Class information for: |
Basic class information |
Hierarchy of classes |
The table includes all classes above and classes immediately below the current class. |
| Cluster id | Level | Cluster label | #P |
|---|---|---|---|
| 1 | 4 | PHYSICS, CONDENSED MATTER//PHYSICS, APPLIED//MATERIALS SCIENCE, MULTIDISCIPLINARY | 2188495 |
| 396 | 3 | LEAD FREE SOLDER//SOLDER//ELECTROMIGRATION | 32184 |
| 535 | 2 | LEAD FREE SOLDER//SOLDER//SOLDERING & SURFACE MOUNT TECHNOLOGY | 15297 |
| 16 | 1 | LEAD FREE SOLDER//SOLDER//PB FREE SOLDER | 5500 |
Terms with highest relevance score |
| rank | Category | termType | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
|---|---|---|---|---|---|---|
| 1 | LEAD FREE SOLDER | authKW | 3776017 | 16% | 75% | 879 |
| 2 | SOLDER | authKW | 1552650 | 10% | 48% | 563 |
| 3 | PB FREE SOLDER | authKW | 1013832 | 4% | 75% | 235 |
| 4 | SOLDER JOINT | authKW | 776050 | 4% | 59% | 229 |
| 5 | JOURNAL OF ELECTRONIC MATERIALS | journal | 639437 | 19% | 10% | 1070 |
| 6 | INTERMETALLIC COMPOUNDS | authKW | 542648 | 11% | 16% | 590 |
| 7 | INTERFACIAL REACTION | authKW | 528361 | 5% | 31% | 300 |
| 8 | SN AG CU | authKW | 504459 | 2% | 82% | 107 |
| 9 | SOLDERING & SURFACE MOUNT TECHNOLOGY | journal | 393180 | 3% | 41% | 168 |
| 10 | INTERMETALLIC COMPOUND IMC | authKW | 364860 | 1% | 79% | 81 |
Web of Science journal categories |
| chi_square_rank | Category | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
|---|---|---|---|---|---|
| 1 | Materials Science, Multidisciplinary | 67568 | 76% | 0% | 4168 |
| 2 | Metallurgy & Metallurgical Engineering | 51552 | 33% | 1% | 1792 |
| 3 | Engineering, Electrical & Electronic | 27917 | 42% | 0% | 2330 |
| 4 | Physics, Applied | 22260 | 42% | 0% | 2285 |
| 5 | Engineering, Manufacturing | 6887 | 6% | 0% | 353 |
| 6 | Nanoscience & Nanotechnology | 5517 | 12% | 0% | 644 |
| 7 | Physics, Condensed Matter | 1012 | 9% | 0% | 505 |
| 8 | Mining & Mineral Processing | 826 | 1% | 0% | 76 |
| 9 | Engineering, Mechanical | 568 | 4% | 0% | 231 |
| 10 | Chemistry, Physical | 430 | 9% | 0% | 506 |
Address terms |
| chi_square_rank | term | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
|---|---|---|---|---|---|
| 1 | ELECT PACKAGING MAT | 168915 | 1% | 72% | 41 |
| 2 | COMPONENT QUAL TECHNOL GRP | 120544 | 0% | 96% | 22 |
| 3 | ELECT PACKAGING | 105597 | 1% | 33% | 56 |
| 4 | MICROJOINING | 83499 | 1% | 42% | 35 |
| 5 | MAT SCI ENGN | 58818 | 31% | 1% | 1729 |
| 6 | 14 | 45407 | 1% | 27% | 29 |
| 7 | ELECT PROD TECHNOL | 35968 | 0% | 37% | 17 |
| 8 | TIANJIN ADV JOINTING TECHNOL | 34817 | 0% | 41% | 15 |
| 9 | KEY STATE NEW DISPLAYS SYST INTEGRAT | 34370 | 0% | 100% | 6 |
| 10 | STATE ADV BRAZING FILLER MET TECHNOL | 34007 | 0% | 42% | 14 |
Journals |
| chi_square_rank | term | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
|---|---|---|---|---|---|
| 1 | JOURNAL OF ELECTRONIC MATERIALS | 639437 | 19% | 10% | 1070 |
| 2 | SOLDERING & SURFACE MOUNT TECHNOLOGY | 393180 | 3% | 41% | 168 |
| 3 | JOURNAL OF ELECTRONIC PACKAGING | 109843 | 3% | 12% | 156 |
| 4 | JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS | 79784 | 7% | 4% | 366 |
| 5 | MICROELECTRONICS RELIABILITY | 69200 | 5% | 4% | 299 |
| 6 | IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES | 30187 | 1% | 7% | 78 |
| 7 | JOURNAL OF ALLOYS AND COMPOUNDS | 19983 | 7% | 1% | 390 |
| 8 | IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING | 18682 | 1% | 9% | 36 |
| 9 | JOURNAL OF MATERIALS RESEARCH | 17389 | 4% | 2% | 193 |
| 10 | MATERIALS TRANSACTIONS | 16698 | 3% | 2% | 147 |
Author Key Words |
| chi_square_rank | term | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass | LCSH search | Wikipedia search |
|---|---|---|---|---|---|---|---|
| 1 | LEAD FREE SOLDER | 3776017 | 16% | 75% | 879 | Search LEAD+FREE+SOLDER | Search LEAD+FREE+SOLDER |
| 2 | SOLDER | 1552650 | 10% | 48% | 563 | Search SOLDER | Search SOLDER |
| 3 | PB FREE SOLDER | 1013832 | 4% | 75% | 235 | Search PB+FREE+SOLDER | Search PB+FREE+SOLDER |
| 4 | SOLDER JOINT | 776050 | 4% | 59% | 229 | Search SOLDER+JOINT | Search SOLDER+JOINT |
| 5 | INTERMETALLIC COMPOUNDS | 542648 | 11% | 16% | 590 | Search INTERMETALLIC+COMPOUNDS | Search INTERMETALLIC+COMPOUNDS |
| 6 | INTERFACIAL REACTION | 528361 | 5% | 31% | 300 | Search INTERFACIAL+REACTION | Search INTERFACIAL+REACTION |
| 7 | SN AG CU | 504459 | 2% | 82% | 107 | Search SN+AG+CU | Search SN+AG+CU |
| 8 | INTERMETALLIC COMPOUND IMC | 364860 | 1% | 79% | 81 | Search INTERMETALLIC+COMPOUND+IMC | Search INTERMETALLIC+COMPOUND+IMC |
| 9 | COMPOSITE SOLDER | 310188 | 1% | 95% | 57 | Search COMPOSITE+SOLDER | Search COMPOSITE+SOLDER |
| 10 | ELECTROMIGRATION | 302299 | 4% | 22% | 245 | Search ELECTROMIGRATION | Search ELECTROMIGRATION |
Core articles |
The table includes core articles in the class. The following variables is taken into account for the relevance score of an article in a cluster c: (1) Number of references referring to publications in the class. (2) Share of total number of active references referring to publications in the class. (3) Age of the article. New articles get higher score than old articles. (4) Citation rate, normalized to year. |
Classes with closest relation at Level 1 |