Class information for:
Level 1: WAFER BONDING//ANODIC BONDING//DIRECT BONDING

Basic class information
Bar chart of Publication_year

Last years might be incomplete

Hierarchy of classes
The table includes all classes above and classes immediately below the current class.


Cluster id Level Cluster label #P
1 4 PHYSICS, CONDENSED MATTER//PHYSICS, APPLIED//MATERIALS SCIENCE, MULTIDISCIPLINARY 2188495
13 3       PHYSICS, APPLIED//IEEE TRANSACTIONS ON ELECTRON DEVICES//SILICON 136516
3171 2             WAFER BONDING//ANODIC BONDING//DIRECT BONDING 2326
4923 1                   WAFER BONDING//ANODIC BONDING//DIRECT BONDING 1730

Terms with highest relevance score


rank Category termType chi_square shrOfCwithTerm shrOfTermInClass termInClass
1 WAFER BONDING authKW 989840 10% 33% 166
2 ANODIC BONDING authKW 901085 5% 57% 87
3 DIRECT BONDING authKW 301114 2% 42% 39
4 LOW TEMPERATURE BONDING authKW 259627 2% 49% 29
5 SILICON WAFER BONDING authKW 245433 1% 84% 16
6 ROOM TEMPERATURE BONDING authKW 242868 1% 67% 20
7 SURFACE ACTIVATED BONDING authKW 218581 1% 67% 18
8 HERMETICITY authKW 163927 1% 50% 18
9 WAFER DIRECT BONDING authKW 146586 1% 62% 13
10 MEMS PACKAGING authKW 145713 1% 50% 16

Web of Science journal categories


chi_square_rank Category chi_square shrOfCwithTerm shrOfTermInClass termInClass
1 Physics, Applied 13469 56% 0% 973
2 Engineering, Electrical & Electronic 8150 41% 0% 708
3 Instruments & Instrumentation 7371 21% 0% 363
4 Nanoscience & Nanotechnology 6392 21% 0% 371
5 Materials Science, Multidisciplinary 3571 34% 0% 580
6 Materials Science, Coatings & Films 2599 9% 0% 159
7 Electrochemistry 940 7% 0% 119
8 Mechanics 637 8% 0% 132
9 Physics, Condensed Matter 277 9% 0% 151
10 Engineering, Manufacturing 208 2% 0% 38

Address terms


chi_square_rank term chi_square shrOfCwithTerm shrOfTermInClass termInClass
1 WAFER BONDING 72860 0% 67% 6
2 ADV MICROSYST INTEGRAT PACKAGING 36432 0% 100% 2
3 FUNDAMENTAL SCI NOVEL MICRO NANO DEV 36432 0% 100% 2
4 OPTOELECT OKI 36432 0% 100% 2
5 PRECIS ENGN 31991 3% 3% 54
6 MODERN MFG QUAL ENGN 24287 0% 67% 2
7 ORION ELECT CO LTD 24287 0% 67% 2
8 ZENTRUM MIKROTECHNOL 24279 0% 22% 6
9 SP2M NRS 20489 0% 38% 3
10 ADV ELECT COMPONENT SECT 18216 0% 100% 1

Journals


chi_square_rank term chi_square shrOfCwithTerm shrOfTermInClass termInClass
1 JOURNAL OF MICROMECHANICS AND MICROENGINEERING 37215 6% 2% 108
2 SENSORS AND ACTUATORS A-PHYSICAL 34708 8% 1% 139
3 MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS 28090 4% 2% 76
4 JOURNAL OF MICROELECTROMECHANICAL SYSTEMS 24386 4% 2% 61
5 IEEE TRANSACTIONS ON ADVANCED PACKAGING 12117 2% 3% 26
6 ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY 10344 2% 2% 29
7 JOURNAL OF THE ELECTROCHEMICAL SOCIETY 6648 6% 0% 107
8 PHILIPS JOURNAL OF RESEARCH 5435 1% 3% 10
9 IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY 4092 1% 1% 18
10 ECS SOLID STATE LETTERS 3232 0% 2% 8

Author Key Words


chi_square_rank term chi_square shrOfCwithTerm shrOfTermInClass termInClass LCSH search Wikipedia search
1 WAFER BONDING 989840 10% 33% 166 Search WAFER+BONDING Search WAFER+BONDING
2 ANODIC BONDING 901085 5% 57% 87 Search ANODIC+BONDING Search ANODIC+BONDING
3 DIRECT BONDING 301114 2% 42% 39 Search DIRECT+BONDING Search DIRECT+BONDING
4 LOW TEMPERATURE BONDING 259627 2% 49% 29 Search LOW+TEMPERATURE+BONDING Search LOW+TEMPERATURE+BONDING
5 SILICON WAFER BONDING 245433 1% 84% 16 Search SILICON+WAFER+BONDING Search SILICON+WAFER+BONDING
6 ROOM TEMPERATURE BONDING 242868 1% 67% 20 Search ROOM+TEMPERATURE+BONDING Search ROOM+TEMPERATURE+BONDING
7 SURFACE ACTIVATED BONDING 218581 1% 67% 18 Search SURFACE+ACTIVATED+BONDING Search SURFACE+ACTIVATED+BONDING
8 HERMETICITY 163927 1% 50% 18 Search HERMETICITY Search HERMETICITY
9 WAFER DIRECT BONDING 146586 1% 62% 13 Search WAFER+DIRECT+BONDING Search WAFER+DIRECT+BONDING
10 MEMS PACKAGING 145713 1% 50% 16 Search MEMS+PACKAGING Search MEMS+PACKAGING

Core articles
The table includes core articles in the class. The following variables is taken into account for the relevance score of an article in a cluster c:
(1) Number of references referring to publications in the class.
(2) Share of total number of active references referring to publications in the class.
(3) Age of the article. New articles get higher score than old articles.
(4) Citation rate, normalized to year.

Classes with closest relation at Level 1


rank cluster_id2 link
1 23885 ANAL STRUCT MAT//UNITE RECH PHYS SOLIDE//PHYS MATIERE CONDENSEE NANOSCI LR ES 40 11
2 8017 THROUGH SILICON VIA TSV//THROUGH SILICON VIA//3D IC
3 28137 WET ETCHING OF GLASS//EBEP//CURRENT BALANCE EQUATION
4 11918 ION CUT//SMART CUT//GETTERING
5 25803 EPITAXIAL LIFT OFF//EPITAXIAL LIFT OFF ELO//EPITAXIAL LIFT OFF ELO METHOD
6 11441 DIE ATTACH//HIGH TEMPERATURE SOLDER//NANOSILVER PASTE
7 29849 COMPLIANT INTERCONNECTS//DIE SHIFT//OFF CHIP
8 9903 PRESSURE SENSOR//PIEZORESISTANCE//CAPACITIVE PRESSURE SENSOR
9 37235 MAKYOH TOPOGRAPHY//SURFACE FLATNESS//MAKYOH
10 36481 LANGAHA MADAGASCARIENSIS//ADHESION COATINGS//ALUMINUM MICRO FIN ARRAYS

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