Class information for:
Level 1: ELECTROMIGRATION//ELECTROMIGRATION EM//PRC MER

Basic class information
Bar chart of Publication_year

Last years might be incomplete

Hierarchy of classes
The table includes all classes above and classes immediately below the current class.


Cluster id Level Cluster label #P
1 4 PHYSICS, CONDENSED MATTER//PHYSICS, APPLIED//MATERIALS SCIENCE, MULTIDISCIPLINARY 2188495
396 3       LEAD FREE SOLDER//SOLDER//ELECTROMIGRATION 32184
3099 2             ELECTROMIGRATION//OPTICAL MOUSE//ELECTROMIGRATION EM 2500
4287 1                   ELECTROMIGRATION//ELECTROMIGRATION EM//PRC MER 1846

Terms with highest relevance score


rank Category termType chi_square shrOfCwithTerm shrOfTermInClass termInClass
1 ELECTROMIGRATION authKW 1606414 18% 29% 327
2 ELECTROMIGRATION EM authKW 226245 1% 49% 27
3 PRC MER address 137702 1% 73% 11
4 STRESS VOIDING authKW 121394 0% 89% 8
5 STRESS INDUCED VOIDING authKW 115227 0% 75% 9
6 CU INTERCONNECT authKW 113095 1% 25% 27
7 STRESS MIGRATION SM authKW 85356 0% 100% 5
8 STRESS INDUCED MIGRATION authKW 78033 0% 57% 8
9 INTERCONNECT authKW 76935 4% 6% 82
10 MICROELECTRONICS RELIABILITY journal 76685 10% 2% 182

Web of Science journal categories


chi_square_rank Category chi_square shrOfCwithTerm shrOfTermInClass termInClass
1 Physics, Applied 21711 68% 0% 1261
2 Engineering, Electrical & Electronic 6187 35% 0% 646
3 Nanoscience & Nanotechnology 4848 18% 0% 337
4 Materials Science, Coatings & Films 2227 8% 0% 153
5 Materials Science, Multidisciplinary 1815 24% 0% 451
6 Physics, Condensed Matter 1102 15% 0% 269
7 Metallurgy & Metallurgical Engineering 400 6% 0% 108
8 Computer Science, Hardware & Architecture 281 2% 0% 46
9 Materials Science, Characterization, Testing 51 1% 0% 15
10 Electrochemistry 48 2% 0% 38

Address terms


chi_square_rank term chi_square shrOfCwithTerm shrOfTermInClass termInClass
1 PRC MER 137702 1% 73% 11
2 INTERCONNECT PACKAGING 60086 1% 27% 13
3 EE PHYS ELECT 54626 0% 80% 4
4 ADV PROC DEV PROJECT TEAM 51214 0% 100% 3
5 INTERCONNECT PACKAGING GRP 45521 0% 67% 4
6 MINIST EDUC BAND G SEMICOND MAT DEVICES 45521 0% 67% 4
7 PRCMER 34143 0% 100% 2
8 PROC MFG DEV 34143 0% 100% 2
9 STANDARD ANALOG BUSINESS LINE 34143 0% 100% 2
10 ADV DEVICE DEV 33096 0% 24% 8

Journals


chi_square_rank term chi_square shrOfCwithTerm shrOfTermInClass termInClass
1 MICROELECTRONICS RELIABILITY 76685 10% 2% 182
2 IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY 30615 2% 4% 45
3 JOURNAL OF APPLIED PHYSICS 13841 16% 0% 297
4 MICROELECTRONIC ENGINEERING 6871 4% 1% 65
5 APPLIED PHYSICS LETTERS 5024 10% 0% 185
6 JOURNAL OF ELECTRONIC MATERIALS 4411 3% 1% 52
7 THIN SOLID FILMS 3563 5% 0% 89
8 IEEE TRANSACTIONS ON ELECTRON DEVICES 2635 3% 0% 50
9 JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B 2168 3% 0% 47
10 MICROELECTRONICS AND RELIABILITY 1739 0% 1% 9

Author Key Words


chi_square_rank term chi_square shrOfCwithTerm shrOfTermInClass termInClass LCSH search Wikipedia search
1 ELECTROMIGRATION 1606414 18% 29% 327 Search ELECTROMIGRATION Search ELECTROMIGRATION
2 ELECTROMIGRATION EM 226245 1% 49% 27 Search ELECTROMIGRATION+EM Search ELECTROMIGRATION+EM
3 STRESS VOIDING 121394 0% 89% 8 Search STRESS+VOIDING Search STRESS+VOIDING
4 STRESS INDUCED VOIDING 115227 0% 75% 9 Search STRESS+INDUCED+VOIDING Search STRESS+INDUCED+VOIDING
5 CU INTERCONNECT 113095 1% 25% 27 Search CU+INTERCONNECT Search CU+INTERCONNECT
6 STRESS MIGRATION SM 85356 0% 100% 5 Search STRESS+MIGRATION+SM Search STRESS+MIGRATION+SM
7 STRESS INDUCED MIGRATION 78033 0% 57% 8 Search STRESS+INDUCED+MIGRATION Search STRESS+INDUCED+MIGRATION
8 INTERCONNECT 76935 4% 6% 82 Search INTERCONNECT Search INTERCONNECT
9 STRESS MIGRATION 71215 1% 38% 11 Search STRESS+MIGRATION Search STRESS+MIGRATION
10 COPPER INTERCONNECTS 68568 1% 27% 15 Search COPPER+INTERCONNECTS Search COPPER+INTERCONNECTS

Core articles
The table includes core articles in the class. The following variables is taken into account for the relevance score of an article in a cluster c:
(1) Number of references referring to publications in the class.
(2) Share of total number of active references referring to publications in the class.
(3) Age of the article. New articles get higher score than old articles.
(4) Citation rate, normalized to year.

Classes with closest relation at Level 1


rank cluster_id2 link
1 22409 HILLOCKS//SUR E EVALUAT//ARRAY PROC TECHNOL GRP
2 27585 ASARO TILLER GRINFELD INSTABILITY//ARBITRARY SHALLOW SURFACES//COMPOSITIONAL AND MORPHOLOGICAL INSTABILITY
3 18983 SELF FORMING BARRIER//CUMG ALLOY//CUTI ALLOY FILM
4 35530 OPTICAL MOUSE//OPTICAL MOUSE SENSOR//PG PL ELECT
5 23923 DIRECT FORCE//ATOMIC MIGRATIONS//METALS AND DILUTE ALLOYS
6 5443 BULGE TEST//STRIP BENDING TEST//SINGLE CRYSTAL SILICON
7 4876 COPPER ELECTRODEPOSITION//SELF ANNEALING//COPPER ELECTROPLATING
8 36332 AE TECHNOL//VISUAL ABNORMALITIES//ALUMINUM STRIPES
9 20311 LONGITUDINAL MICROSTRUCTURE//VERY NARROW COPPER WIRE//8 INCH WAFER
10 21319 NANOGAP ELECTRODES//NANOGAP//SURFACE CONDUCTION ELECTRON EMITTER

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