Class information for:
Level 2: LEAD FREE SOLDER//SOLDER//SOLDERING & SURFACE MOUNT TECHNOLOGY

Basic class information
Bar chart of Publication_year

Last years might be incomplete

Hierarchy of classes
The table includes all classes above and classes immediately below the current class.


Cluster id Level Cluster label #P
1 4 PHYSICS, CONDENSED MATTER//PHYSICS, APPLIED//MATERIALS SCIENCE, MULTIDISCIPLINARY 2188495
396 3       LEAD FREE SOLDER//SOLDER//ELECTROMIGRATION 32184
535 2             LEAD FREE SOLDER//SOLDER//SOLDERING & SURFACE MOUNT TECHNOLOGY 15297
16 1                   LEAD FREE SOLDER//SOLDER//PB FREE SOLDER 5500
8017 1                   THROUGH SILICON VIA TSV//THROUGH SILICON VIA//3D IC 1327
11441 1                   DIE ATTACH//HIGH TEMPERATURE SOLDER//NANOSILVER PASTE 1009
11481 1                   CONDUCTIVE ADHESIVE//ANISOTROPIC CONDUCTIVE FILM ACF//ANISOTROPIC CONDUCTIVE FILM 1006
12046 1                   WIRE BONDING//THERMOSONIC WIRE BONDING//ULTRASONIC WIRE BONDING 963
16702 1                   MOIRE INTERFEROMETRY//ELECTRON BEAM MOIRE//SHADOW MOIRE 665
18826 1                   UNDERFILL//FLIP CHIP//UNDERFILL FLOW 558
19399 1                   ADV DESIGN MFG RELIABIL MEMS NEMS ODES//BOARD LEVEL DROP TEST//MAT MICROSTRUCT INTEGR 531
19977 1                   FLUIDIC SELF ASSEMBLY//FLUIDIC SELF ASSEMBLY FSA//SELF ALIGNMENT 503
20699 1                   POPCORN CRACKING//LEADFRAME//FAILURE PATH 473
21049 1                   INTERFACIAL SHEARS//NON LOCAL STRESS CURVATURE RELATIONS//NON UNIFORM MISFIT STRAIN 458
21084 1                   TIN WHISKERS//SN WHISKER//WHISKER GROWTH 457
23683 1                   SOLDER PASTE//VAPOUR PHASE SOLDERING//STENCIL PRINTING 361
26160 1                   ELECTROCHEMICAL MIGRATION//ELECTROCHEMICAL MIGRATION ECM//SURFACE INSULATION RESISTANCE 283
27661 1                   PLASTIC ENCAPSULATED MICROCIRCUIT//DORMANT STORAGE//NONHERMETIC 244
27922 1                   CHIP STRENGTH//DIE STRENGTH//WAFER DICING 238
29547 1                   KKU SEAGATE COOPERAT//LASER SOLDERING//INNER LEAD BONDING ILB 202
29849 1                   COMPLIANT INTERCONNECTS//DIE SHIFT//OFF CHIP 195
30739 1                   ACOUSTIC MICRO IMAGING//DRIVING PATTERN SIMULATION//OPEN BUMPS 179
32938 1                   PROBE CARD//MEMS PROBE CARD//POROUS SILICON MICROMACHINING 145

Terms with highest relevance score


rank Category termType chi_square shrOfCwithTerm shrOfTermInClass termInClass
1 LEAD FREE SOLDER authKW 1638541 6% 82% 966
2 SOLDER authKW 995195 5% 64% 752
3 SOLDERING & SURFACE MOUNT TECHNOLOGY journal 589093 2% 83% 343
4 SOLDER JOINT authKW 517628 2% 81% 312
5 FLIP CHIP authKW 494223 3% 61% 397
6 JOURNAL OF ELECTRONIC PACKAGING journal 477004 4% 43% 542
7 PB FREE SOLDER authKW 442465 2% 83% 259
8 JOURNAL OF ELECTRONIC MATERIALS journal 432448 10% 14% 1470
9 IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY journal 307939 3% 32% 463
10 MICROELECTRONICS RELIABILITY journal 301531 7% 14% 1040

Web of Science journal categories


chi_square_rank Category chi_square shrOfCwithTerm shrOfTermInClass termInClass
1 Materials Science, Multidisciplinary 92295 54% 1% 8315
2 Engineering, Electrical & Electronic 86798 45% 1% 6825
3 Engineering, Manufacturing 56827 11% 2% 1658
4 Physics, Applied 42429 35% 0% 5355
5 Metallurgy & Metallurgical Engineering 37435 17% 1% 2626
6 Nanoscience & Nanotechnology 24328 14% 1% 2211
7 Engineering, Mechanical 3785 6% 0% 911
8 Materials Science, Characterization, Testing 3402 2% 1% 309
9 Mechanics 2455 5% 0% 830
10 Computer Science, Hardware & Architecture 1742 2% 0% 336

