Class information for:
Level 1: DIE ATTACH//HIGH TEMPERATURE SOLDER//NANOSILVER PASTE

Basic class information
Bar chart of Publication_year

Last years might be incomplete

Hierarchy of classes
The table includes all classes above and classes immediately below the current class.


Cluster id Level Cluster label #P
1 4 PHYSICS, CONDENSED MATTER//PHYSICS, APPLIED//MATERIALS SCIENCE, MULTIDISCIPLINARY 2188495
396 3       LEAD FREE SOLDER//SOLDER//ELECTROMIGRATION 32184
535 2             LEAD FREE SOLDER//SOLDER//SOLDERING & SURFACE MOUNT TECHNOLOGY 15297
11441 1                   DIE ATTACH//HIGH TEMPERATURE SOLDER//NANOSILVER PASTE 1009

Terms with highest relevance score


rank Category termType chi_square shrOfCwithTerm shrOfTermInClass termInClass
1 DIE ATTACH authKW 763538 4% 66% 37
2 HIGH TEMPERATURE SOLDER authKW 510148 2% 78% 21
3 NANOSILVER PASTE authKW 510148 2% 78% 21
4 FLUXLESS BONDING authKW 439986 2% 78% 18
5 DIE ATTACHMENT authKW 410295 2% 77% 17
6 FLUXLESS SOLDERING authKW 367444 2% 59% 20
7 DIFFUSION SOLDERING authKW 348947 2% 62% 18
8 AU SN SOLDER authKW 252995 1% 90% 9
9 DIE BONDING authKW 229492 1% 57% 13
10 HIGH TEMPERATURE LEAD FREE SOLDER authKW 199895 1% 80% 8

Web of Science journal categories


chi_square_rank Category chi_square shrOfCwithTerm shrOfTermInClass termInClass
1 Materials Science, Multidisciplinary 9844 68% 0% 686
2 Engineering, Electrical & Electronic 5477 44% 0% 441
3 Metallurgy & Metallurgical Engineering 4415 23% 0% 228
4 Physics, Applied 3828 40% 0% 407
5 Engineering, Manufacturing 3380 10% 0% 104
6 Nanoscience & Nanotechnology 1446 14% 0% 139
7 Materials Science, Coatings & Films 910 7% 0% 73
8 Physics, Condensed Matter 421 13% 0% 127
9 Chemistry, Physical 66 9% 0% 88
10 Microscopy 20 1% 0% 6

Address terms


chi_square_rank term chi_square shrOfCwithTerm shrOfTermInClass termInClass
1 LED ENGN 124937 0% 100% 4
2 MAT MFG TECHNOL PROGRAM 124937 0% 100% 4
3 TIANJIN ADV JOINING TECHNOL 102409 3% 12% 28
4 ELECT MAT BUSINESS UNIT 62468 0% 100% 2
5 ELECT PACKAGING MICRONANO MFG 62468 0% 100% 2
6 INAL POWER SYST 62468 0% 100% 2
7 INTELLIGENT STRUCT MAT SYST 62468 0% 100% 2
8 SMART GREEN PROC 62468 0% 100% 2
9 ELECT ENGN COMP SCI MAT MFG TECHNOL 56219 0% 60% 3
10 WELDING JOINING RD GRP 46848 0% 50% 3

Journals


chi_square_rank term chi_square shrOfCwithTerm shrOfTermInClass termInClass
1 JOURNAL OF ELECTRONIC MATERIALS 51363 13% 1% 130
2 IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY 42201 4% 3% 44
3 SOLDERING & SURFACE MOUNT TECHNOLOGY 19424 2% 4% 16
4 MICROELECTRONICS RELIABILITY 15713 6% 1% 61
5 IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES 13114 2% 2% 22
6 JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS 9801 5% 1% 55
7 IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY 9638 2% 2% 20
8 IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY 7983 2% 2% 17
9 MATERIALS TRANSACTIONS 5181 3% 0% 35
10 GEC JOURNAL OF TECHNOLOGY 4994 0% 8% 2

Author Key Words


chi_square_rank term chi_square shrOfCwithTerm shrOfTermInClass termInClass LCSH search Wikipedia search
1 DIE ATTACH 763538 4% 66% 37 Search DIE+ATTACH Search DIE+ATTACH
2 HIGH TEMPERATURE SOLDER 510148 2% 78% 21 Search HIGH+TEMPERATURE+SOLDER Search HIGH+TEMPERATURE+SOLDER
3 NANOSILVER PASTE 510148 2% 78% 21 Search NANOSILVER+PASTE Search NANOSILVER+PASTE
4 FLUXLESS BONDING 439986 2% 78% 18 Search FLUXLESS+BONDING Search FLUXLESS+BONDING
5 DIE ATTACHMENT 410295 2% 77% 17 Search DIE+ATTACHMENT Search DIE+ATTACHMENT
6 FLUXLESS SOLDERING 367444 2% 59% 20 Search FLUXLESS+SOLDERING Search FLUXLESS+SOLDERING
7 DIFFUSION SOLDERING 348947 2% 62% 18 Search DIFFUSION+SOLDERING Search DIFFUSION+SOLDERING
8 AU SN SOLDER 252995 1% 90% 9 Search AU+SN+SOLDER Search AU+SN+SOLDER
9 DIE BONDING 229492 1% 57% 13 Search DIE+BONDING Search DIE+BONDING
10 HIGH TEMPERATURE LEAD FREE SOLDER 199895 1% 80% 8 Search HIGH+TEMPERATURE+LEAD+FREE+SOLDER Search HIGH+TEMPERATURE+LEAD+FREE+SOLDER

Core articles
The table includes core articles in the class. The following variables is taken into account for the relevance score of an article in a cluster c:
(1) Number of references referring to publications in the class.
(2) Share of total number of active references referring to publications in the class.
(3) Age of the article. New articles get higher score than old articles.
(4) Citation rate, normalized to year.

Classes with closest relation at Level 1


rank cluster_id2 link
1 16 LEAD FREE SOLDER//SOLDER//PB FREE SOLDER
2 26160 ELECTROCHEMICAL MIGRATION//ELECTROCHEMICAL MIGRATION ECM//SURFACE INSULATION RESISTANCE
3 32657 ADVANCED BUILD UP SUBSTRATE//CATHODIC ELECTRO CLEANING//CONDENSATION STIMULATED DIFFUSION
4 5559 IGBT//INSULATED GATE BIPOLAR TRANSISTOR IGBT//IEEE TRANSACTIONS ON POWER ELECTRONICS
5 31473 NANOJOINING//ELECTRICAL NANOWELDING//NANOSCALE SOLDERING
6 12722 ISOTHERMAL SOLIDIFICATION//TLP BONDING//TRANSIENT LIQUID PHASE BONDING
7 4923 WAFER BONDING//ANODIC BONDING//DIRECT BONDING
8 4894 INKJET PRINTING//PRINTED ELECTRONICS//CONDUCTIVE INK
9 11481 CONDUCTIVE ADHESIVE//ANISOTROPIC CONDUCTIVE FILM ACF//ANISOTROPIC CONDUCTIVE FILM
10 7589 ALLOY THERMODYNAMICS//CALPHAD-COMPUTER COUPLING OF PHASE DIAGRAMS AND THERMOCHEMISTRY//LIQUID ALLOYS

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