Class information for:
Level 1: COPPER ELECTRODEPOSITION//SELF ANNEALING//COPPER ELECTROPLATING

Basic class information
Bar chart of Publication_year

Last years might be incomplete

Hierarchy of classes
The table includes all classes above and classes immediately below the current class.


Cluster id Level Cluster label #P
1 4 PHYSICS, CONDENSED MATTER//PHYSICS, APPLIED//MATERIALS SCIENCE, MULTIDISCIPLINARY 2188495
42 3       ELECTROCHEMISTRY//FUEL CELL//JOURNAL OF ELECTROANALYTICAL CHEMISTRY 105165
592 2             ELECTRODEPOSITION//PLATING AND SURFACE FINISHING//TRANSACTIONS OF THE INSTITUTE OF METAL FINISHING 14629
4876 1                   COPPER ELECTRODEPOSITION//SELF ANNEALING//COPPER ELECTROPLATING 1737

Terms with highest relevance score


rank Category termType chi_square shrOfCwithTerm shrOfTermInClass termInClass
1 COPPER ELECTRODEPOSITION authKW 449788 3% 45% 55
2 SELF ANNEALING authKW 299908 1% 72% 23
3 COPPER ELECTROPLATING authKW 250270 1% 53% 26
4 LEVELER authKW 156800 1% 79% 11
5 VIA FILLING authKW 145995 1% 62% 13
6 SUPERFILLING authKW 139554 1% 77% 10
7 JOURNAL OF THE ELECTROCHEMICAL SOCIETY journal 118351 26% 1% 447
8 ELECTROPLATING authKW 117944 5% 7% 91
9 GLOBAL BUSINESS UNIT ELECT MAT address 111122 0% 88% 7
10 MICROVIA FILLING authKW 108856 0% 100% 6

Web of Science journal categories


chi_square_rank Category chi_square shrOfCwithTerm shrOfTermInClass termInClass
1 Electrochemistry 52594 47% 0% 813
2 Materials Science, Coatings & Films 47410 38% 0% 652
3 Metallurgy & Metallurgical Engineering 3196 15% 0% 261
4 Materials Science, Multidisciplinary 1452 23% 0% 397
5 Physics, Applied 1059 18% 0% 318
6 Nanoscience & Nanotechnology 774 8% 0% 142
7 Engineering, Electrical & Electronic 325 11% 0% 184
8 METALLURGY & MINING 61 0% 0% 4
9 Physics, Condensed Matter 55 5% 0% 91
10 Engineering, Manufacturing 42 1% 0% 20

Address terms


chi_square_rank term chi_square shrOfCwithTerm shrOfTermInClass termInClass
1 GLOBAL BUSINESS UNIT ELECT MAT 111122 0% 88% 7
2 ADV ELECT ASSEMBLY 54428 0% 100% 3
3 BURLINGTON PLANT 36285 0% 100% 2
4 DEEP SUBMICRON INTEGRATED CIRCUIT TECHNOL 36285 0% 100% 2
5 ELE OPLATING MET FINISHING TECHNOL 29760 0% 21% 8
6 ADV PACKAGING INTERCONNECT 18143 0% 100% 1
7 AMIA S 18143 0% 100% 1
8 ARC SPECIAL PARTICLES INTER ES 18143 0% 100% 1
9 AREA Q ANALIT 18143 0% 100% 1
10 ATOM ENERGY SAFE DEV PROBLEMS 18143 0% 100% 1

Journals


chi_square_rank term chi_square shrOfCwithTerm shrOfTermInClass termInClass
1 JOURNAL OF THE ELECTROCHEMICAL SOCIETY 118351 26% 1% 447
2 PLATING AND SURFACE FINISHING 65332 4% 5% 71
3 TRANSACTIONS OF THE INSTITUTE OF METAL FINISHING 25481 2% 3% 42
4 ELECTROCHEMICAL AND SOLID STATE LETTERS 23165 4% 2% 74
5 JOURNAL OF APPLIED ELECTROCHEMISTRY 21699 5% 1% 84
6 CIRCUIT WORLD 14040 1% 6% 13
7 ELECTROCHIMICA ACTA 8735 7% 0% 118
8 ECS ELECTROCHEMISTRY LETTERS 6852 1% 3% 12
9 MICROELECTRONIC ENGINEERING 4658 3% 1% 52
10 KOREAN JOURNAL OF METALS AND MATERIALS 4618 1% 2% 16

Author Key Words


chi_square_rank term chi_square shrOfCwithTerm shrOfTermInClass termInClass LCSH search Wikipedia search
1 COPPER ELECTRODEPOSITION 449788 3% 45% 55 Search COPPER+ELECTRODEPOSITION Search COPPER+ELECTRODEPOSITION
2 SELF ANNEALING 299908 1% 72% 23 Search SELF+ANNEALING Search SELF+ANNEALING
3 COPPER ELECTROPLATING 250270 1% 53% 26 Search COPPER+ELECTROPLATING Search COPPER+ELECTROPLATING
4 LEVELER 156800 1% 79% 11 Search LEVELER Search LEVELER
5 VIA FILLING 145995 1% 62% 13 Search VIA+FILLING Search VIA+FILLING
6 SUPERFILLING 139554 1% 77% 10 Search SUPERFILLING Search SUPERFILLING
7 ELECTROPLATING 117944 5% 7% 91 Search ELECTROPLATING Search ELECTROPLATING
8 MICROVIA FILLING 108856 0% 100% 6 Search MICROVIA+FILLING Search MICROVIA+FILLING
9 BOTTOM UP FILLING 86436 1% 53% 9 Search BOTTOM+UP+FILLING Search BOTTOM+UP+FILLING
10 COPPER PLATING 85023 1% 31% 15 Search COPPER+PLATING Search COPPER+PLATING

Core articles
The table includes core articles in the class. The following variables is taken into account for the relevance score of an article in a cluster c:
(1) Number of references referring to publications in the class.
(2) Share of total number of active references referring to publications in the class.
(3) Age of the article. New articles get higher score than old articles.
(4) Citation rate, normalized to year.

Classes with closest relation at Level 1


rank cluster_id2 link
1 29736 ACETATE AND HULL CELL//ACID SULPHATE BATHS//AL2O3 COATED MWCNTS
2 12733 ELECTROLESS COPPER PLATING//ELECTROLESS COPPER DEPOSITION//ELECTROLESS DEPOSITION
3 38318 TRANSACTIONS OF THE INSTITUTE OF METAL FINISHING//EDUCTORS//ACID COPPER
4 12538 ELECTROCRYSTALLIZATION//CURRENT TRANSIENTS//ELECTROCHEMICAL NUCLEATION
5 26520 DIFFERENTIAL BOND POLARIZABILITY//RAMAN INTENSITY//TEMPORAL BOND POLARIZABILITY
6 17175 THERMAL EQUILIBRIUM DIAGRAM//TIN ELECTRODEPOSITION//CONNECTING RELIABILITY
7 20311 LONGITUDINAL MICROSTRUCTURE//VERY NARROW COPPER WIRE//8 INCH WAFER
8 21144 SILVER BISMUTH ALLOYS//SILVER INDIUM ALLOY//DIPARTIMENTO INGN INNOVAZ
9 28565 POROUS TRANSDUCER//VARIABLE ULTRACAPACITOR//BENARD INSTABILITY
10 8017 THROUGH SILICON VIA TSV//THROUGH SILICON VIA//3D IC

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