Class information for: |
Basic class information |
Hierarchy of classes |
The table includes all classes above and classes immediately below the current class. |
| Cluster id | Level | Cluster label | #P |
|---|---|---|---|
| 1 | 4 | PHYSICS, CONDENSED MATTER//PHYSICS, APPLIED//MATERIALS SCIENCE, MULTIDISCIPLINARY | 2188495 |
| 396 | 3 | LEAD FREE SOLDER//SOLDER//ELECTROMIGRATION | 32184 |
| 535 | 2 | LEAD FREE SOLDER//SOLDER//SOLDERING & SURFACE MOUNT TECHNOLOGY | 15297 |
| 29547 | 1 | KKU SEAGATE COOPERAT//LASER SOLDERING//INNER LEAD BONDING ILB | 202 |
Terms with highest relevance score |
| rank | Category | termType | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
|---|---|---|---|---|---|---|
| 1 | KKU SEAGATE COOPERAT | address | 898986 | 5% | 52% | 11 |
| 2 | LASER SOLDERING | authKW | 572074 | 5% | 33% | 11 |
| 3 | INNER LEAD BONDING ILB | authKW | 499276 | 2% | 80% | 4 |
| 4 | MECH INTELLIGENT SYST ENG | address | 312048 | 1% | 100% | 2 |
| 5 | OME WORKS | address | 312048 | 1% | 100% | 2 |
| 6 | READ WRITE ELECTRONICS | authKW | 312048 | 1% | 100% | 2 |
| 7 | THERMAL PERFORMANCE DESIGN | authKW | 312048 | 1% | 100% | 2 |
| 8 | INNER LEAD BONDING | authKW | 280841 | 1% | 60% | 3 |
| 9 | 2 D MAGNETIC RECORDING 2 DMR | authKW | 156024 | 0% | 100% | 1 |
| 10 | 6 LINE SUSPENSION ASSEMBLY INTERCONNECT TRACE | authKW | 156024 | 0% | 100% | 1 |
Web of Science journal categories |
| chi_square_rank | Category | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
|---|---|---|---|---|---|
| 1 | Engineering, Manufacturing | 3878 | 24% | 0% | 49 |
| 2 | Engineering, Electrical & Electronic | 2033 | 58% | 0% | 118 |
| 3 | Materials Science, Multidisciplinary | 407 | 33% | 0% | 67 |
| 4 | Physics, Applied | 279 | 26% | 0% | 52 |
| 5 | Engineering, Mechanical | 84 | 7% | 0% | 15 |
| 6 | Materials Science, Characterization, Testing | 43 | 2% | 0% | 4 |
| 7 | Nanoscience & Nanotechnology | 42 | 6% | 0% | 12 |
| 8 | Metallurgy & Metallurgical Engineering | 29 | 5% | 0% | 10 |
| 9 | Instruments & Instrumentation | 26 | 4% | 0% | 9 |
| 10 | Computer Science, Interdisciplinary Applications | 22 | 3% | 0% | 7 |
Address terms |
| chi_square_rank | term | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
|---|---|---|---|---|---|
| 1 | KKU SEAGATE COOPERAT | 898986 | 5% | 52% | 11 |
| 2 | MECH INTELLIGENT SYST ENG | 312048 | 1% | 100% | 2 |
| 3 | OME WORKS | 312048 | 1% | 100% | 2 |
| 4 | ELECT CHARACTERIZAT ENGN | 156024 | 0% | 100% | 1 |
| 5 | EMI RD | 156024 | 0% | 100% | 1 |
| 6 | HDD COMPONENT | 156024 | 0% | 100% | 1 |
| 7 | IND UNIV COOP | 156024 | 0% | 100% | 1 |
| 8 | INTERCONNECT PROD TECHNOL GRP | 156024 | 0% | 100% | 1 |
| 9 | LCDD PROJECT ENGN | 156024 | 0% | 100% | 1 |
| 10 | MAT PHYS S | 156024 | 0% | 100% | 1 |
Journals |
| chi_square_rank | term | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
|---|---|---|---|---|---|
| 1 | IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY | 101583 | 14% | 2% | 29 |
| 2 | IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING | 19948 | 3% | 2% | 7 |
| 3 | SOLDERING & SURFACE MOUNT TECHNOLOGY | 6066 | 2% | 1% | 4 |
| 4 | PROCEEDINGS OF THE INSTITUTION OF MECHANICAL ENGINEERS | 5378 | 0% | 3% | 1 |
| 5 | JOURNAL OF THE ENGINEERING MECHANICS DIVISION-ASCE | 2846 | 1% | 1% | 2 |
| 6 | IEEE TRANSACTIONS ON MAGNETICS | 2198 | 11% | 0% | 22 |
| 7 | IEEE MAGNETICS LETTERS | 1996 | 1% | 1% | 2 |
| 8 | ARCHAOLOGISCHES NACHRICHTENBLATT | 1901 | 0% | 1% | 1 |
| 9 | IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART A | 1605 | 1% | 1% | 2 |
| 10 | IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING | 1572 | 1% | 1% | 2 |
Author Key Words |
Core articles |
The table includes core articles in the class. The following variables is taken into account for the relevance score of an article in a cluster c: (1) Number of references referring to publications in the class. (2) Share of total number of active references referring to publications in the class. (3) Age of the article. New articles get higher score than old articles. (4) Citation rate, normalized to year. |
Classes with closest relation at Level 1 |