Class information for: |
Basic class information |
Hierarchy of classes |
The table includes all classes above and classes immediately below the current class. |
| Cluster id | Level | Cluster label | #P |
|---|---|---|---|
| 1 | 4 | PHYSICS, CONDENSED MATTER//PHYSICS, APPLIED//MATERIALS SCIENCE, MULTIDISCIPLINARY | 2188495 |
| 396 | 3 | LEAD FREE SOLDER//SOLDER//ELECTROMIGRATION | 32184 |
| 2634 | 2 | FIZIKA NIZKIKH TEMPERATUR//JOURNAL OF PHYSICS F-METAL PHYSICS//ULTRAHIGH PURITY ALUMINUM | 3742 |
| 20311 | 1 | LONGITUDINAL MICROSTRUCTURE//VERY NARROW COPPER WIRE//8 INCH WAFER | 488 |
Terms with highest relevance score |
| rank | Category | termType | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
|---|---|---|---|---|---|---|
| 1 | LONGITUDINAL MICROSTRUCTURE | authKW | 206663 | 1% | 80% | 4 |
| 2 | VERY NARROW COPPER WIRE | authKW | 193748 | 1% | 100% | 3 |
| 3 | 8 INCH WAFER | authKW | 129165 | 0% | 100% | 2 |
| 4 | ADDITIVE FREE PLATING | authKW | 129165 | 0% | 100% | 2 |
| 5 | BACK ETCH METHOD | authKW | 129165 | 0% | 100% | 2 |
| 6 | CALLENDAR VAN DUSEN | authKW | 129165 | 0% | 100% | 2 |
| 7 | ELECTRICAL RESISTIVITY OF METALLIC THIN FILMS | authKW | 129165 | 0% | 100% | 2 |
| 8 | GDSII LEVEL LAYOUTS | authKW | 129165 | 0% | 100% | 2 |
| 9 | HITACHI KYOWA ENGN LTD | address | 129165 | 0% | 100% | 2 |
| 10 | ROUGHNESS ACCESSIBILITY | authKW | 129165 | 0% | 100% | 2 |
Web of Science journal categories |
| chi_square_rank | Category | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
|---|---|---|---|---|---|
| 1 | Physics, Condensed Matter | 2612 | 39% | 0% | 189 |
| 2 | Physics, Applied | 2268 | 44% | 0% | 216 |
| 3 | Materials Science, Coatings & Films | 670 | 9% | 0% | 43 |
| 4 | Nanoscience & Nanotechnology | 468 | 11% | 0% | 56 |
| 5 | Materials Science, Multidisciplinary | 273 | 19% | 0% | 95 |
| 6 | Physics, Multidisciplinary | 177 | 10% | 0% | 50 |
| 7 | Engineering, Electrical & Electronic | 156 | 13% | 0% | 63 |
| 8 | Microscopy | 53 | 1% | 0% | 6 |
| 9 | Metallurgy & Metallurgical Engineering | 37 | 4% | 0% | 19 |
| 10 | Optics | 25 | 5% | 0% | 22 |
Address terms |
| chi_square_rank | term | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
|---|---|---|---|---|---|
| 1 | HITACHI KYOWA ENGN LTD | 129165 | 0% | 100% | 2 |
| 2 | SUR ES INTER ES MAT SOLIDES | 129165 | 0% | 100% | 2 |
| 3 | CIENCIAS CONSTRUCC | 114809 | 1% | 44% | 4 |
| 4 | AMSOTROPY TEXTURE MAT | 64583 | 0% | 100% | 1 |
| 5 | CEFEX | 64583 | 0% | 100% | 1 |
| 6 | CIENCIAS ELE ON | 64583 | 0% | 100% | 1 |
| 7 | COL MIGUEL HUEYOTLIPAN | 64583 | 0% | 100% | 1 |
| 8 | DRFMC NM SP2M | 64583 | 0% | 100% | 1 |
| 9 | ENGN IL 3055 | 64583 | 0% | 100% | 1 |
| 10 | FCCYOT | 64583 | 0% | 100% | 1 |
Journals |
| chi_square_rank | term | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
|---|---|---|---|---|---|
| 1 | MICROELECTRONIC ENGINEERING | 2225 | 4% | 0% | 19 |
| 2 | SURFACE REVIEW AND LETTERS | 1504 | 2% | 0% | 8 |
| 3 | PHYSICAL REVIEW B | 1499 | 13% | 0% | 64 |
| 4 | JOURNAL OF LOW TEMPERATURE PHYSICS | 1250 | 2% | 0% | 12 |
| 5 | MATERIALS SCIENCE-POLAND | 1153 | 1% | 0% | 5 |
| 6 | THIN SOLID FILMS | 1067 | 5% | 0% | 25 |
| 7 | JOURNAL OF APPLIED PHYSICS | 1060 | 9% | 0% | 43 |
| 8 | PHYSICAL REVIEW APPLIED | 690 | 1% | 0% | 3 |
| 9 | ECS ELECTROCHEMISTRY LETTERS | 676 | 0% | 1% | 2 |
| 10 | INTERNATIONAL JOURNAL OF CLOTHING SCIENCE AND TECHNOLOGY | 561 | 0% | 0% | 2 |
Author Key Words |
Core articles |
The table includes core articles in the class. The following variables is taken into account for the relevance score of an article in a cluster c: (1) Number of references referring to publications in the class. (2) Share of total number of active references referring to publications in the class. (3) Age of the article. New articles get higher score than old articles. (4) Citation rate, normalized to year. |
Classes with closest relation at Level 1 |