Class information for: |
Basic class information |
Hierarchy of classes |
The table includes all classes above and classes immediately below the current class. |
| Cluster id | Level | Cluster label | #P |
|---|---|---|---|
| 1 | 4 | PHYSICS, CONDENSED MATTER//PHYSICS, APPLIED//MATERIALS SCIENCE, MULTIDISCIPLINARY | 2188495 |
| 396 | 3 | LEAD FREE SOLDER//SOLDER//ELECTROMIGRATION | 32184 |
| 535 | 2 | LEAD FREE SOLDER//SOLDER//SOLDERING & SURFACE MOUNT TECHNOLOGY | 15297 |
| 1011 | 2 | ATOMIC LAYER DEPOSITION//DIFFUSION BARRIER//CU METALLIZATION | 10645 |
| 2634 | 2 | FIZIKA NIZKIKH TEMPERATUR//JOURNAL OF PHYSICS F-METAL PHYSICS//ULTRAHIGH PURITY ALUMINUM | 3742 |
| 3099 | 2 | ELECTROMIGRATION//OPTICAL MOUSE//ELECTROMIGRATION EM | 2500 |
Terms with highest relevance score |
| rank | Category | termType | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
|---|---|---|---|---|---|---|
| 1 | LEAD FREE SOLDER | authKW | 777783 | 3% | 82% | 966 |
| 2 | SOLDER | authKW | 478537 | 2% | 65% | 757 |
| 3 | ELECTROMIGRATION | authKW | 365156 | 2% | 57% | 652 |
| 4 | SOLDERING & SURFACE MOUNT TECHNOLOGY | journal | 279635 | 1% | 83% | 343 |
| 5 | JOURNAL OF ELECTRONIC MATERIALS | journal | 246862 | 5% | 16% | 1616 |
| 6 | SOLDER JOINT | authKW | 245700 | 1% | 81% | 312 |
| 7 | FLIP CHIP | authKW | 235672 | 1% | 61% | 398 |
| 8 | JOURNAL OF ELECTRONIC PACKAGING | journal | 234594 | 2% | 44% | 552 |
| 9 | PB FREE SOLDER | authKW | 210032 | 1% | 83% | 259 |
| 10 | MICROELECTRONICS RELIABILITY | journal | 204648 | 4% | 17% | 1246 |
Web of Science journal categories |
| chi_square_rank | Category | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
|---|---|---|---|---|---|
| 1 | Physics, Applied | 127143 | 41% | 1% | 13224 |
| 2 | Materials Science, Multidisciplinary | 97232 | 40% | 1% | 12772 |
| 3 | Materials Science, Coatings & Films | 64884 | 11% | 2% | 3401 |
| 4 | Engineering, Electrical & Electronic | 61193 | 27% | 1% | 8725 |
| 5 | Nanoscience & Nanotechnology | 31316 | 12% | 1% | 3717 |
| 6 | Engineering, Manufacturing | 27565 | 5% | 2% | 1725 |
| 7 | Metallurgy & Metallurgical Engineering | 27013 | 10% | 1% | 3377 |
| 8 | Physics, Condensed Matter | 21273 | 15% | 1% | 4893 |
| 9 | Electrochemistry | 2385 | 3% | 0% | 960 |
| 10 | Chemistry, Physical | 2349 | 9% | 0% | 2902 |
Address terms |
| chi_square_rank | term | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
|---|---|---|---|---|---|
| 1 | MICROJOINING | 63692 | 0% | 88% | 74 |
| 2 | MAT SCI ENGN | 44778 | 12% | 1% | 3829 |
| 3 | ELECT PACKAGING MAT | 41152 | 0% | 86% | 49 |
| 4 | ST S RELIABIL | 32470 | 0% | 92% | 36 |
| 5 | ELECT PACKAGING | 31397 | 0% | 44% | 74 |
| 6 | COMPONENT QUAL TECHNOL GRP | 20564 | 0% | 96% | 22 |
| 7 | ELECT MFG ENGN GRP | 19077 | 0% | 78% | 25 |
| 8 | CALCE ELECT PROD SYST | 16879 | 0% | 34% | 51 |
| 9 | ADV MAT JOINING | 14748 | 0% | 32% | 48 |
| 10 | CALCE | 13632 | 0% | 33% | 43 |
Journals |
| chi_square_rank | term | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
|---|---|---|---|---|---|
| 1 | SOLDERING & SURFACE MOUNT TECHNOLOGY | 279635 | 1% | 83% | 343 |
| 2 | JOURNAL OF ELECTRONIC MATERIALS | 246862 | 5% | 16% | 1616 |
| 3 | JOURNAL OF ELECTRONIC PACKAGING | 234594 | 2% | 44% | 552 |
| 4 | MICROELECTRONICS RELIABILITY | 204648 | 4% | 17% | 1246 |
| 5 | IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY | 146511 | 1% | 32% | 464 |
| 6 | IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES | 126217 | 1% | 34% | 386 |
| 7 | IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING | 88894 | 1% | 48% | 190 |
| 8 | IEEE TRANSACTIONS ON ADVANCED PACKAGING | 56188 | 1% | 24% | 242 |
| 9 | FIZIKA NIZKIKH TEMPERATUR | 46934 | 1% | 13% | 385 |
| 10 | CHEMICAL VAPOR DEPOSITION | 45959 | 1% | 22% | 217 |
Author Key Words |
| chi_square_rank | term | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass | LCSH search | Wikipedia search |
|---|---|---|---|---|---|---|---|
| 1 | LEAD FREE SOLDER | 777783 | 3% | 82% | 966 | Search LEAD+FREE+SOLDER | Search LEAD+FREE+SOLDER |
| 2 | SOLDER | 478537 | 2% | 65% | 757 | Search SOLDER | Search SOLDER |
| 3 | ELECTROMIGRATION | 365156 | 2% | 57% | 652 | Search ELECTROMIGRATION | Search ELECTROMIGRATION |
| 4 | SOLDER JOINT | 245700 | 1% | 81% | 312 | Search SOLDER+JOINT | Search SOLDER+JOINT |
| 5 | FLIP CHIP | 235672 | 1% | 61% | 398 | Search FLIP+CHIP | Search FLIP+CHIP |
| 6 | PB FREE SOLDER | 210032 | 1% | 83% | 259 | Search PB+FREE+SOLDER | Search PB+FREE+SOLDER |
| 7 | ATOMIC LAYER DEPOSITION | 157059 | 2% | 26% | 615 | Search ATOMIC+LAYER+DEPOSITION | Search ATOMIC+LAYER+DEPOSITION |
| 8 | THROUGH SILICON VIA TSV | 141186 | 1% | 75% | 192 | Search THROUGH+SILICON+VIA+TSV | Search THROUGH+SILICON+VIA+TSV |
| 9 | DIFFUSION BARRIER | 137791 | 1% | 41% | 343 | Search DIFFUSION+BARRIER | Search DIFFUSION+BARRIER |
| 10 | INTERMETALLIC COMPOUNDS | 131664 | 2% | 19% | 706 | Search INTERMETALLIC+COMPOUNDS | Search INTERMETALLIC+COMPOUNDS |
Core articles |
The table includes core articles in the class. The following variables is taken into account for the relevance score of an article in a cluster c: (1) Number of references referring to publications in the class. (2) Share of total number of active references referring to publications in the class. (3) Age of the article. New articles get higher score than old articles. (4) Citation rate, normalized to year. |
Classes with closest relation at Level 3 |