Class information for:
Level 1: SELF FORMING BARRIER//CUMG ALLOY//CUTI ALLOY FILM

Basic class information

Bar chart of Publication_year

Last years might be incomplete

Hierarchy of classes

The table includes all classes above and classes immediately below the current class.



Cluster id Level Cluster label #P
1 4 PHYSICS, CONDENSED MATTER//PHYSICS, APPLIED//MATERIALS SCIENCE, MULTIDISCIPLINARY 2188495
396 3       LEAD FREE SOLDER//SOLDER//ELECTROMIGRATION 32184
1011 2             ATOMIC LAYER DEPOSITION//DIFFUSION BARRIER//CU METALLIZATION 10645
18983 1                   SELF FORMING BARRIER//CUMG ALLOY//CUTI ALLOY FILM 550

Terms with highest relevance score



rank Category termType chi_square shrOfCwithTerm shrOfTermInClass termInClass
1 SELF FORMING BARRIER authKW 520927 2% 91% 10
2 CUMG ALLOY authKW 343813 1% 100% 6
3 CUTI ALLOY FILM authKW 343813 1% 100% 6
4 AGGLOMERATION SUPPRESSION authKW 294695 1% 86% 6
5 BARRIERLESS METALLIZATION authKW 286511 1% 100% 5
6 SILVER METALLIZATION authKW 282097 1% 62% 8
7 SELF FORMING authKW 257857 1% 75% 6
8 NSF LOW POWER ELECT address 229205 1% 67% 6
9 ACT MATRIX LIQUID CRYSTAL DISPLAY address 179065 1% 63% 5
10 CU3GE authKW 171906 1% 100% 3

Web of Science journal categories



chi_square_rank Category chi_square shrOfCwithTerm shrOfTermInClass termInClass
1 Physics, Applied 5772 65% 0% 356
2 Materials Science, Coatings & Films 3782 19% 0% 105
3 Materials Science, Multidisciplinary 1590 39% 0% 214
4 Nanoscience & Nanotechnology 622 12% 0% 68
5 Physics, Condensed Matter 579 19% 0% 102
6 Engineering, Electrical & Electronic 542 20% 0% 112
7 Metallurgy & Metallurgical Engineering 382 10% 0% 53
8 Electrochemistry 116 5% 0% 25
9 Optics 60 6% 0% 32
10 Chemistry, Physical 26 8% 0% 44

Address terms



chi_square_rank term chi_square shrOfCwithTerm shrOfTermInClass termInClass
1 NSF LOW POWER ELECT 229205 1% 67% 6
2 ACT MATRIX LIQUID CRYSTAL DISPLAY 179065 1% 63% 5
3 LOW POWER ELECT 135816 1% 30% 8
4 PROTECT INFORMAT 114604 0% 100% 2
5 CHEM BIO MAT ENGN 71731 2% 10% 12
6 ACT MATRIX LIGUID CRYSTAL DISPLAY 57302 0% 100% 1
7 ACT MATRIX LIGUID DISPLAY 57302 0% 100% 1
8 CCDS FUSE SOLUT 57302 0% 100% 1
9 CEA G LETI 57302 0% 100% 1
10 HITACHI HIGH TECHNOL 57302 0% 100% 1

Journals



chi_square_rank term chi_square shrOfCwithTerm shrOfTermInClass termInClass
1 JOURNAL OF ELECTRONIC MATERIALS 5323 6% 0% 31
2 MICROELECTRONIC ENGINEERING 5283 6% 0% 31
3 JAPANESE JOURNAL OF APPLIED PHYSICS 3525 6% 0% 32
4 THIN SOLID FILMS 3261 8% 0% 46
5 JOURNAL OF APPLIED PHYSICS 1553 10% 0% 55
6 APPLIED PHYSICS LETTERS 808 7% 0% 41
7 JOURNAL OF THE ELECTROCHEMICAL SOCIETY 790 4% 0% 21
8 IEEE ELECTRON DEVICE LETTERS 600 2% 0% 10
9 APPLIED SURFACE SCIENCE 536 3% 0% 19
10 VACUUM 461 2% 0% 9

Author Key Words



chi_square_rank term chi_square shrOfCwithTerm shrOfTermInClass termInClass LCSH search Wikipedia search
1 SELF FORMING BARRIER 520927 2% 91% 10 Search SELF+FORMING+BARRIER Search SELF+FORMING+BARRIER
2 CUMG ALLOY 343813 1% 100% 6 Search CUMG+ALLOY Search CUMG+ALLOY
3 CUTI ALLOY FILM 343813 1% 100% 6 Search CUTI+ALLOY+FILM Search CUTI+ALLOY+FILM
4 AGGLOMERATION SUPPRESSION 294695 1% 86% 6 Search AGGLOMERATION+SUPPRESSION Search AGGLOMERATION+SUPPRESSION
5 BARRIERLESS METALLIZATION 286511 1% 100% 5 Search BARRIERLESS+METALLIZATION Search BARRIERLESS+METALLIZATION
6 SILVER METALLIZATION 282097 1% 62% 8 Search SILVER+METALLIZATION Search SILVER+METALLIZATION
7 SELF FORMING 257857 1% 75% 6 Search SELF+FORMING Search SELF+FORMING
8 CU3GE 171906 1% 100% 3 Search CU3GE Search CU3GE
9 CUB ALLOY 171906 1% 100% 3 Search CUB+ALLOY Search CUB+ALLOY
10 SILICON100 WAFER 171906 1% 100% 3 Search SILICON100+WAFER Search SILICON100+WAFER

Core articles

The table includes core articles in the class. The following variables is taken into account for the relevance score of an article in a cluster c:
(1) Number of references referring to publications in the class.
(2) Share of total number of active references referring to publications in the class.
(3) Age of the article. New articles get higher score than old articles.
(4) Citation rate, normalized to year.

Classes with closest relation at Level 1



rank cluster_id2 link
1 3456 DIFFUSION BARRIER//CU METALLIZATION//TANTALUM NITRIDE
2 11897 PERFLUORINATED CARBOXYLATES//CU CVD//ZENTRUM MIKROTECHNOL
3 4287 ELECTROMIGRATION//ELECTROMIGRATION EM//PRC MER
4 27042 INDUCTIVELY COUPLED PLASMA REACTIVE ION ETCHING//TI HARD MASK//MAGNETIC TUNNEL JUNCTION MATERIALS
5 22409 HILLOCKS//SUR E EVALUAT//ARRAY PROC TECHNOL GRP
6 38234 ALUMINUM MATRIX NANOCOMPOSITE FILM//ELECTRON BEAM EVAPORATIVE PVD//HIGHLY SUPERSATURATED SOLID SOLUTION
7 20311 LONGITUDINAL MICROSTRUCTURE//VERY NARROW COPPER WIRE//8 INCH WAFER
8 14235 ITO AG ITO//AZO AG AZO//TRANSPARENT CONDUCTING ELECTRODE
9 12733 ELECTROLESS COPPER PLATING//ELECTROLESS COPPER DEPOSITION//ELECTROLESS DEPOSITION
10 31618 W TI THIN FILMS//W TI ALLOY//W 10TI ALLOY

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