Class information for: |
Basic class information |
Hierarchy of classes |
The table includes all classes above and classes immediately below the current class. |
| Cluster id | Level | Cluster label | #P |
|---|---|---|---|
| 1 | 4 | PHYSICS, CONDENSED MATTER//PHYSICS, APPLIED//MATERIALS SCIENCE, MULTIDISCIPLINARY | 2188495 |
| 396 | 3 | LEAD FREE SOLDER//SOLDER//ELECTROMIGRATION | 32184 |
| 535 | 2 | LEAD FREE SOLDER//SOLDER//SOLDERING & SURFACE MOUNT TECHNOLOGY | 15297 |
| 32938 | 1 | PROBE CARD//MEMS PROBE CARD//POROUS SILICON MICROMACHINING | 145 |
Terms with highest relevance score |
| rank | Category | termType | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
|---|---|---|---|---|---|---|
| 1 | PROBE CARD | authKW | 2366787 | 10% | 78% | 14 |
| 2 | MEMS PROBE CARD | authKW | 905659 | 3% | 83% | 5 |
| 3 | POROUS SILICON MICROMACHINING | authKW | 679242 | 3% | 63% | 5 |
| 4 | WAFER LEVEL PROBING TEST | authKW | 652076 | 2% | 100% | 3 |
| 5 | WAFER PROBING TEST | authKW | 652076 | 2% | 100% | 3 |
| 6 | EPOXY RING PROBE CARD | authKW | 434717 | 1% | 100% | 2 |
| 7 | MULTILAYER NEEDLE CARD | authKW | 434717 | 1% | 100% | 2 |
| 8 | WAFER PROBING | authKW | 417991 | 3% | 38% | 5 |
| 9 | PROBE MARK | authKW | 289810 | 1% | 67% | 2 |
| 10 | VERTICAL PROBE | authKW | 289810 | 1% | 67% | 2 |
Web of Science journal categories |
| chi_square_rank | Category | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
|---|---|---|---|---|---|
| 1 | Nanoscience & Nanotechnology | 1270 | 32% | 0% | 47 |
| 2 | Engineering, Electrical & Electronic | 1004 | 49% | 0% | 71 |
| 3 | Engineering, Manufacturing | 795 | 13% | 0% | 19 |
| 4 | Education, Scientific Disciplines | 730 | 11% | 0% | 16 |
| 5 | Instruments & Instrumentation | 687 | 22% | 0% | 32 |
| 6 | Physics, Applied | 603 | 42% | 0% | 61 |
| 7 | Materials Science, Multidisciplinary | 334 | 35% | 0% | 51 |
| 8 | Mechanics | 92 | 10% | 0% | 14 |
| 9 | Engineering, General | 82 | 6% | 0% | 9 |
| 10 | Engineering, Mechanical | 63 | 8% | 0% | 11 |
Address terms |
| chi_square_rank | term | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
|---|---|---|---|---|---|
| 1 | CONTINUOUS PROGRAM IMPROVEMENT | 217359 | 1% | 100% | 1 |
| 2 | ELECT RELIABIL METROL 405 | 217359 | 1% | 100% | 1 |
| 3 | GRP DF | 217359 | 1% | 100% | 1 |
| 4 | HIGH TECH IND ENGINEERS | 217359 | 1% | 100% | 1 |
| 5 | IC MEMS INC | 217359 | 1% | 100% | 1 |
| 6 | PROL ING | 217359 | 1% | 100% | 1 |
| 7 | SPECIAL BUSINESS | 217359 | 1% | 100% | 1 |
| 8 | SYST BOARD | 217359 | 1% | 100% | 1 |
| 9 | POLYTECH ENGN GIJON | 173884 | 1% | 40% | 2 |
| 10 | KOREA BIO IT FOUNDRY SEOUL | 108678 | 1% | 50% | 1 |
Journals |
| chi_square_rank | term | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
|---|---|---|---|---|---|
| 1 | JOURNAL OF MATERIALS EDUCATION | 163002 | 6% | 8% | 9 |
| 2 | MACHINE DESIGN | 21491 | 2% | 3% | 3 |
| 3 | IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING | 8774 | 3% | 1% | 4 |
| 4 | JOURNAL OF MICROMECHANICS AND MICROENGINEERING | 5489 | 8% | 0% | 12 |
| 5 | MICROELECTRONICS RELIABILITY | 4979 | 9% | 0% | 13 |
| 6 | IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY | 3790 | 3% | 0% | 5 |
| 7 | INTERNATIONAL JOURNAL OF ENGINEERING EDUCATION | 3362 | 4% | 0% | 6 |
| 8 | IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES | 3019 | 3% | 0% | 4 |
| 9 | IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING | 2266 | 1% | 1% | 2 |
| 10 | MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS | 2088 | 4% | 0% | 6 |
Author Key Words |
| chi_square_rank | term | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass | LCSH search | Wikipedia search |
|---|---|---|---|---|---|---|---|
| 1 | PROBE CARD | 2366787 | 10% | 78% | 14 | Search PROBE+CARD | Search PROBE+CARD |
| 2 | MEMS PROBE CARD | 905659 | 3% | 83% | 5 | Search MEMS+PROBE+CARD | Search MEMS+PROBE+CARD |
| 3 | POROUS SILICON MICROMACHINING | 679242 | 3% | 63% | 5 | Search POROUS+SILICON+MICROMACHINING | Search POROUS+SILICON+MICROMACHINING |
| 4 | WAFER LEVEL PROBING TEST | 652076 | 2% | 100% | 3 | Search WAFER+LEVEL+PROBING+TEST | Search WAFER+LEVEL+PROBING+TEST |
| 5 | WAFER PROBING TEST | 652076 | 2% | 100% | 3 | Search WAFER+PROBING+TEST | Search WAFER+PROBING+TEST |
| 6 | EPOXY RING PROBE CARD | 434717 | 1% | 100% | 2 | Search EPOXY+RING+PROBE+CARD | Search EPOXY+RING+PROBE+CARD |
| 7 | MULTILAYER NEEDLE CARD | 434717 | 1% | 100% | 2 | Search MULTILAYER+NEEDLE+CARD | Search MULTILAYER+NEEDLE+CARD |
| 8 | WAFER PROBING | 417991 | 3% | 38% | 5 | Search WAFER+PROBING | Search WAFER+PROBING |
| 9 | PROBE MARK | 289810 | 1% | 67% | 2 | Search PROBE+MARK | Search PROBE+MARK |
| 10 | VERTICAL PROBE | 289810 | 1% | 67% | 2 | Search VERTICAL+PROBE | Search VERTICAL+PROBE |
Core articles |
The table includes core articles in the class. The following variables is taken into account for the relevance score of an article in a cluster c: (1) Number of references referring to publications in the class. (2) Share of total number of active references referring to publications in the class. (3) Age of the article. New articles get higher score than old articles. (4) Citation rate, normalized to year. |
Classes with closest relation at Level 1 |