Class information for: |
Basic class information |
Hierarchy of classes |
The table includes all classes above and classes immediately below the current class. |
Cluster id | Level | Cluster label | #P |
---|---|---|---|
1 | 4 | PHYSICS, CONDENSED MATTER//PHYSICS, APPLIED//MATERIALS SCIENCE, MULTIDISCIPLINARY | 2188495 |
390 | 3 | SENSORS AND ACTUATORS A-PHYSICAL//JOURNAL OF MICROELECTROMECHANICAL SYSTEMS//MEMS | 32897 |
3658 | 2 | MICROHOTPLATE//MICROHEATER//THIN FILM THERMOCOUPLES | 1296 |
26132 | 1 | THIN FILM THERMOCOUPLES//SENSORS SUR E TECHNOL PARTNERSHIP//SMART MAT MEMS | 284 |
Terms with highest relevance score |
rank | Category | termType | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
---|---|---|---|---|---|---|
1 | THIN FILM THERMOCOUPLES | authKW | 1168132 | 7% | 53% | 20 |
2 | SENSORS SUR E TECHNOL PARTNERSHIP | address | 355116 | 1% | 80% | 4 |
3 | SMART MAT MEMS | address | 302088 | 2% | 39% | 7 |
4 | CERAMIC THERMOCOUPLE | authKW | 221949 | 1% | 100% | 2 |
5 | MATCH X | authKW | 221949 | 1% | 100% | 2 |
6 | NICR NISI | authKW | 221949 | 1% | 100% | 2 |
7 | SENSORS TECHNOL BRANCH | address | 221949 | 1% | 100% | 2 |
8 | THIN FILM STRAIN GAGE | authKW | 221949 | 1% | 100% | 2 |
9 | THIN FILM THERMOCOUPLE TFTC | authKW | 221949 | 1% | 100% | 2 |
10 | PHILIPS TECHNICAL REVIEW | journal | 167830 | 4% | 14% | 11 |
Web of Science journal categories |
chi_square_rank | Category | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
---|---|---|---|---|---|
1 | Instruments & Instrumentation | 2176 | 28% | 0% | 79 |
2 | Materials Science, Coatings & Films | 1653 | 18% | 0% | 50 |
3 | Physics, Applied | 889 | 37% | 0% | 105 |
4 | Materials Science, Multidisciplinary | 464 | 30% | 0% | 86 |
5 | Engineering, Electrical & Electronic | 421 | 24% | 0% | 69 |
6 | Physics, Condensed Matter | 290 | 18% | 0% | 52 |
7 | Engineering, General | 210 | 7% | 0% | 20 |
8 | Metallurgy & Metallurgical Engineering | 120 | 8% | 0% | 22 |
9 | Nanoscience & Nanotechnology | 112 | 8% | 0% | 22 |
10 | Materials Science, Ceramics | 90 | 4% | 0% | 11 |
Address terms |
chi_square_rank | term | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
---|---|---|---|---|---|
1 | SENSORS SUR E TECHNOL PARTNERSHIP | 355116 | 1% | 80% | 4 |
2 | SMART MAT MEMS | 302088 | 2% | 39% | 7 |
3 | SENSORS TECHNOL BRANCH | 221949 | 1% | 100% | 2 |
4 | ADV TRANSDUCERS | 110974 | 0% | 100% | 1 |
5 | HGEBIET ELEKTROMECH SYST MIKROTECH | 110974 | 0% | 100% | 1 |
6 | HGEBIET MESS SENSORTECH | 110974 | 0% | 100% | 1 |
7 | INFORMAT MAT COMPUTAT SCI | 110974 | 0% | 100% | 1 |
8 | KT CONSULTING | 110974 | 0% | 100% | 1 |
9 | LOGIST SAF J4 | 110974 | 0% | 100% | 1 |
10 | PROGNOST DIAGNOST TEAM | 110974 | 0% | 100% | 1 |
Journals |
chi_square_rank | term | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
---|---|---|---|---|---|
1 | PHILIPS TECHNICAL REVIEW | 167830 | 4% | 14% | 11 |
2 | SENSORS AND ACTUATORS A-PHYSICAL | 10538 | 11% | 0% | 31 |
3 | THIN SOLID FILMS | 2887 | 11% | 0% | 31 |
4 | POWDER METALLURGY AND METAL CERAMICS | 2139 | 2% | 0% | 6 |
5 | JOURNAL OF MANUFACTURING SCIENCE AND ENGINEERING-TRANSACTIONS OF THE ASME | 1564 | 2% | 0% | 6 |
6 | SENSORS AND ACTUATORS | 1503 | 1% | 0% | 3 |
7 | SENSOR REVIEW | 1028 | 1% | 0% | 2 |
8 | JOURNAL OF MICROMECHANICS AND MICROENGINEERING | 944 | 2% | 0% | 7 |
9 | ANNUAL REVIEW OF CHEMICAL AND BIOMOLECULAR ENGINEERING | 659 | 0% | 1% | 1 |
10 | IEEE SENSORS JOURNAL | 609 | 2% | 0% | 6 |
Author Key Words |
Core articles |
The table includes core articles in the class. The following variables is taken into account for the relevance score of an article in a cluster c: (1) Number of references referring to publications in the class. (2) Share of total number of active references referring to publications in the class. (3) Age of the article. New articles get higher score than old articles. (4) Citation rate, normalized to year. |
Classes with closest relation at Level 1 |