Class information for:
Level 1: THROUGH SILICON VIA TSV//THROUGH SILICON VIA//3D IC

Basic class information
Bar chart of Publication_year

Last years might be incomplete

Hierarchy of classes
The table includes all classes above and classes immediately below the current class.


Cluster id Level Cluster label #P
1 4 PHYSICS, CONDENSED MATTER//PHYSICS, APPLIED//MATERIALS SCIENCE, MULTIDISCIPLINARY 2188495
396 3       LEAD FREE SOLDER//SOLDER//ELECTROMIGRATION 32184
535 2             LEAD FREE SOLDER//SOLDER//SOLDERING & SURFACE MOUNT TECHNOLOGY 15297
8017 1                   THROUGH SILICON VIA TSV//THROUGH SILICON VIA//3D IC 1327

Terms with highest relevance score


rank Category termType chi_square shrOfCwithTerm shrOfTermInClass termInClass
1 THROUGH SILICON VIA TSV authKW 3256649 14% 73% 187
2 THROUGH SILICON VIA authKW 1618863 9% 59% 115
3 3D IC authKW 1404334 8% 56% 106
4 3 D INTEGRATION authKW 987636 9% 37% 113
5 THROUGH SILICON VIAS TSVS authKW 970783 4% 74% 55
6 TSV authKW 786541 6% 43% 77
7 IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY journal 388493 12% 11% 153
8 KEEP OUT ZONE KOZ authKW 356232 1% 100% 15
9 3 D INTEGRATED CIRCUITS authKW 337319 2% 57% 25
10 MICROBUMP authKW 281624 2% 46% 26

Web of Science journal categories


chi_square_rank Category chi_square shrOfCwithTerm shrOfTermInClass termInClass
1 Engineering, Electrical & Electronic 23937 77% 0% 1024
2 Computer Science, Hardware & Architecture 17465 21% 0% 273
3 Engineering, Manufacturing 7988 14% 0% 182
4 Nanoscience & Nanotechnology 4184 20% 0% 264
5 Physics, Applied 3395 34% 0% 448
6 Materials Science, Multidisciplinary 1578 26% 0% 351
7 Computer Science, Interdisciplinary Applications 419 5% 0% 72
8 Optics 267 7% 0% 97
9 Instruments & Instrumentation 165 4% 0% 58
10 Computer Science, Software Engineering 141 3% 0% 38

Address terms


chi_square_rank term chi_square shrOfCwithTerm shrOfTermInClass termInClass
1 SILICON TEST SOLUT 142493 0% 100% 6
2 ADV DESIGN TEAM 101321 1% 53% 8
3 ASSEMBLY RELIABIL TECHNOL 53969 0% 45% 5
4 NEW DISPLAYS SYST PLICAT 53969 0% 45% 5
5 HIGH DENS INTERCONNECT GRP 53433 0% 75% 3
6 ULTRA PRECIS MECH SYST 53433 0% 75% 3
7 GENIE ELECT SYST ENERGET 47498 0% 100% 2
8 ICE CUBE 47498 0% 100% 2
9 MICRON 47498 0% 100% 2
10 PKG DEV DEV 47498 0% 100% 2

Journals


chi_square_rank term chi_square shrOfCwithTerm shrOfTermInClass termInClass
1 IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY 388493 12% 11% 153
2 IEEE DESIGN & TEST 33936 1% 9% 16
3 IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS 32859 5% 2% 71
4 IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS 24031 5% 1% 71
5 IEEE TRANSACTIONS ON ADVANCED PACKAGING 18344 2% 3% 28
6 MICROELECTRONIC ENGINEERING 14592 6% 1% 80
7 IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY 12102 2% 2% 24
8 ACM JOURNAL ON EMERGING TECHNOLOGIES IN COMPUTING SYSTEMS 11009 1% 4% 12
9 MICROELECTRONICS RELIABILITY 9328 4% 1% 54
10 JOURNAL OF ELECTRONIC TESTING-THEORY AND APPLICATIONS 6934 1% 2% 18

Author Key Words


chi_square_rank term chi_square shrOfCwithTerm shrOfTermInClass termInClass LCSH search Wikipedia search
1 THROUGH SILICON VIA TSV 3256649 14% 73% 187 Search THROUGH+SILICON+VIA+TSV Search THROUGH+SILICON+VIA+TSV
2 THROUGH SILICON VIA 1618863 9% 59% 115 Search THROUGH+SILICON+VIA Search THROUGH+SILICON+VIA
3 3D IC 1404334 8% 56% 106 Search 3D+IC Search 3D+IC
4 3 D INTEGRATION 987636 9% 37% 113 Search 3+D+INTEGRATION Search 3+D+INTEGRATION
5 THROUGH SILICON VIAS TSVS 970783 4% 74% 55 Search THROUGH+SILICON+VIAS+TSVS Search THROUGH+SILICON+VIAS+TSVS
6 TSV 786541 6% 43% 77 Search TSV Search TSV
7 KEEP OUT ZONE KOZ 356232 1% 100% 15 Search KEEP+OUT+ZONE+KOZ Search KEEP+OUT+ZONE+KOZ
8 3 D INTEGRATED CIRCUITS 337319 2% 57% 25 Search 3+D+INTEGRATED+CIRCUITS Search 3+D+INTEGRATED+CIRCUITS
9 MICROBUMP 281624 2% 46% 26 Search MICROBUMP Search MICROBUMP
10 3 D PACKAGING 238129 1% 53% 19 Search 3+D+PACKAGING Search 3+D+PACKAGING

Core articles
The table includes core articles in the class. The following variables is taken into account for the relevance score of an article in a cluster c:
(1) Number of references referring to publications in the class.
(2) Share of total number of active references referring to publications in the class.
(3) Age of the article. New articles get higher score than old articles.
(4) Citation rate, normalized to year.

Classes with closest relation at Level 1


rank cluster_id2 link
1 29849 COMPLIANT INTERCONNECTS//DIE SHIFT//OFF CHIP
2 14701 COMPACT THERMAL MODEL//DYNAMIC THERMAL MANAGEMENT//DYNAMIC THERMAL MANAGEMENT DTM
3 4923 WAFER BONDING//ANODIC BONDING//DIRECT BONDING
4 17103 FLOORPLANNING//PHYSICAL DESIGN//PLACEMENT
5 4876 COPPER ELECTRODEPOSITION//SELF ANNEALING//COPPER ELECTROPLATING
6 18826 UNDERFILL//FLIP CHIP//UNDERFILL FLOW
7 32938 PROBE CARD//MEMS PROBE CARD//POROUS SILICON MICROMACHINING
8 27922 CHIP STRENGTH//DIE STRENGTH//WAFER DICING
9 16759 SUBSTRATE NOISE//SUBSTRATE COUPLING//POWER SUPPLY NOISE
10 6833 BUFFER INSERTION//INTERCONNECT//GATE SIZING

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