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Direct Laser Writer MLA150

MLA150
Published Apr 12, 2021

During spring 2021 a Direct Laser Writer MLA150 from Heidelberg Instruments will be installed.

The MLA 150 (MaskLess Aligner) Direct Laser Writer is capable of photolithography of details down to 0.6 um (min. feature size). It uses a UV diode laser illumination of 375 nm for broadband and i-line photoresists, such as SU-8, AZ-nLOF, TOK IP and others. The option of Back Side Alignment (BSA) is included, thus adding the possibility of exposing backside of substrate. Maximum substrate size is 6 x 6 inches, minimum size is 5 x 5 mm (due to auto focus mechanism). Maximum write area is 150 x 150 mm, and substrate thickness can be between 0.1 to 12 mm.

MLA 150 functional principe.
Page responsible:Anders Liljeborg
Belongs to: Albanova Nanolab
Last changed: Apr 12, 2021