Class information for:
Level 1: ELECTROLESS COPPER PLATING//ELECTROLESS COPPER DEPOSITION//ELECTROLESS DEPOSITION

Basic class information
Bar chart of Publication_year

Last years might be incomplete

Hierarchy of classes
The table includes all classes above and classes immediately below the current class.


Cluster id Level Cluster label #P
1 4 PHYSICS, CONDENSED MATTER//PHYSICS, APPLIED//MATERIALS SCIENCE, MULTIDISCIPLINARY 2188495
42 3       ELECTROCHEMISTRY//FUEL CELL//JOURNAL OF ELECTROANALYTICAL CHEMISTRY 105165
592 2             ELECTRODEPOSITION//PLATING AND SURFACE FINISHING//TRANSACTIONS OF THE INSTITUTE OF METAL FINISHING 14629
12733 1                   ELECTROLESS COPPER PLATING//ELECTROLESS COPPER DEPOSITION//ELECTROLESS DEPOSITION 915

Terms with highest relevance score


rank Category termType chi_square shrOfCwithTerm shrOfTermInClass termInClass
1 ELECTROLESS COPPER PLATING authKW 353809 4% 31% 33
2 ELECTROLESS COPPER DEPOSITION authKW 284418 2% 52% 16
3 ELECTROLESS DEPOSITION authKW 272146 8% 10% 77
4 COWP FILM authKW 172216 1% 100% 5
5 BOTTOM UP FILLING authKW 129660 1% 47% 8
6 ELECTROLESS COPPER authKW 111093 1% 32% 10
7 ELECTROLESS authKW 95032 3% 10% 28
8 CO W P THIN FILMS authKW 77495 0% 75% 3
9 IN SITU STRAIN MONITORING authKW 77495 0% 75% 3
10 60 NM TRENCH PATTERN authKW 68886 0% 100% 2

Web of Science journal categories


chi_square_rank Category chi_square shrOfCwithTerm shrOfTermInClass termInClass
1 Materials Science, Coatings & Films 27318 39% 0% 359
2 Electrochemistry 14729 34% 0% 314
3 Metallurgy & Metallurgical Engineering 1371 14% 0% 125
4 Physics, Applied 1065 24% 0% 219
5 Materials Science, Multidisciplinary 904 24% 0% 224
6 Nanoscience & Nanotechnology 518 9% 0% 83
7 Physics, Condensed Matter 191 10% 0% 88
8 Chemistry, Physical 170 12% 0% 111
9 Engineering, Electrical & Electronic 98 9% 0% 80
10 Chemistry, Multidisciplinary 60 8% 0% 77

Address terms


chi_square_rank term chi_square shrOfCwithTerm shrOfTermInClass termInClass
1 ADV DISPLAY TECHNOL MAGNETOELECT 34443 0% 100% 1
2 ADV OPTOELECT SCI 34443 0% 100% 1
3 ANDRONIKASHVILI PHYS6 TAMARASHVILI ST 34443 0% 100% 1
4 BEING SPECIAL FUNCT MAT FILMS 34443 0% 100% 1
5 BGA MFG GRP 34443 0% 100% 1
6 BTT PTH 34443 0% 100% 1
7 BTT PTH RD 34443 0% 100% 1
8 CHIM MATRIERE CONDENSEE BORDEAUX 34443 0% 100% 1
9 CROLLES ALLIANCE 2 34443 0% 100% 1
10 ENERGY ENVIRONM BIOMED MED ENGN 34443 0% 100% 1

