Class information for: |
Basic class information |
Hierarchy of classes |
The table includes all classes above and classes immediately below the current class. |
| Cluster id | Level | Cluster label | #P |
|---|---|---|---|
| 1 | 4 | PHYSICS, CONDENSED MATTER//PHYSICS, APPLIED//MATERIALS SCIENCE, MULTIDISCIPLINARY | 2188495 |
| 396 | 3 | LEAD FREE SOLDER//SOLDER//ELECTROMIGRATION | 32184 |
| 535 | 2 | LEAD FREE SOLDER//SOLDER//SOLDERING & SURFACE MOUNT TECHNOLOGY | 15297 |
| 26160 | 1 | ELECTROCHEMICAL MIGRATION//ELECTROCHEMICAL MIGRATION ECM//SURFACE INSULATION RESISTANCE | 283 |
Terms with highest relevance score |
| rank | Category | termType | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
|---|---|---|---|---|---|---|
| 1 | ELECTROCHEMICAL MIGRATION | authKW | 3034189 | 13% | 72% | 38 |
| 2 | ELECTROCHEMICAL MIGRATION ECM | authKW | 1113665 | 4% | 100% | 10 |
| 3 | SURFACE INSULATION RESISTANCE | authKW | 548260 | 3% | 62% | 8 |
| 4 | CONDUCTIVE ANODIC FILAMENT | authKW | 397735 | 2% | 71% | 5 |
| 5 | NO CLEAN FLUX | authKW | 356371 | 1% | 80% | 4 |
| 6 | SURFACE INSULATION RESISTANCE SIR | authKW | 356371 | 1% | 80% | 4 |
| 7 | FLUX CHEMISTRY | authKW | 334099 | 1% | 100% | 3 |
| 8 | PROD ASSURANCE PONSE | address | 250573 | 1% | 75% | 3 |
| 9 | FINE PITCH THROUGH VIAS | authKW | 222733 | 1% | 100% | 2 |
| 10 | HIGH TEMPERATURE BIASED TESTING | authKW | 222733 | 1% | 100% | 2 |
Web of Science journal categories |
| chi_square_rank | Category | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
|---|---|---|---|---|---|
| 1 | Engineering, Electrical & Electronic | 1942 | 49% | 0% | 138 |
| 2 | Materials Science, Multidisciplinary | 1760 | 55% | 0% | 156 |
| 3 | Engineering, Manufacturing | 1460 | 13% | 0% | 36 |
| 4 | Metallurgy & Metallurgical Engineering | 867 | 19% | 0% | 54 |
| 5 | Physics, Applied | 856 | 36% | 0% | 103 |
| 6 | Nanoscience & Nanotechnology | 341 | 13% | 0% | 36 |
| 7 | Materials Science, Coatings & Films | 217 | 7% | 0% | 19 |
| 8 | Electrochemistry | 163 | 7% | 0% | 20 |
| 9 | Physics, Condensed Matter | 105 | 12% | 0% | 34 |
| 10 | Materials Science, Characterization, Testing | 47 | 2% | 0% | 5 |
Address terms |
| chi_square_rank | term | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
|---|---|---|---|---|---|
| 1 | PROD ASSURANCE PONSE | 250573 | 1% | 75% | 3 |
| 2 | SECT MAT SUR E TECHNOL | 222733 | 1% | 100% | 2 |
| 3 | ADV DEV TEAM ACI 2 | 111366 | 0% | 100% | 1 |
| 4 | ADV OPERAT ENGN | 111366 | 0% | 100% | 1 |
| 5 | BUSINESS UNIT MANAGEMENT | 111366 | 0% | 100% | 1 |
| 6 | CBNERRVA | 111366 | 0% | 100% | 1 |
| 7 | CO KG | 111366 | 0% | 100% | 1 |
| 8 | CONNECTOR DEV | 111366 | 0% | 100% | 1 |
| 9 | ELECT INTERCONNECT TEAM | 111366 | 0% | 100% | 1 |
| 10 | FIELD ELECT INTERCONNECT | 111366 | 0% | 100% | 1 |
Journals |
| chi_square_rank | term | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
|---|---|---|---|---|---|
| 1 | SOLDERING & SURFACE MOUNT TECHNOLOGY | 27077 | 4% | 2% | 10 |
| 2 | CIRCUIT WORLD | 25018 | 2% | 3% | 7 |
| 3 | IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY | 19380 | 5% | 1% | 15 |
| 4 | IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY | 9871 | 4% | 1% | 10 |
| 5 | JOURNAL OF ELECTRONIC MATERIALS | 5227 | 8% | 0% | 22 |
| 6 | MICROELECTRONICS RELIABILITY | 4351 | 6% | 0% | 17 |
| 7 | JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS | 3749 | 6% | 0% | 18 |
| 8 | JOURNAL OF THE IEST | 3180 | 0% | 3% | 1 |
| 9 | MICROELECTRONICS INTERNATIONAL | 2817 | 1% | 1% | 3 |
| 10 | IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY | 2792 | 2% | 0% | 6 |
Author Key Words |
Core articles |
The table includes core articles in the class. The following variables is taken into account for the relevance score of an article in a cluster c: (1) Number of references referring to publications in the class. (2) Share of total number of active references referring to publications in the class. (3) Age of the article. New articles get higher score than old articles. (4) Citation rate, normalized to year. |
Classes with closest relation at Level 1 |