Class information for: |
Basic class information |
Hierarchy of classes |
The table includes all classes above and classes immediately below the current class. |
| Cluster id | Level | Cluster label | #P |
|---|---|---|---|
| 1 | 4 | PHYSICS, CONDENSED MATTER//PHYSICS, APPLIED//MATERIALS SCIENCE, MULTIDISCIPLINARY | 2188495 |
| 396 | 3 | LEAD FREE SOLDER//SOLDER//ELECTROMIGRATION | 32184 |
| 535 | 2 | LEAD FREE SOLDER//SOLDER//SOLDERING & SURFACE MOUNT TECHNOLOGY | 15297 |
| 23683 | 1 | SOLDER PASTE//VAPOUR PHASE SOLDERING//STENCIL PRINTING | 361 |
Terms with highest relevance score |
| rank | Category | termType | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
|---|---|---|---|---|---|---|
| 1 | SOLDER PASTE | authKW | 1862437 | 11% | 53% | 40 |
| 2 | VAPOUR PHASE SOLDERING | authKW | 1069464 | 4% | 88% | 14 |
| 3 | STENCIL PRINTING | authKW | 1040545 | 6% | 57% | 21 |
| 4 | SOLDERING & SURFACE MOUNT TECHNOLOGY | journal | 953429 | 19% | 16% | 67 |
| 5 | ELECT MFG ENGN GRP | address | 883932 | 5% | 56% | 18 |
| 6 | SURFACE MOUNT TECHNOLOGY | authKW | 679793 | 8% | 27% | 29 |
| 7 | REFLOW SOLDERING | authKW | 533680 | 5% | 34% | 18 |
| 8 | CONVECTION REFLOW OVEN | authKW | 436517 | 1% | 100% | 5 |
| 9 | PCBA REWORK | authKW | 436517 | 1% | 100% | 5 |
| 10 | AUTOMATED PCBA REWORK | authKW | 349214 | 1% | 100% | 4 |
Web of Science journal categories |
| chi_square_rank | Category | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
|---|---|---|---|---|---|
| 1 | Engineering, Manufacturing | 17114 | 38% | 0% | 137 |
| 2 | Engineering, Electrical & Electronic | 2417 | 48% | 0% | 174 |
| 3 | Materials Science, Multidisciplinary | 1263 | 42% | 0% | 153 |
| 4 | Metallurgy & Metallurgical Engineering | 1250 | 20% | 0% | 73 |
| 5 | Engineering, Mechanical | 525 | 13% | 0% | 47 |
| 6 | Engineering, Industrial | 413 | 6% | 0% | 22 |
| 7 | Thermodynamics | 153 | 6% | 0% | 21 |
| 8 | Mechanics | 150 | 8% | 0% | 29 |
| 9 | Operations Research & Management Science | 145 | 5% | 0% | 18 |
| 10 | Computer Science, Interdisciplinary Applications | 134 | 6% | 0% | 21 |
Address terms |
| chi_square_rank | term | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
|---|---|---|---|---|---|
| 1 | ELECT MFG ENGN GRP | 883932 | 5% | 56% | 18 |
| 2 | AERONAUT MECH MFG ENGN | 241757 | 2% | 46% | 6 |
| 3 | BOARD ASSEMBLY | 116403 | 1% | 67% | 2 |
| 4 | WINFUL | 116403 | 1% | 67% | 2 |
| 5 | ADV DESIGN MFG GRP | 87303 | 0% | 100% | 1 |
| 6 | ALPHA SERV PROD DEV GRP | 87303 | 0% | 100% | 1 |
| 7 | ALPHA SERVER PROD DEV GRP | 87303 | 0% | 100% | 1 |
| 8 | CERAM MFG | 87303 | 0% | 100% | 1 |
| 9 | DOMAINE LORGERIE | 87303 | 0% | 100% | 1 |
| 10 | EC COMPONENTS RD | 87303 | 0% | 100% | 1 |
Journals |
| chi_square_rank | term | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
|---|---|---|---|---|---|
| 1 | SOLDERING & SURFACE MOUNT TECHNOLOGY | 953429 | 19% | 16% | 67 |
| 2 | JOURNAL OF ELECTRONICS MANUFACTURING | 57798 | 3% | 7% | 10 |
| 3 | IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING | 31723 | 3% | 3% | 12 |
| 4 | CIRCUIT WORLD | 25615 | 2% | 4% | 8 |
| 5 | JOURNAL OF ELECTRONIC PACKAGING | 9906 | 3% | 1% | 12 |
| 6 | EE-EVALUATION ENGINEERING | 8629 | 1% | 3% | 3 |
| 7 | IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY | 6743 | 3% | 1% | 10 |
| 8 | MICROELECTRONICS INTERNATIONAL | 6138 | 1% | 1% | 5 |
| 9 | IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY | 2978 | 2% | 0% | 7 |
| 10 | MICROELECTRONICS RELIABILITY | 2303 | 4% | 0% | 14 |
Author Key Words |
| chi_square_rank | term | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass | LCSH search | Wikipedia search |
|---|---|---|---|---|---|---|---|
| 1 | SOLDER PASTE | 1862437 | 11% | 53% | 40 | Search SOLDER+PASTE | Search SOLDER+PASTE |
| 2 | VAPOUR PHASE SOLDERING | 1069464 | 4% | 88% | 14 | Search VAPOUR+PHASE+SOLDERING | Search VAPOUR+PHASE+SOLDERING |
| 3 | STENCIL PRINTING | 1040545 | 6% | 57% | 21 | Search STENCIL+PRINTING | Search STENCIL+PRINTING |
| 4 | SURFACE MOUNT TECHNOLOGY | 679793 | 8% | 27% | 29 | Search SURFACE+MOUNT+TECHNOLOGY | Search SURFACE+MOUNT+TECHNOLOGY |
| 5 | REFLOW SOLDERING | 533680 | 5% | 34% | 18 | Search REFLOW+SOLDERING | Search REFLOW+SOLDERING |
| 6 | CONVECTION REFLOW OVEN | 436517 | 1% | 100% | 5 | Search CONVECTION+REFLOW+OVEN | Search CONVECTION+REFLOW+OVEN |
| 7 | PCBA REWORK | 436517 | 1% | 100% | 5 | Search PCBA+REWORK | Search PCBA+REWORK |
| 8 | AUTOMATED PCBA REWORK | 349214 | 1% | 100% | 4 | Search AUTOMATED+PCBA+REWORK | Search AUTOMATED+PCBA+REWORK |
| 9 | CARBON GRAPHITE PASTE | 261910 | 1% | 100% | 3 | Search CARBON+GRAPHITE+PASTE | Search CARBON+GRAPHITE+PASTE |
| 10 | SURFACE MOUNT REWORK | 261910 | 1% | 100% | 3 | Search SURFACE+MOUNT+REWORK | Search SURFACE+MOUNT+REWORK |
Core articles |
The table includes core articles in the class. The following variables is taken into account for the relevance score of an article in a cluster c: (1) Number of references referring to publications in the class. (2) Share of total number of active references referring to publications in the class. (3) Age of the article. New articles get higher score than old articles. (4) Citation rate, normalized to year. |
Classes with closest relation at Level 1 |