Class information for:
Level 1: UNDERFILL//FLIP CHIP//UNDERFILL FLOW

Basic class information
Bar chart of Publication_year

Last years might be incomplete

Hierarchy of classes
The table includes all classes above and classes immediately below the current class.


Cluster id Level Cluster label #P
1 4 PHYSICS, CONDENSED MATTER//PHYSICS, APPLIED//MATERIALS SCIENCE, MULTIDISCIPLINARY 2188495
396 3       LEAD FREE SOLDER//SOLDER//ELECTROMIGRATION 32184
535 2             LEAD FREE SOLDER//SOLDER//SOLDERING & SURFACE MOUNT TECHNOLOGY 15297
18826 1                   UNDERFILL//FLIP CHIP//UNDERFILL FLOW 558

Terms with highest relevance score


rank Category termType chi_square shrOfCwithTerm shrOfTermInClass termInClass
1 UNDERFILL authKW 2662908 16% 53% 89
2 FLIP CHIP authKW 666594 16% 13% 88
3 UNDERFILL FLOW authKW 525700 2% 85% 11
4 NO FLOW UNDERFILL authKW 478417 2% 71% 12
5 BUMP PITCH authKW 395364 1% 100% 7
6 CASTRO MACOSKO MODEL authKW 282403 1% 100% 5
7 FLIP CHIP PACKAGE authKW 280726 2% 38% 13
8 PLASTIC ENCAPSULATION authKW 225922 1% 100% 4
9 WAVE SOLDERING authKW 207941 2% 41% 9
10 JOURNAL OF ELECTRONIC PACKAGING journal 206164 12% 5% 68

Web of Science journal categories


chi_square_rank Category chi_square shrOfCwithTerm shrOfTermInClass termInClass
1 Engineering, Manufacturing 5678 18% 0% 99
2 Engineering, Electrical & Electronic 3737 48% 0% 269
3 Materials Science, Multidisciplinary 1513 38% 0% 211
4 Nanoscience & Nanotechnology 1263 17% 0% 95
5 Engineering, Mechanical 1053 15% 0% 82
6 Physics, Applied 474 21% 0% 117
7 Mechanics 341 9% 0% 53
8 Thermodynamics 213 6% 0% 31
9 Materials Science, Composites 161 3% 0% 15
10 Metallurgy & Metallurgical Engineering 106 6% 0% 31

Address terms


chi_square_rank term chi_square shrOfCwithTerm shrOfTermInClass termInClass
1 PHOTOMECH 119598 1% 35% 6
2 BUSINESS TEAM 112961 0% 100% 2
3 LOCTITE ELECT MAT 112961 0% 100% 2
4 MAT EQUIPMENT ENGN 112961 0% 100% 2
5 NEPZ ZONE 112961 0% 100% 2
6 ELECT ASSEMBLY PACKAGING 100852 1% 36% 5
7 ADV CIRCUIT INTERCONNECT RD 75306 0% 67% 2
8 DAIMLERCHRYSLER SIM 75306 0% 67% 2
9 ADV MICROSYSTEMS PACKAGING 56481 0% 100% 1
10 ASSEMBLY RELIABIL 56481 0% 100% 1

Journals


chi_square_rank term chi_square shrOfCwithTerm shrOfTermInClass termInClass
1 JOURNAL OF ELECTRONIC PACKAGING 206164 12% 5% 68
2 IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING 96368 5% 7% 26
3 IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES 90807 8% 4% 43
4 IEEE TRANSACTIONS ON ADVANCED PACKAGING 50172 5% 3% 30
5 SOLDERING & SURFACE MOUNT TECHNOLOGY 44490 3% 4% 18
6 MICROELECTRONICS RELIABILITY 40862 13% 1% 73
7 IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY 22703 4% 2% 24
8 IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART A 17592 2% 3% 11
9 IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING 7212 1% 2% 7
10 JOURNAL OF ELECTRONICS MANUFACTURING 3361 1% 2% 3

Author Key Words


chi_square_rank term chi_square shrOfCwithTerm shrOfTermInClass termInClass LCSH search Wikipedia search
1 UNDERFILL 2662908 16% 53% 89 Search UNDERFILL Search UNDERFILL
2 FLIP CHIP 666594 16% 13% 88 Search FLIP+CHIP Search FLIP+CHIP
3 UNDERFILL FLOW 525700 2% 85% 11 Search UNDERFILL+FLOW Search UNDERFILL+FLOW
4 NO FLOW UNDERFILL 478417 2% 71% 12 Search NO+FLOW+UNDERFILL Search NO+FLOW+UNDERFILL
5 BUMP PITCH 395364 1% 100% 7 Search BUMP+PITCH Search BUMP+PITCH
6 CASTRO MACOSKO MODEL 282403 1% 100% 5 Search CASTRO+MACOSKO+MODEL Search CASTRO+MACOSKO+MODEL
7 FLIP CHIP PACKAGE 280726 2% 38% 13 Search FLIP+CHIP+PACKAGE Search FLIP+CHIP+PACKAGE
8 PLASTIC ENCAPSULATION 225922 1% 100% 4 Search PLASTIC+ENCAPSULATION Search PLASTIC+ENCAPSULATION
9 WAVE SOLDERING 207941 2% 41% 9 Search WAVE+SOLDERING Search WAVE+SOLDERING
10 UNDERFILL ENCAPSULATION 180736 1% 80% 4 Search UNDERFILL+ENCAPSULATION Search UNDERFILL+ENCAPSULATION

Core articles
The table includes core articles in the class. The following variables is taken into account for the relevance score of an article in a cluster c:
(1) Number of references referring to publications in the class.
(2) Share of total number of active references referring to publications in the class.
(3) Age of the article. New articles get higher score than old articles.
(4) Citation rate, normalized to year.

Classes with closest relation at Level 1


rank cluster_id2 link
1 20699 POPCORN CRACKING//LEADFRAME//FAILURE PATH
2 29849 COMPLIANT INTERCONNECTS//DIE SHIFT//OFF CHIP
3 19399 ADV DESIGN MFG RELIABIL MEMS NEMS ODES//BOARD LEVEL DROP TEST//MAT MICROSTRUCT INTEGR
4 16702 MOIRE INTERFEROMETRY//ELECTRON BEAM MOIRE//SHADOW MOIRE
5 11481 CONDUCTIVE ADHESIVE//ANISOTROPIC CONDUCTIVE FILM ACF//ANISOTROPIC CONDUCTIVE FILM
6 23683 SOLDER PASTE//VAPOUR PHASE SOLDERING//STENCIL PRINTING
7 21049 INTERFACIAL SHEARS//NON LOCAL STRESS CURVATURE RELATIONS//NON UNIFORM MISFIT STRAIN
8 27661 PLASTIC ENCAPSULATED MICROCIRCUIT//DORMANT STORAGE//NONHERMETIC
9 12046 WIRE BONDING//THERMOSONIC WIRE BONDING//ULTRASONIC WIRE BONDING
10 35135 MAHALANOBIS TAGUCHI SYSTEM//GOMPERTZ BINARY PARTICLE SWARM OPTIMIZATION//VARIABLE DETECTION

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