Class information for:
Level 1: DIFFUSION BARRIER//CU METALLIZATION//TANTALUM NITRIDE

Basic class information
Bar chart of Publication_year

Last years might be incomplete

Hierarchy of classes
The table includes all classes above and classes immediately below the current class.


Cluster id Level Cluster label #P
1 4 PHYSICS, CONDENSED MATTER//PHYSICS, APPLIED//MATERIALS SCIENCE, MULTIDISCIPLINARY 2188495
396 3       LEAD FREE SOLDER//SOLDER//ELECTROMIGRATION 32184
1011 2             ATOMIC LAYER DEPOSITION//DIFFUSION BARRIER//CU METALLIZATION 10645
3456 1                   DIFFUSION BARRIER//CU METALLIZATION//TANTALUM NITRIDE 2011

Terms with highest relevance score


rank Category termType chi_square shrOfCwithTerm shrOfTermInClass termInClass
1 DIFFUSION BARRIER authKW 1342342 13% 32% 267
2 CU METALLIZATION authKW 782083 4% 70% 71
3 TANTALUM NITRIDE authKW 649649 4% 54% 77
4 TA SI N authKW 322356 1% 86% 24
5 TUNGSTEN NITRIDE authKW 279170 2% 42% 42
6 CU DIFFUSION BARRIER authKW 170627 1% 78% 14
7 COPPER METALLIZATION authKW 156456 1% 37% 27
8 TAN authKW 141368 2% 24% 38
9 ADV PROC C ACITOR address 104463 0% 67% 10
10 COPPER DIFFUSION BARRIER authKW 92171 0% 59% 10

Web of Science journal categories


chi_square_rank Category chi_square shrOfCwithTerm shrOfTermInClass termInClass
1 Materials Science, Coatings & Films 38892 32% 0% 637
2 Physics, Applied 18783 61% 0% 1232
3 Materials Science, Multidisciplinary 4134 33% 0% 673
4 Physics, Condensed Matter 3055 22% 0% 438
5 Nanoscience & Nanotechnology 2363 13% 0% 253
6 Electrochemistry 1879 9% 0% 177
7 Engineering, Electrical & Electronic 954 15% 0% 303
8 Metallurgy & Metallurgical Engineering 298 5% 0% 101
9 Optics 190 6% 0% 111
10 Chemistry, Physical 143 9% 0% 180

Address terms


chi_square_rank term chi_square shrOfCwithTerm shrOfTermInClass termInClass
1 ADV PROC C ACITOR 104463 0% 67% 10
2 NEW YORK STATE ADV THIN FILM TECHNOL 71629 0% 57% 8
3 MAT CHEM COATINGS 50144 0% 80% 4
4 SEMICOND MICROSYST TECHN IHM 47011 0% 100% 3
5 SEMICOND MICROSYST TECHNOL 44371 1% 17% 17
6 MET DEPOSIT PROD GRP 35257 0% 75% 3
7 FUDAN NOVELLUS INTERCONNECT 31341 0% 100% 2
8 NW SERV OFF 31341 0% 100% 2
9 MEMORY DEV 26091 1% 11% 15
10 BENET S 23732 1% 13% 12

Journals


chi_square_rank term chi_square shrOfCwithTerm shrOfTermInClass termInClass
1 THIN SOLID FILMS 17979 10% 1% 206
2 MICROELECTRONIC ENGINEERING 16879 5% 1% 106
3 JOURNAL OF THE ELECTROCHEMICAL SOCIETY 13042 8% 1% 161
4 ELECTROCHEMICAL AND SOLID STATE LETTERS 7689 2% 1% 46
5 JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A 7454 4% 1% 83
6 JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B 6004 4% 0% 81
7 SURFACE & COATINGS TECHNOLOGY 4743 4% 0% 79
8 JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS 3685 4% 0% 87
9 ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY 3411 1% 1% 18
10 CHEMICAL VAPOR DEPOSITION 3062 1% 1% 14

Author Key Words


chi_square_rank term chi_square shrOfCwithTerm shrOfTermInClass termInClass LCSH search Wikipedia search
1 DIFFUSION BARRIER 1342342 13% 32% 267 Search DIFFUSION+BARRIER Search DIFFUSION+BARRIER
2 CU METALLIZATION 782083 4% 70% 71 Search CU+METALLIZATION Search CU+METALLIZATION
3 TANTALUM NITRIDE 649649 4% 54% 77 Search TANTALUM+NITRIDE Search TANTALUM+NITRIDE
4 TA SI N 322356 1% 86% 24 Search TA+SI+N Search TA+SI+N
5 TUNGSTEN NITRIDE 279170 2% 42% 42 Search TUNGSTEN+NITRIDE Search TUNGSTEN+NITRIDE
6 CU DIFFUSION BARRIER 170627 1% 78% 14 Search CU+DIFFUSION+BARRIER Search CU+DIFFUSION+BARRIER
7 COPPER METALLIZATION 156456 1% 37% 27 Search COPPER+METALLIZATION Search COPPER+METALLIZATION
8 TAN 141368 2% 24% 38 Search TAN Search TAN
9 COPPER DIFFUSION BARRIER 92171 0% 59% 10 Search COPPER+DIFFUSION+BARRIER Search COPPER+DIFFUSION+BARRIER
10 TANTALUM 81920 4% 6% 86 Search TANTALUM Search TANTALUM

Core articles
The table includes core articles in the class. The following variables is taken into account for the relevance score of an article in a cluster c:
(1) Number of references referring to publications in the class.
(2) Share of total number of active references referring to publications in the class.
(3) Age of the article. New articles get higher score than old articles.
(4) Citation rate, normalized to year.

Classes with closest relation at Level 1


rank cluster_id2 link
1 18983 SELF FORMING BARRIER//CUMG ALLOY//CUTI ALLOY FILM
2 31618 W TI THIN FILMS//W TI ALLOY//W 10TI ALLOY
3 3225 TITANIUM NITRIDE//ZIRCONIUM NITRIDE//ZIRCONIUM OXYNITRIDE
4 17999 RUTHENIUM FILMS//RUO2//RU
5 11897 PERFLUORINATED CARBOXYLATES//CU CVD//ZENTRUM MIKROTECHNOL
6 23675 PACVD//OBERFLACHENTECH PLASMATECH WERKSTOFFENTWIC//PULSE PLASMA BIASING
7 14190 CVD W//BLANKET TUNGSTEN//TUNGSTEN THIN FILMS
8 22169 EMBEDDED RESISTOR//RESISTIVE FILMS//THIN FILM RESISTOR
9 30846 CROSS KELVIN RESISTOR CKR//CROSS BRIDGE KELVIN RESISTOR CBKR//POLYMETAL GATE
10 12733 ELECTROLESS COPPER PLATING//ELECTROLESS COPPER DEPOSITION//ELECTROLESS DEPOSITION

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