Feng and Y. Wang, "A cascade control approach to active suspension using pneumatic actuators," Asian journal of control, pp. 1-19, 2019.
[2]
M. W. Hussain et al., "A SiC BJT-Based Negative Resistance Oscillator for High-Temperature Applications," IEEE Journal of the Electron Devices Society, vol. 7, no. 1, pp. 191-195, 2019.
[4]
J. Wang et al., "Efficient Design-for-Test Approach for Networks-on-Chip," I.E.E.E. transactions on computers (Print), vol. 68, no. 2, pp. 198-213, 2019.
[5]
X. Chen, "Efficient Memory Access and Synchronization in NoC-based Many-core Processors," Doctoral thesis Stockholm, Sweden : KTH Royal Institute of Technology, TRITA-EECS-AVL, 2019:2, 2019.
[6]
N. Ivanisevic, S. Rodriguez and A. Rusu, "Impedance Spectroscopy Based on Linear System Identification," IEEE Transactions on Biomedical Circuits and Systems, vol. 13, no. 2, pp. 396-402, 2019.
[7]
Y. Zhou et al., "SCORE : A Novel Scheme to Efficiently Cache Overlong ECCs in NAND Flash Memory," ACM Transactions on Architecture and Code Optimization (TACO), vol. 15, no. 4, 2019.
[8]
B. Negash, T. Westerlund and H. Tenhunen, "Towards an interoperable Internet of Things through a web of virtual things at the Fog layer," Future generations computer systems, vol. 91, pp. 96-107, 2019.
[9]
S. Kargarrazi et al., "500 degrees C SiC PWM Integrated Circuit," IEEE transactions on power electronics, vol. 34, no. 3, pp. 1997-2001, 2019.
[12]
B. G. Malm, "Fact or Fiction? – Citation Categories and their Use Cases in Thesis Bibliographies at KTH," in This work was presented at KTH Scholarship of teaching and learning (SoTL) March 29, 2019, 2019.
[13]
P. Chaourani et al., "Inductors in a Monolithic 3-D Process : Performance Analysis and Design Guidelines," IEEE Transactions on Very Large Scale Integration (vlsi) Systems, vol. 27, no. 2, pp. 468-480, 2019.
[14]
S. Hou et al., "High Temperature High Current Gain IC Compatible 4H-SiC Phototransistor," in European Conference on Silicon Carbide and Related Materials (ECSCRM 2018), 2019.
[15]
S. Hou et al., "Process Control and Optimization of 4H-SiC Semiconductor Devices and Circuits," in Proceedings of the 3rd Electron Devices Technology and Manufacturing, (EDTM) Conference 2019, 2019.
[16]
S. Hou, "Silicon Carbide High Temperature Photodetectors and Image Sensor," Doctoral thesis : KTH Royal Institute of Technology, TRITA-EECS-AVL, 2019:37, 2019.
[17]
N. Ivanisevic, "Circuit Design Techniques for Implantable Closed-Loop Neural Interfaces," Doctoral thesis Stockholm : KTH Royal Institute of Technology, TRITA-EECS-AVL, 2019:33, 2019.
[18]
W. Zhang, Q. Cao and Z. Lu, "Bit-Flipping Schemes Upon MLC Flash : Investigation, Implementation, and Evaluation," IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, vol. 38, no. 4, pp. 780-784, 2019.
[19]
M. Shakir et al., "Towards Silicon Carbide VLSI Circuits for Extreme Environment Applications," Electronics, vol. 8, no. 5, 2019.
[20]
M. Ekström, B. G. Malm and C.-M. Zetterling, "High-Temperature Recessed Channel SiC CMOS Inverters and Ring Oscillators," IEEE Electron Device Letters, vol. 40, no. 5, pp. 670-673, 2019.
[21]
M. Ekström, A. Ferrario and C.-M. Zetterling, "Investigation of a Self-Aligned Cobalt Silicide Process for Ohmic Contacts to Silicon Carbide," Journal of Electronic Materials, vol. 48, no. 4, pp. 2509-2516, 2019.
[22]
M. Ekström, "SiC CMOS and memory devices for high-temperature integrated circuits," Doctoral thesis Stockholm : KTH Royal Institute of Technology, TRITA-EECS-AVL, 2019:42, 2019.
[24]
G. Shabbir et al., "Buffer-Aided Successive Relay Selection Scheme for Energy Harvesting IoT Networks," IEEE Access, vol. 7, pp. 36246-36258, 2019.
[25]
R. Ma et al., "RBER-Aware Lifetime Prediction Scheme for 3D-TLC NAND Flash Memory," IEEE Access, vol. 7, pp. 44696-44708, 2019.