Journals


chi_square_rank term chi_square shrOfCwithTerm shrOfTermInClass termInClass
1 PLATING AND SURFACE FINISHING 61541 5% 4% 50
2 JOURNAL OF THE ELECTROCHEMICAL SOCIETY 41815 21% 1% 193
3 ELECTROCHEMICAL AND SOLID STATE LETTERS 10402 4% 1% 36
4 TRANSACTIONS OF THE INSTITUTE OF METAL FINISHING 6160 2% 1% 15
5 TRANSACTIONS OF THE METAL FINISHERS ASSOCIATION OF INDIA 4073 0% 4% 3
6 MICROELECTRONIC ENGINEERING 4025 4% 0% 35
7 ELECTROCHIMICA ACTA 2074 5% 0% 42
8 CIRCUIT WORLD 1416 0% 1% 3
9 IBM JOURNAL OF RESEARCH AND DEVELOPMENT 1387 1% 0% 9
10 THIN SOLID FILMS 1231 4% 0% 37

Author Key Words


chi_square_rank term chi_square shrOfCwithTerm shrOfTermInClass termInClass LCSH search Wikipedia search
1 ELECTROLESS COPPER PLATING 353809 4% 31% 33 Search ELECTROLESS+COPPER+PLATING Search ELECTROLESS+COPPER+PLATING
2 ELECTROLESS COPPER DEPOSITION 284418 2% 52% 16 Search ELECTROLESS+COPPER+DEPOSITION Search ELECTROLESS+COPPER+DEPOSITION
3 ELECTROLESS DEPOSITION 272146 8% 10% 77 Search ELECTROLESS+DEPOSITION Search ELECTROLESS+DEPOSITION
4 COWP FILM 172216 1% 100% 5 Search COWP+FILM Search COWP+FILM
5 BOTTOM UP FILLING 129660 1% 47% 8 Search BOTTOM+UP+FILLING Search BOTTOM+UP+FILLING
6 ELECTROLESS COPPER 111093 1% 32% 10 Search ELECTROLESS+COPPER Search ELECTROLESS+COPPER
7 ELECTROLESS 95032 3% 10% 28 Search ELECTROLESS Search ELECTROLESS
8 CO W P THIN FILMS 77495 0% 75% 3 Search CO+W+P+THIN+FILMS Search CO+W+P+THIN+FILMS
9 IN SITU STRAIN MONITORING 77495 0% 75% 3 Search IN+SITU+STRAIN+MONITORING Search IN+SITU+STRAIN+MONITORING
10 60 NM TRENCH PATTERN 68886 0% 100% 2 Search 60+NM+TRENCH+PATTERN Search 60+NM+TRENCH+PATTERN

Core articles
The table includes core articles in the class. The following variables is taken into account for the relevance score of an article in a cluster c:
(1) Number of references referring to publications in the class.
(2) Share of total number of active references referring to publications in the class.
(3) Age of the article. New articles get higher score than old articles.
(4) Citation rate, normalized to year.

Classes with closest relation at Level 1


rank cluster_id2 link
1 15952 ELECTROLESS METALLIZATION//LASER MICRO CLADDING//LASER INDUCED CHEMICAL LIQUID PHASE DEPOSITION
2 2014 ELECTROLESS PLATING//ELECTROLESS//ELECTROLESS NICKEL
3 4876 COPPER ELECTRODEPOSITION//SELF ANNEALING//COPPER ELECTROPLATING
4 18983 SELF FORMING BARRIER//CUMG ALLOY//CUTI ALLOY FILM
5 25090 CO P//MICROMAGNETS//CO P ALLOYS
6 11897 PERFLUORINATED CARBOXYLATES//CU CVD//ZENTRUM MIKROTECHNOL
7 30595 COATING OF NON STOICHIOMETRIC COPPER SULPHIDE//COBALT SULPHIDE COATINGS//DIRECT ASCORBIC ACID FUEL CELL
8 3456 DIFFUSION BARRIER//CU METALLIZATION//TANTALUM NITRIDE
9 38559 ASTM G1 90//FORMIC ACID AND CORROSION INHIBITION SUBSTITUTED THIONES//HALIDE IONS AND INHIBITION
10 17502 NI W ALLOY//SECT AMORPHOUS SYST//INDUCED CODEPOSITION

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