Class information for: |
Basic class information |
Hierarchy of classes |
The table includes all classes above and classes immediately below the current class. |
Cluster id | Level | Cluster label | #P |
---|---|---|---|
1 | 4 | PHYSICS, CONDENSED MATTER//PHYSICS, APPLIED//MATERIALS SCIENCE, MULTIDISCIPLINARY | 2188495 |
553 | 3 | BETA FESI2//SILICIDES//ERBIUM | 18376 |
685 | 2 | BETA FESI2//SILICIDES//SERIES RESISTANCE | 13508 |
22169 | 1 | EMBEDDED RESISTOR//RESISTIVE FILMS//THIN FILM RESISTOR | 414 |
Terms with highest relevance score |
rank | Category | termType | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
---|---|---|---|---|---|---|
1 | EMBEDDED RESISTOR | authKW | 710506 | 3% | 67% | 14 |
2 | RESISTIVE FILMS | authKW | 541344 | 2% | 89% | 8 |
3 | THIN FILM RESISTOR | authKW | 503355 | 6% | 29% | 23 |
4 | NI CR THIN FILM | authKW | 380633 | 1% | 100% | 5 |
5 | ARGON PLUS OXYGEN MIXTURE GAS | authKW | 304507 | 1% | 100% | 4 |
6 | RELATIVE RESISTANCE CHANGE | authKW | 228380 | 1% | 100% | 3 |
7 | INTEGRAL PASSIVES | authKW | 174000 | 1% | 57% | 4 |
8 | TEMPERATURE COEFFICIENT OF RESISTANCE TCR | authKW | 173992 | 2% | 29% | 8 |
9 | EMBEDDED PASSIVE MATERIALS | authKW | 152253 | 0% | 100% | 2 |
10 | EMBEDDED THIN FILM RESISTOR | authKW | 152253 | 0% | 100% | 2 |
Web of Science journal categories |
chi_square_rank | Category | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
---|---|---|---|---|---|
1 | Materials Science, Coatings & Films | 6571 | 29% | 0% | 119 |
2 | Physics, Applied | 2557 | 50% | 0% | 209 |
3 | Materials Science, Multidisciplinary | 1975 | 49% | 0% | 202 |
4 | Physics, Condensed Matter | 1207 | 29% | 0% | 121 |
5 | Engineering, Electrical & Electronic | 513 | 22% | 0% | 93 |
6 | Engineering, Manufacturing | 348 | 5% | 0% | 22 |
7 | Metallurgy & Metallurgical Engineering | 187 | 8% | 0% | 33 |
8 | Nanoscience & Nanotechnology | 118 | 7% | 0% | 28 |
9 | Computer Science, Hardware & Architecture | 59 | 2% | 0% | 10 |
10 | Electrochemistry | 50 | 4% | 0% | 15 |
Address terms |
chi_square_rank | term | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
---|---|---|---|---|---|
1 | MINIST HIGH TEMP MAT TESTS | 152249 | 1% | 50% | 4 |
2 | ELECT TECHNOL EDUC | 101497 | 1% | 33% | 4 |
3 | CHAIR ELECT DEVICES CIRCUITS | 76127 | 0% | 100% | 1 |
4 | CIE UNIV | 76127 | 0% | 100% | 1 |
5 | CIVIL MAT MFG ENGN EII | 76127 | 0% | 100% | 1 |
6 | COLD MASS PRECIS FORMING | 76127 | 0% | 100% | 1 |
7 | EDUC MINIST HIST TEMP MAT TESTS | 76127 | 0% | 100% | 1 |
8 | INFORMAT ENGN PHYS | 76127 | 0% | 100% | 1 |
9 | MICROREL | 76127 | 0% | 100% | 1 |
10 | MECH DESIGN SYST ENGN | 48934 | 1% | 21% | 3 |
Journals |
chi_square_rank | term | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
---|---|---|---|---|---|
1 | CIRCUIT WORLD | 17097 | 2% | 3% | 7 |
2 | THIN SOLID FILMS | 12327 | 19% | 0% | 77 |
3 | IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY | 11530 | 3% | 1% | 14 |
4 | ELECTROCOMPONENT SCIENCE AND TECHNOLOGY | 8350 | 1% | 4% | 3 |
5 | HEWLETT-PACKARD JOURNAL | 3628 | 1% | 1% | 4 |
6 | IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING | 1724 | 1% | 1% | 3 |
7 | SOUTH AFRICAN JOURNAL OF PHYSICS - SUID-AFRIKAANSE TYDSKRIF VIR FISIKA | 1552 | 0% | 2% | 1 |
8 | VACUUM | 1512 | 3% | 0% | 14 |
9 | IBM JOURNAL OF RESEARCH AND DEVELOPMENT | 1368 | 1% | 0% | 6 |
10 | SIEMENS FORSCHUNGS-UND ENTWICKLUNGSBERICHTE-SIEMENS RESEARCH AND DEVELOPMENT REPORTS | 1099 | 0% | 1% | 2 |
Author Key Words |
Core articles |
The table includes core articles in the class. The following variables is taken into account for the relevance score of an article in a cluster c: (1) Number of references referring to publications in the class. (2) Share of total number of active references referring to publications in the class. (3) Age of the article. New articles get higher score than old articles. (4) Citation rate, normalized to year. |
Classes with closest relation at Level 1 |