[26]
M. Shakir, "Process Design Kit and High-Temperature Digital ASICs in Silicon Carbide," Doctoral thesis Stockholm : KTH Royal Institute of Technology, TRITA-EECS-AVL, 2019:53, 2019.
[27]
M. Shakir, "555-Timer IC Operational at 500 °C," Bipolar SiC 555-timer IC, High Temperature ICs, TTL Comparator, SiC Integrated Circuits, 2019.
[28]
M. Shakir, S. Hou and C.-M. Zetterling, "A Monolithic 500 °C D-flip flop Realized in Bipolar 4H-SiC TTL technology," in Materials Science Forum, Proceedings of European Conference on Silicon Carbide and Related Materials 2018, 2019.
[29]
W. Zhou et al., "On-Chip Photonic Crystal Surface-Emitting Membrane Lasers," IEEE Journal of Selected Topics in Quantum Electronics, vol. 25, no. 3, 2019.
[30]
P. Chaourani, "Sequential 3D Integration - Design Methodologies and Circuit Techniques," Doctoral thesis Stockholm : KTH Royal Institute of Technology, TRITA-EECS-AVL, 2019:54, 2019.
[32]
S. A. Ahmad et al., "Penta-band antenna with defected ground structure for wireless communication applications," in 2019 2nd International Conference on Computing, Mathematics and Engineering Technologies, iCoMET 2019, 2019.
[33]
A. M. Grishin and S. Khartsev, "Waveguiding in All-Garnet Heteroepitaxial Magneto-Optical Photonic Crystals," JETP Letters : Journal of Experimental And Theoretical Physics Letters, vol. 109, no. 2, pp. 83-86, 2019.
[34]
A. Kelati, "IoT based Appliances Identification Techniques with Fog Computing for e-Health," in IST-Africa 2019 Conference Proceedings, 2019.
[35]
S. Gyger et al., "Reconfigurable frequency coding of triggered single photons in the telecom C-band," Optics Express, vol. 27, no. 10, pp. 14400-14406, 2019.
[37]
M. Fakih et al., "Experimental evaluation of SAFEPOWER architecture for safe and power-efficient mixed-criticality systems," Journal of Low Power Electronics and Applications, vol. 9, no. 1, 2019.
[38]
S. Jiang et al., "Testing aware dynamic mapping for path-centric network-on-chip test," Integration, vol. 67, pp. 134-143, 2019.
[39]
K. Tian et al., "An Improved 4H-SiC Trench-Gate MOSFET With Low ON-Resistance and Switching Loss," IEEE Transactions on Electron Devices, vol. 66, no. 5, pp. 2307-2313, 2019.
[40]
F. Marranghello et al., "Four-level forms for memristive material implication logic," IEEE Transactions on Very Large Scale Integration (vlsi) Systems, vol. 27, no. 5, pp. 1228-1232, 2019.
[41]
G. Jayakumar, P.-E. Hellström and M. Östling, "Utilizing the superior etch stop quality of HfO 2 in the front end of line wafer scale integration of silicon nanowire biosensors," Microelectronic Engineering, vol. 212, pp. 13-20, 2019.
[42]
A. Kelati et al., "IoT based Appliances Identification Techniques with FogComputing for e-Health," in 2019 IST-Africa Week Conference (IST-Africa, 2019.
[43]
K. (. Chen et al., "NoC-based DNN Accelerator: A Future Design Paradigm," in International Symposium on Networks-on-Chip (NOCS'19), 2019.
[45]
A. Javed et al., "Miniaturized cross-lines rectangular ring-shaped flexible multiband antenna," Applied Computational Electromagnetics Society Journal, vol. 34, no. 5, pp. 625-630, 2019.
[46]
K. Tian et al., "An Improved 4H-SiC Trench-Gate MOSFET With Low ON-Resistance and Switching Loss," IEEE Transactions on Electron Devices, vol. 66, no. 5, pp. 2307-2313, 2019.
[48]
S. I. Naqvi et al., "A planar flexible quad-band antenna for WLAN/WiMAX/LTE applications," in 2019 2nd International Conference on Computing, Mathematics and Engineering Technologies, iCoMET 2019, 2019.
[49]
S. Sollami Delekta, "Inkjet Printing of Graphene-based Microsupercapacitors for Miniaturized Energy Storage Applications," Doctoral thesis : KTH Royal Institute of Technology, TRITA-EECS-AVL, 2019:61, 2019.
[50]
A. Saeed et al., "Robustness-Driven Hybrid Descriptor for Noise-Deterrent Texture Classification," IEEE Access, vol. 7, pp. 110116-110127, 2019.
Full list in the KTH publications portal