Address terms


chi_square_rank term chi_square shrOfCwithTerm shrOfTermInClass termInClass
1 MICROJOINING 134168 0% 88% 74
2 ELECT PACKAGING MAT 86690 0% 86% 49
3 ST S RELIABIL 68395 0% 92% 36
4 ELECT PACKAGING 66220 0% 44% 74
5 COMPONENT QUAL TECHNOL GRP 43313 0% 96% 22
6 MAT SCI ENGN 41522 16% 1% 2489
7 ELECT MFG ENGN GRP 40191 0% 78% 25
8 CALCE ELECT PROD SYST 34239 0% 33% 50
9 ADV MAT JOINING 31135 0% 32% 48
10 CALCE 28775 0% 33% 43

Journals


chi_square_rank term chi_square shrOfCwithTerm shrOfTermInClass termInClass
1 SOLDERING & SURFACE MOUNT TECHNOLOGY 589093 2% 83% 343
2 JOURNAL OF ELECTRONIC PACKAGING 477004 4% 43% 542
3 JOURNAL OF ELECTRONIC MATERIALS 432448 10% 14% 1470
4 IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY 307939 3% 32% 463
5 MICROELECTRONICS RELIABILITY 301531 7% 14% 1040
6 IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES 259537 2% 33% 381
7 IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING 187446 1% 48% 190
8 IEEE TRANSACTIONS ON ADVANCED PACKAGING 115817 2% 24% 239
9 IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY 90684 2% 19% 239
10 IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING 66059 1% 29% 111

Author Key Words


chi_square_rank term chi_square shrOfCwithTerm shrOfTermInClass termInClass LCSH search Wikipedia search
1 LEAD FREE SOLDER 1638541 6% 82% 966 Search LEAD+FREE+SOLDER Search LEAD+FREE+SOLDER
2 SOLDER 995195 5% 64% 752 Search SOLDER Search SOLDER
3 SOLDER JOINT 517628 2% 81% 312 Search SOLDER+JOINT Search SOLDER+JOINT
4 FLIP CHIP 494223 3% 61% 397 Search FLIP+CHIP Search FLIP+CHIP
5 PB FREE SOLDER 442465 2% 83% 259 Search PB+FREE+SOLDER Search PB+FREE+SOLDER
6 THROUGH SILICON VIA TSV 291302 1% 75% 190 Search THROUGH+SILICON+VIA+TSV Search THROUGH+SILICON+VIA+TSV
7 INTERMETALLIC COMPOUNDS 273056 5% 19% 699 Search INTERMETALLIC+COMPOUNDS Search INTERMETALLIC+COMPOUNDS
8 INTERFACIAL REACTION 229466 2% 34% 330 Search INTERFACIAL+REACTION Search INTERFACIAL+REACTION
9 SN AG CU 216722 1% 90% 117 Search SN+AG+CU Search SN+AG+CU
10 UNDERFILL 210201 1% 78% 131 Search UNDERFILL Search UNDERFILL

Core articles
The table includes core articles in the class. The following variables is taken into account for the relevance score of an article in a cluster c:
(1) Number of references referring to publications in the class.
(2) Share of total number of active references referring to publications in the class.
(3) Age of the article. New articles get higher score than old articles.
(4) Citation rate, normalized to year.

Classes with closest relation at Level 2


rank cluster_id2 link
1 3171 WAFER BONDING//ANODIC BONDING//DIRECT BONDING
2 3099 ELECTROMIGRATION//OPTICAL MOUSE//ELECTROMIGRATION EM
3 1718 IGBT//LDMOS//POWER MOSFET
4 3112 DIGITAL IMAGE CORRELATION//FULL FIELD MEASUREMENTS//VIRTUAL FIELDS METHOD
5 2469 DIFFUS SOLIDS GRP//ATOMIC MOBILITY//DEFECT AND DIFFUSION FORUM/JOURNAL
6 2186 SILVER NANOWIRES//TRANSPARENT ELECTRODE//BLISTER TEST
7 3496 ARC EROSION//ELECTRICAL CONTACTS//IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY
8 592 ELECTRODEPOSITION//PLATING AND SURFACE FINISHING//TRANSACTIONS OF THE INSTITUTE OF METAL FINISHING
9 3307 SHANDITE//AFLOW//HALF ANTIPEROVSKITES
10 1370 NANOINDENTATION//SMALL PUNCH TEST//INDENTATION

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