Class information for: |
Basic class information |
Hierarchy of classes |
The table includes all classes above and classes immediately below the current class. |
Terms with highest relevance score |
rank | Category | termType | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
---|---|---|---|---|---|---|
1 | LOSSY SILICON SUBSTRATE | authKW | 505075 | 2% | 100% | 5 |
2 | HNA ETCHING | authKW | 323246 | 1% | 80% | 4 |
3 | DISTRIBUTED INDUCTANCE AND RESISTANCE | authKW | 303045 | 1% | 100% | 3 |
4 | FIELD CARRIER INTERACTIONS | authKW | 303045 | 1% | 100% | 3 |
5 | ON CHIP INTERCONNECTS | authKW | 299480 | 4% | 23% | 13 |
6 | COMPLEX DIELECTRIC IMAGE METHOD | authKW | 202030 | 1% | 100% | 2 |
7 | DEVICE LEVEL SIMULATION | authKW | 202030 | 1% | 100% | 2 |
8 | ESATTELEMIC | address | 202030 | 1% | 100% | 2 |
9 | SILICON SEMICONDUCTING SUBSTRATE | authKW | 202030 | 1% | 100% | 2 |
10 | GAS ISOLATED INTERCONNECT | authKW | 134685 | 1% | 67% | 2 |
Web of Science journal categories |
chi_square_rank | Category | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
---|---|---|---|---|---|
1 | Engineering, Electrical & Electronic | 6763 | 84% | 0% | 263 |
2 | Computer Science, Hardware & Architecture | 232 | 5% | 0% | 16 |
3 | Telecommunications | 181 | 7% | 0% | 22 |
4 | Physics, Applied | 129 | 16% | 0% | 49 |
5 | Optics | 105 | 9% | 0% | 28 |
6 | Computer Science, Interdisciplinary Applications | 53 | 4% | 0% | 13 |
7 | Materials Science, Multidisciplinary | 13 | 8% | 0% | 26 |
8 | Nanoscience & Nanotechnology | 12 | 3% | 0% | 10 |
9 | Mathematics, Interdisciplinary Applications | 8 | 2% | 0% | 5 |
10 | Physics, Multidisciplinary | 6 | 4% | 0% | 12 |
Address terms |
chi_square_rank | term | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
---|---|---|---|---|---|
1 | ESATTELEMIC | 202030 | 1% | 100% | 2 |
2 | ESAT TELEMIC | 117128 | 4% | 8% | 14 |
3 | ADV DEVICE PHYS | 101015 | 0% | 100% | 1 |
4 | CEAINACCNRSUMR 8191 | 101015 | 0% | 100% | 1 |
5 | IMM LAMEL | 101015 | 0% | 100% | 1 |
6 | INPGUJFUSUMR 5130 | 101015 | 0% | 100% | 1 |
7 | LIGHT ELECT MICROWAVES COMMUN | 101015 | 0% | 100% | 1 |
8 | MICROWAVE RF TECHNOLOGIES | 101015 | 0% | 100% | 1 |
9 | STUDIES DESIGNS | 101015 | 0% | 100% | 1 |
10 | ESAT TELEM | 82644 | 1% | 27% | 3 |
Journals |
chi_square_rank | term | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
---|---|---|---|---|---|
1 | IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES | 42810 | 24% | 1% | 74 |
2 | IEEE TRANSACTIONS ON ADVANCED PACKAGING | 4877 | 2% | 1% | 7 |
3 | ELECTRONICS LETTERS | 4465 | 13% | 0% | 42 |
4 | INTERNATIONAL JOURNAL OF ELECTRONICS | 4007 | 4% | 0% | 14 |
5 | MICROWAVE AND OPTICAL TECHNOLOGY LETTERS | 2910 | 7% | 0% | 21 |
6 | INTERNATIONAL JOURNAL OF NUMERICAL MODELLING-ELECTRONIC NETWORKS DEVICES AND FIELDS | 2559 | 2% | 1% | 5 |
7 | MICROELECTRONICS INTERNATIONAL | 2555 | 1% | 1% | 3 |
8 | AEU-ARCHIV FUR ELEKTRONIK UND UBERTRAGUNGSTECHNIK-INTERNATIONAL JOURNAL OF ELECTRONICS AND COMMUNICATIONS | 2512 | 1% | 1% | 3 |
9 | IEE PROCEEDINGS-MICROWAVES ANTENNAS AND PROPAGATION | 2271 | 2% | 0% | 5 |
10 | INFORMACIJE MIDEM-JOURNAL OF MICROELECTRONICS ELECTRONIC COMPONENTS AND MATERIALS | 1530 | 1% | 1% | 3 |
Author Key Words |
Core articles |
The table includes core articles in the class. The following variables is taken into account for the relevance score of an article in a cluster c: (1) Number of references referring to publications in the class. (2) Share of total number of active references referring to publications in the class. (3) Age of the article. New articles get higher score than old articles. (4) Citation rate, normalized to year. |
Classes with closest relation at Level 1 |