Class information for:
Level 2: ELECTROMIGRATION//OPTICAL MOUSE//ELECTROMIGRATION EM

Basic class information
Bar chart of Publication_year

Last years might be incomplete

Hierarchy of classes
The table includes all classes above and classes immediately below the current class.


Cluster id Level Cluster label #P
1 4 PHYSICS, CONDENSED MATTER//PHYSICS, APPLIED//MATERIALS SCIENCE, MULTIDISCIPLINARY 2188495
396 3       LEAD FREE SOLDER//SOLDER//ELECTROMIGRATION 32184
3099 2             ELECTROMIGRATION//OPTICAL MOUSE//ELECTROMIGRATION EM 2500
4287 1                   ELECTROMIGRATION//ELECTROMIGRATION EM//PRC MER 1846
22409 1                   HILLOCKS//SUR E EVALUAT//ARRAY PROC TECHNOL GRP 406
33515 1                   AGE FROM 0 TO 175 DAYS//ANTHOSTEMA AULNYANUM//ASP FLOODS 137
35530 1                   OPTICAL MOUSE//OPTICAL MOUSE SENSOR//PG PL ELECT 111

Terms with highest relevance score


rank Category termType chi_square shrOfCwithTerm shrOfTermInClass termInClass
1 ELECTROMIGRATION authKW 1222561 13% 29% 332
2 OPTICAL MOUSE authKW 185629 1% 82% 18
3 ELECTROMIGRATION EM authKW 167045 1% 49% 27
4 PRC MER address 101674 0% 73% 11
5 STRESS VOIDING authKW 89633 0% 89% 8
6 HILLOCKS authKW 86644 1% 25% 28
7 STRESS INDUCED VOIDING authKW 85079 0% 75% 9
8 CU INTERCONNECT authKW 83495 1% 25% 27
9 STRESS MIGRATION authKW 73442 1% 45% 13
10 STRESS MIGRATION SM authKW 63025 0% 100% 5

Web of Science journal categories


chi_square_rank Category chi_square shrOfCwithTerm shrOfTermInClass termInClass
1 Physics, Applied 25415 64% 0% 1594
2 Materials Science, Coatings & Films 6995 12% 0% 309
3 Engineering, Electrical & Electronic 6599 31% 0% 785
4 Nanoscience & Nanotechnology 4819 16% 0% 395
5 Materials Science, Multidisciplinary 2709 25% 0% 636
6 Physics, Condensed Matter 1910 16% 0% 404
7 Metallurgy & Metallurgical Engineering 557 6% 0% 148
8 Computer Science, Hardware & Architecture 218 2% 0% 49
9 Electrochemistry 108 2% 0% 61
10 Instruments & Instrumentation 91 3% 0% 70

Address terms


chi_square_rank term chi_square shrOfCwithTerm shrOfTermInClass termInClass
1 PRC MER 101674 0% 73% 11
2 SUR E EVALUAT 50420 0% 100% 4
3 INTERCONNECT PACKAGING 44361 1% 27% 13
4 EE PHYS ELECT 40334 0% 80% 4
5 ADV PROC DEV PROJECT TEAM 37815 0% 100% 3
6 ARRAY PROC TECHNOL GRP 37815 0% 100% 3
7 PG PL ELECT 37815 0% 100% 3
8 INTERCONNECT PACKAGING GRP 33610 0% 67% 4
9 MINIST EDUC BAND G SEMICOND MAT DEVICES 33610 0% 67% 4
10 CORP DEV ENGN 25210 0% 100% 2

Journals


chi_square_rank term chi_square shrOfCwithTerm shrOfTermInClass termInClass
1 MICROELECTRONICS RELIABILITY 58414 7% 3% 185
2 IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY 22582 2% 4% 45
3 JOURNAL OF APPLIED PHYSICS 11363 13% 0% 315
4 THIN SOLID FILMS 8716 6% 0% 161
5 MICROELECTRONIC ENGINEERING 7479 3% 1% 79
6 SOLID STATE TECHNOLOGY 4189 1% 1% 25
7 APPLIED PHYSICS LETTERS 4170 8% 0% 198
8 JOURNAL OF ELECTRONIC MATERIALS 3755 2% 1% 56
9 JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B 3670 3% 0% 71
10 JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A 2878 2% 0% 58

Author Key Words


chi_square_rank term chi_square shrOfCwithTerm shrOfTermInClass termInClass LCSH search Wikipedia search
1 ELECTROMIGRATION 1222561 13% 29% 332 Search ELECTROMIGRATION Search ELECTROMIGRATION
2 OPTICAL MOUSE 185629 1% 82% 18 Search OPTICAL+MOUSE Search OPTICAL+MOUSE
3 ELECTROMIGRATION EM 167045 1% 49% 27 Search ELECTROMIGRATION+EM Search ELECTROMIGRATION+EM
4 STRESS VOIDING 89633 0% 89% 8 Search STRESS+VOIDING Search STRESS+VOIDING
5 HILLOCKS 86644 1% 25% 28 Search HILLOCKS Search HILLOCKS
6 STRESS INDUCED VOIDING 85079 0% 75% 9 Search STRESS+INDUCED+VOIDING Search STRESS+INDUCED+VOIDING
7 CU INTERCONNECT 83495 1% 25% 27 Search CU+INTERCONNECT Search CU+INTERCONNECT
8 STRESS MIGRATION 73442 1% 45% 13 Search STRESS+MIGRATION Search STRESS+MIGRATION
9 STRESS MIGRATION SM 63025 0% 100% 5 Search STRESS+MIGRATION+SM Search STRESS+MIGRATION+SM
10 INTERCONNECT 62448 3% 6% 86 Search INTERCONNECT Search INTERCONNECT

Core articles
The table includes core articles in the class. The following variables is taken into account for the relevance score of an article in a cluster c:
(1) Number of references referring to publications in the class.
(2) Share of total number of active references referring to publications in the class.
(3) Age of the article. New articles get higher score than old articles.
(4) Citation rate, normalized to year.

Classes with closest relation at Level 2


rank cluster_id2 link
1 1011 ATOMIC LAYER DEPOSITION//DIFFUSION BARRIER//CU METALLIZATION
2 535 LEAD FREE SOLDER//SOLDER//SOLDERING & SURFACE MOUNT TECHNOLOGY
3 2634 FIZIKA NIZKIKH TEMPERATUR//JOURNAL OF PHYSICS F-METAL PHYSICS//ULTRAHIGH PURITY ALUMINUM
4 1393 PLASMA POLYMERIZATION//LOW K//PLASMA PROCESSES AND POLYMERS
5 2467 HIPIMS//PNCA//HPPMS
6 592 ELECTRODEPOSITION//PLATING AND SURFACE FINISHING//TRANSACTIONS OF THE INSTITUTE OF METAL FINISHING
7 3658 MICROHOTPLATE//MICROHEATER//THIN FILM THERMOCOUPLES
8 276 JOURNAL OF MICROELECTROMECHANICAL SYSTEMS//MEMS//SENSORS AND ACTUATORS A-PHYSICAL
9 1521 SURFACE DIFFUSION//SURFACE INDUCED DISSOCIATION//LIQUID SUBSTRATE
10 1381 SELF ORGANIZED CRITICALITY//LOW FREQUENCY NOISE//PENNA MODEL

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