Class information for:
Level 1: CHIP STRENGTH//DIE STRENGTH//WAFER DICING

Basic class information
Bar chart of Publication_year

Last years might be incomplete

Hierarchy of classes
The table includes all classes above and classes immediately below the current class.


Cluster id Level Cluster label #P
1 4 PHYSICS, CONDENSED MATTER//PHYSICS, APPLIED//MATERIALS SCIENCE, MULTIDISCIPLINARY 2188495
396 3       LEAD FREE SOLDER//SOLDER//ELECTROMIGRATION 32184
535 2             LEAD FREE SOLDER//SOLDER//SOLDERING & SURFACE MOUNT TECHNOLOGY 15297
27922 1                   CHIP STRENGTH//DIE STRENGTH//WAFER DICING 238

Terms with highest relevance score


rank Category termType chi_square shrOfCwithTerm shrOfTermInClass termInClass
1 CHIP STRENGTH authKW 397271 1% 100% 3
2 DIE STRENGTH authKW 353127 2% 67% 4
3 WAFER DICING authKW 300957 2% 45% 5
4 BALL BREAKER TEST authKW 264847 1% 100% 2
5 BEVEL LENGTH DIFFERENCE authKW 264847 1% 100% 2
6 CHIP EMBEDDING authKW 264847 1% 100% 2
7 CONDUCTIVE STRONTIUM TITANATE authKW 264847 1% 100% 2
8 LEADERS GLOBAL OPERAT address 264847 1% 100% 2
9 ROCKING CURVE IMAGING authKW 264847 1% 100% 2
10 THINNED CHIP authKW 264847 1% 100% 2

Web of Science journal categories


chi_square_rank Category chi_square shrOfCwithTerm shrOfTermInClass termInClass
1 Engineering, Manufacturing 2060 16% 0% 39
2 Physics, Applied 903 40% 0% 96
3 Engineering, Electrical & Electronic 561 30% 0% 71
4 Crystallography 523 13% 0% 31
5 Materials Science, Multidisciplinary 508 34% 0% 81
6 Nanoscience & Nanotechnology 369 14% 0% 34
7 Instruments & Instrumentation 231 11% 0% 25
8 Physics, Condensed Matter 108 13% 0% 31
9 Optics 86 9% 0% 22
10 Physics, Nuclear 43 5% 0% 11

Address terms


chi_square_rank term chi_square shrOfCwithTerm shrOfTermInClass termInClass
1 LEADERS GLOBAL OPERAT 264847 1% 100% 2
2 AUTOMATISIERUNGSTECH GMBH 132424 0% 100% 1
3 ELECT TECHNOL SPACE ELECT GRP 132424 0% 100% 1
4 FRANHOFER NONDESTRUCT TESTING 132424 0% 100% 1
5 GEO UMWELTNATURWISSEN AFTEN 132424 0% 100% 1
6 GEWOWISS 132424 0% 100% 1
7 HAMBURGER SYNCROTRON STRAHRUNGS OR 132424 0% 100% 1
8 KRISTALLOG GEOWISS 132424 0% 100% 1
9 MUNICH IZM M 132424 0% 100% 1
10 MUSASHINO ELECT COMMUN COMMUN S 132424 0% 100% 1

Journals


chi_square_rank term chi_square shrOfCwithTerm shrOfTermInClass termInClass
1 IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY 29968 8% 1% 18
2 IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING 16372 3% 2% 7
3 IEEE TRANSACTIONS ON ADVANCED PACKAGING 6398 3% 1% 7
4 JOURNAL OF APPLIED CRYSTALLOGRAPHY 4511 6% 0% 14
5 CIRCUIT WORLD 2426 1% 1% 2
6 MICROELECTRONICS RELIABILITY 2161 5% 0% 11
7 CRYSTALLOGRAPHY REPORTS 1832 3% 0% 7
8 SOLID STATE TECHNOLOGY 1771 2% 0% 5
9 IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES 1031 1% 0% 3
10 JOURNAL OF MANUFACTURING PROCESSES 968 1% 0% 2

Author Key Words


chi_square_rank term chi_square shrOfCwithTerm shrOfTermInClass termInClass LCSH search Wikipedia search
1 CHIP STRENGTH 397271 1% 100% 3 Search CHIP+STRENGTH Search CHIP+STRENGTH
2 DIE STRENGTH 353127 2% 67% 4 Search DIE+STRENGTH Search DIE+STRENGTH
3 WAFER DICING 300957 2% 45% 5 Search WAFER+DICING Search WAFER+DICING
4 BALL BREAKER TEST 264847 1% 100% 2 Search BALL+BREAKER+TEST Search BALL+BREAKER+TEST
5 BEVEL LENGTH DIFFERENCE 264847 1% 100% 2 Search BEVEL+LENGTH+DIFFERENCE Search BEVEL+LENGTH+DIFFERENCE
6 CHIP EMBEDDING 264847 1% 100% 2 Search CHIP+EMBEDDING Search CHIP+EMBEDDING
7 CONDUCTIVE STRONTIUM TITANATE 264847 1% 100% 2 Search CONDUCTIVE+STRONTIUM+TITANATE Search CONDUCTIVE+STRONTIUM+TITANATE
8 ROCKING CURVE IMAGING 264847 1% 100% 2 Search ROCKING+CURVE+IMAGING Search ROCKING+CURVE+IMAGING
9 THINNED CHIP 264847 1% 100% 2 Search THINNED+CHIP Search THINNED+CHIP
10 ULTRATHIN SEMICONDUCTOR DIE 264847 1% 100% 2 Search ULTRATHIN+SEMICONDUCTOR+DIE Search ULTRATHIN+SEMICONDUCTOR+DIE

Core articles
The table includes core articles in the class. The following variables is taken into account for the relevance score of an article in a cluster c:
(1) Number of references referring to publications in the class.
(2) Share of total number of active references referring to publications in the class.
(3) Age of the article. New articles get higher score than old articles.
(4) Citation rate, normalized to year.

Classes with closest relation at Level 1


rank cluster_id2 link
1 18306 ELECTRON BEAM DOPING//KEK PF//BORRMANN EFFECT
2 8199 NANOMETRIC CUTTING//WIRE SAWING//DUCTILE MODE MACHINING
3 24450 PARA TERPHENYL SINGLE CRYSTALS//CNRS L NEEL//ANTIFERROELECTRITY
4 20649 3DXRD//DIFFRACTION CONTRAST TOMOGRAPHY//THREE DIMENSIONAL X RAY DIFFRACTION
5 32938 PROBE CARD//MEMS PROBE CARD//POROUS SILICON MICROMACHINING
6 18826 UNDERFILL//FLIP CHIP//UNDERFILL FLOW
7 8017 THROUGH SILICON VIA TSV//THROUGH SILICON VIA//3D IC
8 37185 DICING BLADE//DIAMOND CHARGING PROCESS//LAPPING PLATE TOPOGRAPHY
9 17997 STRUKTUR FUNKT KERAM//BALL ON THREE BALLS TEST//SINOPEC TECHNOL CO
10 26965 NONCONTACT HANDLING//BERNOULLI GRIPPER//VORTEX GRIPPER

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