Class information for: |
Basic class information |
Hierarchy of classes |
The table includes all classes above and classes immediately below the current class. |
| Cluster id | Level | Cluster label | #P |
|---|---|---|---|
| 1 | 4 | PHYSICS, CONDENSED MATTER//PHYSICS, APPLIED//MATERIALS SCIENCE, MULTIDISCIPLINARY | 2188495 |
| 396 | 3 | LEAD FREE SOLDER//SOLDER//ELECTROMIGRATION | 32184 |
| 535 | 2 | LEAD FREE SOLDER//SOLDER//SOLDERING & SURFACE MOUNT TECHNOLOGY | 15297 |
| 29849 | 1 | COMPLIANT INTERCONNECTS//DIE SHIFT//OFF CHIP | 195 |
Terms with highest relevance score |
| rank | Category | termType | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
|---|---|---|---|---|---|---|
| 1 | COMPLIANT INTERCONNECTS | authKW | 831213 | 3% | 86% | 6 |
| 2 | DIE SHIFT | authKW | 646500 | 2% | 100% | 4 |
| 3 | OFF CHIP | authKW | 646500 | 2% | 100% | 4 |
| 4 | CHIP TO SUBSTRATE INTERCONNECTS | authKW | 484875 | 2% | 100% | 3 |
| 5 | FIRST LEVEL INTERCONNECTS | authKW | 484875 | 2% | 100% | 3 |
| 6 | FLEXIBLE INTERCONNECTS | authKW | 404058 | 3% | 50% | 5 |
| 7 | CU STUD | authKW | 323250 | 1% | 100% | 2 |
| 8 | WAFER LEVEL PACKAGING | authKW | 317590 | 7% | 15% | 13 |
| 9 | ADV MICROSYST PACKAGING NANOMECH | address | 295531 | 4% | 23% | 8 |
| 10 | PRESSURE CONTACT | authKW | 215499 | 1% | 67% | 2 |
Web of Science journal categories |
| chi_square_rank | Category | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
|---|---|---|---|---|---|
| 1 | Engineering, Manufacturing | 2031 | 18% | 0% | 35 |
| 2 | Engineering, Electrical & Electronic | 1554 | 52% | 0% | 102 |
| 3 | Materials Science, Multidisciplinary | 948 | 49% | 0% | 96 |
| 4 | Nanoscience & Nanotechnology | 802 | 23% | 0% | 44 |
| 5 | Physics, Applied | 390 | 30% | 0% | 59 |
| 6 | Instruments & Instrumentation | 142 | 9% | 0% | 18 |
| 7 | Engineering, Mechanical | 42 | 6% | 0% | 11 |
| 8 | Computer Science, Hardware & Architecture | 32 | 3% | 0% | 5 |
| 9 | Mechanics | 15 | 4% | 0% | 8 |
| 10 | Optics | 15 | 5% | 0% | 10 |
Address terms |
| chi_square_rank | term | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
|---|---|---|---|---|---|
| 1 | ADV MICROSYST PACKAGING NANOMECH | 295531 | 4% | 23% | 8 |
| 2 | COMP AIDED SIMULAT PACKAGING RELIABIL CASPAR | 198918 | 2% | 31% | 4 |
| 3 | ADV PACKING | 161625 | 1% | 100% | 1 |
| 4 | D PACKAGING 3 | 161625 | 1% | 100% | 1 |
| 5 | MENT POWER MECH ENGN | 161625 | 1% | 100% | 1 |
| 6 | MICROSWITCH | 161625 | 1% | 100% | 1 |
| 7 | OFF ELECT MINITURIZAR | 161625 | 1% | 100% | 1 |
| 8 | PME ADV PACKAGING | 161625 | 1% | 100% | 1 |
| 9 | THYSSEN KRUPP AUTOMOT GRP | 161625 | 1% | 100% | 1 |
| 10 | V MICROSYST | 161625 | 1% | 100% | 1 |
Journals |
| chi_square_rank | term | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
|---|---|---|---|---|---|
| 1 | IEEE TRANSACTIONS ON ADVANCED PACKAGING | 173859 | 17% | 3% | 33 |
| 2 | IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY | 36584 | 9% | 1% | 18 |
| 3 | IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES | 23747 | 7% | 1% | 13 |
| 4 | IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING | 15180 | 3% | 2% | 6 |
| 5 | IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING | 14681 | 3% | 2% | 6 |
| 6 | JOURNAL OF ELECTRONIC PACKAGING | 12747 | 5% | 1% | 10 |
| 7 | JOURNAL OF MICROELECTROMECHANICAL SYSTEMS | 3724 | 4% | 0% | 8 |
| 8 | MICROELECTRONICS RELIABILITY | 3147 | 6% | 0% | 12 |
| 9 | SOLDERING & SURFACE MOUNT TECHNOLOGY | 1569 | 1% | 0% | 2 |
| 10 | NEW HORIZONS-THE SCIENCE AND PRACTICE OF ACUTE MEDICINE | 1481 | 1% | 1% | 1 |
Author Key Words |
| chi_square_rank | term | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass | LCSH search | Wikipedia search |
|---|---|---|---|---|---|---|---|
| 1 | COMPLIANT INTERCONNECTS | 831213 | 3% | 86% | 6 | Search COMPLIANT+INTERCONNECTS | Search COMPLIANT+INTERCONNECTS |
| 2 | DIE SHIFT | 646500 | 2% | 100% | 4 | Search DIE+SHIFT | Search DIE+SHIFT |
| 3 | OFF CHIP | 646500 | 2% | 100% | 4 | Search OFF+CHIP | Search OFF+CHIP |
| 4 | CHIP TO SUBSTRATE INTERCONNECTS | 484875 | 2% | 100% | 3 | Search CHIP+TO+SUBSTRATE+INTERCONNECTS | Search CHIP+TO+SUBSTRATE+INTERCONNECTS |
| 5 | FIRST LEVEL INTERCONNECTS | 484875 | 2% | 100% | 3 | Search FIRST+LEVEL+INTERCONNECTS | Search FIRST+LEVEL+INTERCONNECTS |
| 6 | FLEXIBLE INTERCONNECTS | 404058 | 3% | 50% | 5 | Search FLEXIBLE+INTERCONNECTS | Search FLEXIBLE+INTERCONNECTS |
| 7 | CU STUD | 323250 | 1% | 100% | 2 | Search CU+STUD | Search CU+STUD |
| 8 | WAFER LEVEL PACKAGING | 317590 | 7% | 15% | 13 | Search WAFER+LEVEL+PACKAGING | Search WAFER+LEVEL+PACKAGING |
| 9 | PRESSURE CONTACT | 215499 | 1% | 67% | 2 | Search PRESSURE+CONTACT | Search PRESSURE+CONTACT |
| 10 | WLCSP | 184709 | 2% | 29% | 4 | Search WLCSP | Search WLCSP |
Core articles |
The table includes core articles in the class. The following variables is taken into account for the relevance score of an article in a cluster c: (1) Number of references referring to publications in the class. (2) Share of total number of active references referring to publications in the class. (3) Age of the article. New articles get higher score than old articles. (4) Citation rate, normalized to year. |
Classes with closest relation at Level 1 |