Class information for: |
Basic class information |
Hierarchy of classes |
The table includes all classes above and classes immediately below the current class. |
Cluster id | Level | Cluster label | #P |
---|---|---|---|
8 | 4 | POLYMER SCIENCE//CHEMISTRY, PHYSICAL//MATERIALS SCIENCE, MULTIDISCIPLINARY | 1554940 |
646 | 3 | ADDITIVE MANUFACTURING//RAPID PROTOTYPING JOURNAL//SELECTIVE LASER MELTING | 11258 |
932 | 2 | ADDITIVE MANUFACTURING//RAPID PROTOTYPING JOURNAL//SELECTIVE LASER MELTING | 11258 |
36402 | 1 | TIME PRESSURE DISPENSING//JETTING DISPENSER//PIEZOSTACK ACTUATOR | 99 |
Terms with highest relevance score |
rank | Category | termType | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
---|---|---|---|---|---|---|
1 | TIME PRESSURE DISPENSING | authKW | 2865189 | 9% | 100% | 9 |
2 | JETTING DISPENSER | authKW | 2263851 | 8% | 89% | 8 |
3 | PIEZOSTACK ACTUATOR | authKW | 1611661 | 9% | 56% | 9 |
4 | FLUID DISPENSING | authKW | 1418119 | 7% | 64% | 7 |
5 | DISPENSING PROCESS | authKW | 716296 | 3% | 75% | 3 |
6 | ADHESIVE DISPENSING | authKW | 636709 | 2% | 100% | 2 |
7 | EJECTION BEHAVIOR | authKW | 424471 | 2% | 67% | 2 |
8 | 58BI 42SN SOLDER ALLOY | authKW | 318354 | 1% | 100% | 1 |
9 | ADHESIVE DOT | authKW | 318354 | 1% | 100% | 1 |
10 | ADHESIVE JETTING DISPENSING | authKW | 318354 | 1% | 100% | 1 |
Web of Science journal categories |
chi_square_rank | Category | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
---|---|---|---|---|---|
1 | Engineering, Manufacturing | 3837 | 34% | 0% | 34 |
2 | Automation & Control Systems | 574 | 16% | 0% | 16 |
3 | Engineering, Mechanical | 200 | 15% | 0% | 15 |
4 | Materials Science, Multidisciplinary | 150 | 29% | 0% | 29 |
5 | Engineering, Electrical & Electronic | 146 | 24% | 0% | 24 |
6 | Instruments & Instrumentation | 131 | 12% | 0% | 12 |
7 | Computer Science, Cybernetics | 97 | 3% | 0% | 3 |
8 | Mechanics | 86 | 11% | 0% | 11 |
9 | Computer Science, Artificial Intelligence | 61 | 7% | 0% | 7 |
10 | Engineering, Chemical | 44 | 10% | 0% | 10 |
Address terms |
chi_square_rank | term | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
---|---|---|---|---|---|
1 | DIGITAL ESCOSYST BUSINESS INTELLIGENCE | 159176 | 1% | 50% | 1 |
2 | MFG ENG ENG MANAGEMENT | 159176 | 1% | 50% | 1 |
3 | SMART STRUCT SYST | 93752 | 9% | 3% | 9 |
4 | MECH EQUIPMENT MFG CONTROL TECHNOL | 63667 | 2% | 10% | 2 |
5 | CHONGQING MUNICIPAL | 53057 | 1% | 17% | 1 |
6 | FLUID MACHINERY FLUID ENGN | 45477 | 1% | 14% | 1 |
7 | MECH ENGN ENGN MANAGEMENT | 31834 | 1% | 10% | 1 |
8 | STATE HIGH PERFORMANCE COMPLEX MFG | 31564 | 7% | 1% | 7 |
9 | EXTREME MECH ENGN | 28939 | 1% | 9% | 1 |
10 | MAT SCI ENGN CHEM ENGN | 17682 | 2% | 3% | 2 |
Journals |
chi_square_rank | term | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
---|---|---|---|---|---|
1 | IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING | 51436 | 8% | 2% | 8 |
2 | IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY | 5556 | 5% | 0% | 5 |
3 | JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY | 3293 | 6% | 0% | 6 |
4 | SMART MATERIALS AND STRUCTURES | 2942 | 7% | 0% | 7 |
5 | JOURNAL OF ELECTRONIC PACKAGING | 2257 | 3% | 0% | 3 |
6 | INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY | 2078 | 9% | 0% | 9 |
7 | IEEE-ASME TRANSACTIONS ON MECHATRONICS | 1243 | 3% | 0% | 3 |
8 | IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY | 982 | 2% | 0% | 2 |
9 | RESEARCH IN ENGINEERING DESIGN | 969 | 1% | 0% | 1 |
10 | MICROELECTRONICS INTERNATIONAL | 895 | 1% | 0% | 1 |
Author Key Words |
Core articles |
The table includes core articles in the class. The following variables is taken into account for the relevance score of an article in a cluster c: (1) Number of references referring to publications in the class. (2) Share of total number of active references referring to publications in the class. (3) Age of the article. New articles get higher score than old articles. (4) Citation rate, normalized to year. |
Classes with closest relation at Level 1 |