Class information for:
Level 1: ADV DESIGN MFG RELIABIL MEMS NEMS ODES//BOARD LEVEL DROP TEST//MAT MICROSTRUCT INTEGR

Basic class information
Bar chart of Publication_year

Last years might be incomplete

Hierarchy of classes
The table includes all classes above and classes immediately below the current class.


Cluster id Level Cluster label #P
1 4 PHYSICS, CONDENSED MATTER//PHYSICS, APPLIED//MATERIALS SCIENCE, MULTIDISCIPLINARY 2188495
396 3       LEAD FREE SOLDER//SOLDER//ELECTROMIGRATION 32184
535 2             LEAD FREE SOLDER//SOLDER//SOLDERING & SURFACE MOUNT TECHNOLOGY 15297
19399 1                   ADV DESIGN MFG RELIABIL MEMS NEMS ODES//BOARD LEVEL DROP TEST//MAT MICROSTRUCT INTEGR 531

Terms with highest relevance score


rank Category termType chi_square shrOfCwithTerm shrOfTermInClass termInClass
1 ADV DESIGN MFG RELIABIL MEMS NEMS ODES address 377973 2% 58% 11
2 BOARD LEVEL DROP TEST authKW 345320 2% 73% 8
3 MAT MICROSTRUCT INTEGR address 329728 2% 56% 10
4 ST S RELIABIL address 298267 3% 36% 14
5 DROP TEST authKW 259120 4% 21% 21
6 PORTABLE ELECTRONIC PRODUCTS authKW 237410 1% 100% 4
7 SPAN SCALE DESIGN MFG address 211971 1% 71% 5
8 ADV DESIGN MFG RELIABIL MEMS NEMS address 185473 1% 63% 5
9 JOURNAL OF ELECTRONIC PACKAGING journal 180096 12% 5% 62
10 SOLDER JOINT authKW 166955 6% 9% 33

Web of Science journal categories


chi_square_rank Category chi_square shrOfCwithTerm shrOfTermInClass termInClass
1 Engineering, Electrical & Electronic 4142 52% 0% 275
2 Nanoscience & Nanotechnology 2428 24% 0% 126
3 Engineering, Mechanical 2197 21% 0% 113
4 Engineering, Manufacturing 1476 9% 0% 50
5 Physics, Applied 840 27% 0% 145
6 Materials Science, Multidisciplinary 820 30% 0% 157
7 Mechanics 738 14% 0% 73
8 Materials Science, Characterization, Testing 398 4% 0% 19
9 Engineering, General 192 5% 0% 27
10 Materials Science, Composites 171 3% 0% 15

Address terms


chi_square_rank term chi_square shrOfCwithTerm shrOfTermInClass termInClass
1 ADV DESIGN MFG RELIABIL MEMS NEMS ODES 377973 2% 58% 11
2 MAT MICROSTRUCT INTEGR 329728 2% 56% 10
3 ST S RELIABIL 298267 3% 36% 14
4 SPAN SCALE DESIGN MFG 211971 1% 71% 5
5 ADV DESIGN MFG RELIABIL MEMS NEMS 185473 1% 63% 5
6 ADV DESIGN MFG RELIABIL 133542 1% 75% 3
7 NSF ADV VEHICLE EXTREME ENVIRONM ELECT CAVE 133542 1% 75% 3
8 CHINA GOUDIAN 118705 0% 100% 2
9 CHINA LONGYUAN POWER GRP CORP LTD 118705 0% 100% 2
10 NSF ADV VEHICLE EXTREME ENVIRONM ELECT 106832 1% 60% 3

Journals


chi_square_rank term chi_square shrOfCwithTerm shrOfTermInClass termInClass
1 JOURNAL OF ELECTRONIC PACKAGING 180096 12% 5% 62
2 MICROELECTRONICS RELIABILITY 85583 19% 1% 103
3 IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES 37604 5% 2% 27
4 IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY 18262 4% 1% 21
5 IEEE TRANSACTIONS ON ADVANCED PACKAGING 8422 2% 1% 12
6 MICROELECTRONICS INTERNATIONAL 8179 1% 2% 7
7 IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING 7330 1% 2% 7
8 CIRCUIT WORLD 6797 1% 2% 5
9 SOLDERING & SURFACE MOUNT TECHNOLOGY 5187 1% 1% 6
10 JOURNAL OF THE IES 4562 0% 4% 2

Author Key Words


chi_square_rank term chi_square shrOfCwithTerm shrOfTermInClass termInClass LCSH search Wikipedia search
1 BOARD LEVEL DROP TEST 345320 2% 73% 8 Search BOARD+LEVEL+DROP+TEST Search BOARD+LEVEL+DROP+TEST
2 DROP TEST 259120 4% 21% 21 Search DROP+TEST Search DROP+TEST
3 PORTABLE ELECTRONIC PRODUCTS 237410 1% 100% 4 Search PORTABLE+ELECTRONIC+PRODUCTS Search PORTABLE+ELECTRONIC+PRODUCTS
4 SOLDER JOINT 166955 6% 9% 33 Search SOLDER+JOINT Search SOLDER+JOINT
5 JEDEC 158271 1% 67% 4 Search JEDEC Search JEDEC
6 BOARD LEVEL RELIABILITY 135660 1% 57% 4 Search BOARD+LEVEL+RELIABILITY Search BOARD+LEVEL+RELIABILITY
7 PACKAGE ON PACKAGE POP 135660 1% 57% 4 Search PACKAGE+ON+PACKAGE+POP Search PACKAGE+ON+PACKAGE+POP
8 EARLY STAGE DESIGN TOOL 133542 1% 75% 3 Search EARLY+STAGE+DESIGN+TOOL Search EARLY+STAGE+DESIGN+TOOL
9 ANISOTROPIC SHELL MODEL 118705 0% 100% 2 Search ANISOTROPIC+SHELL+MODEL Search ANISOTROPIC+SHELL+MODEL
10 COUPLED MD FE MODEL 118705 0% 100% 2 Search COUPLED+MD+FE+MODEL Search COUPLED+MD+FE+MODEL

Core articles
The table includes core articles in the class. The following variables is taken into account for the relevance score of an article in a cluster c:
(1) Number of references referring to publications in the class.
(2) Share of total number of active references referring to publications in the class.
(3) Age of the article. New articles get higher score than old articles.
(4) Citation rate, normalized to year.

Classes with closest relation at Level 1


rank cluster_id2 link
1 29849 COMPLIANT INTERCONNECTS//DIE SHIFT//OFF CHIP
2 18826 UNDERFILL//FLIP CHIP//UNDERFILL FLOW
3 16 LEAD FREE SOLDER//SOLDER//PB FREE SOLDER
4 29532 CUSHION CURVES//PRODUCT TRANSPORT SYSTEM//GR H COMMUN ENGN
5 22749 SECT PROD PROC QUAL//MECHANICAL RELIABILITY PREDICTION//MATURITY INDEX ON RELIABILITY MIR
6 29547 KKU SEAGATE COOPERAT//LASER SOLDERING//INNER LEAD BONDING ILB
7 21049 INTERFACIAL SHEARS//NON LOCAL STRESS CURVATURE RELATIONS//NON UNIFORM MISFIT STRAIN
8 23683 SOLDER PASTE//VAPOUR PHASE SOLDERING//STENCIL PRINTING
9 16702 MOIRE INTERFEROMETRY//ELECTRON BEAM MOIRE//SHADOW MOIRE
10 33744 ENDICOTT ELECT PACKAGING//PLATED THROUGH HOLE//AUTOMOTIVE TIRE

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