Uncooled Infrared Bolometer Arrays

KTH-MST develops low-cost, uncooled infrared bolometer arrays for automotive and security applications using foundry-compatible 3D IC integrated MEMS technology in the framework of EU and nationally funded projects.

Within the framework of two EU funded FP7 projects, low-cost uncooled infrared imaging arrays for use in high-volume automotive applications are developed. 3D heterogeneous integration is used for the bolometer fabrication, allowing high-performance crystalline sensing materials to be integrated on top of CMOS based read-out electronic circuit (ROIC) wafers. The use of epitaxially grown, mono-crystalline Si/SiGe (quantum wells) with a high temperature coefficient of resistance (TCR) and low 1/f noise has the potential to increase the infrared bolometer performance (reduce the NETD). This increase in performance can be used to reduce the requirements on the vacuum levels in the infrared bolometer package, and thus, reduce the overall system costs. The 3D bolometer integration process uses only standard semiconductor materials and can be done in existing MEMS foundries. The Figures show bolometer structures that are manufactured using the 3D-MEMS integration platform from Faun AB and KTH-MST.

Bolometer structures manufactured using the 3D-MEMS integration platform from Faun AB and KTH-MST

Project members:

Frank Niklaus (contact person)

Fredrik Forsberg

Andreas Fischer

Niclas Roxhed

Göran Stemme

Project partners:

  • Infineon
  • Autoliv
  • Daimler
  • Acreo
  • Umicore

Project sponsors:

  • EU-FP7
  • Vinnova
  • IVSS
  • EUREKA-Eurimus

Publications related to this project

Publication list

Projects in MEMS 3D Integration

Title Date
MEMS 3D Integration – INTRODUCTION 1494852780000 May 15, 2017
3D Printing of Silicon Micro- and Nanostructures 1446544478233 Nov 03, 2015
IC Integrated Mono-Crystalline Silicon Micro-Mirror Arrays 1385456416292 Nov 26, 2013
IC-Compatible Wafer-Level Packaging 1385456437514 Nov 26, 2013
Uncooled Infrared Bolometer Arrays 1385460020107 Nov 26, 2013
Q2M - Wafer-scale heterogeneous integration of high quality materials to microsystems 1385456434555 Nov 26, 2013
Shape Memory Alloy microactuators 1416925572570 Nov 25, 2014
Through-Silicon Vias (TSVs) with Wire-Bonded Metal Cores 1385456439775 Nov 26, 2013
High-aspect ratio Through Silicon Vias fabricated by magnetic self-assembly 1385456449775 Nov 26, 2013
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