Class information for: |
Basic class information |
Hierarchy of classes |
The table includes all classes above and classes immediately below the current class. |
| Cluster id | Level | Cluster label | #P |
|---|---|---|---|
| 1 | 4 | PHYSICS, CONDENSED MATTER//PHYSICS, APPLIED//MATERIALS SCIENCE, MULTIDISCIPLINARY | 2188495 |
| 396 | 3 | LEAD FREE SOLDER//SOLDER//ELECTROMIGRATION | 32184 |
| 535 | 2 | LEAD FREE SOLDER//SOLDER//SOLDERING & SURFACE MOUNT TECHNOLOGY | 15297 |
| 12046 | 1 | WIRE BONDING//THERMOSONIC WIRE BONDING//ULTRASONIC WIRE BONDING | 963 |
Terms with highest relevance score |
| rank | Category | termType | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
|---|---|---|---|---|---|---|
| 1 | WIRE BONDING | authKW | 2236326 | 13% | 55% | 124 |
| 2 | THERMOSONIC WIRE BONDING | authKW | 525436 | 2% | 94% | 17 |
| 3 | ULTRASONIC WIRE BONDING | authKW | 525436 | 2% | 94% | 17 |
| 4 | ULTRASONIC BONDING | authKW | 496043 | 2% | 63% | 24 |
| 5 | COPPER WIRE BONDING | authKW | 490893 | 2% | 100% | 15 |
| 6 | ULTRASONIC PLASTIC WELDING | authKW | 465436 | 2% | 89% | 16 |
| 7 | THERMOSONIC BONDING | authKW | 368712 | 1% | 87% | 13 |
| 8 | ULTRASONIC WEDGE BONDING | authKW | 359988 | 1% | 100% | 11 |
| 9 | MICROJOINING | address | 350599 | 3% | 36% | 30 |
| 10 | FREE AIR BALL | authKW | 327262 | 1% | 100% | 10 |
Web of Science journal categories |
| chi_square_rank | Category | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
|---|---|---|---|---|---|
| 1 | Engineering, Manufacturing | 5970 | 14% | 0% | 134 |
| 2 | Engineering, Electrical & Electronic | 5806 | 46% | 0% | 442 |
| 3 | Physics, Applied | 4538 | 45% | 0% | 429 |
| 4 | Materials Science, Multidisciplinary | 3366 | 42% | 0% | 408 |
| 5 | Nanoscience & Nanotechnology | 3255 | 21% | 0% | 198 |
| 6 | Metallurgy & Metallurgical Engineering | 1076 | 12% | 0% | 115 |
| 7 | Materials Science, Coatings & Films | 214 | 4% | 0% | 37 |
| 8 | Acoustics | 211 | 3% | 0% | 30 |
| 9 | Engineering, Mechanical | 171 | 5% | 0% | 50 |
| 10 | Physics, Condensed Matter | 125 | 8% | 0% | 78 |
Address terms |
| chi_square_rank | term | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
|---|---|---|---|---|---|
| 1 | MICROJOINING | 350599 | 3% | 36% | 30 |
| 2 | ADV MAT JOINING | 193726 | 3% | 20% | 30 |
| 3 | PACKAGING RND ADV MFG ENGN | 98179 | 0% | 100% | 3 |
| 4 | NANOELECT ENGN INEE | 73632 | 0% | 75% | 3 |
| 5 | CENT CHARACTERISAT | 65452 | 0% | 100% | 2 |
| 6 | ELECT WIRE MAT RD | 65452 | 0% | 100% | 2 |
| 7 | GLOBAL PACKAGING ENGN | 65452 | 0% | 100% | 2 |
| 8 | SCG IND M SDN BHD | 65452 | 0% | 100% | 2 |
| 9 | ULTRASON BONDING | 65452 | 0% | 100% | 2 |
| 10 | MAT PLICAT | 63101 | 1% | 21% | 9 |
Journals |
| chi_square_rank | term | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
|---|---|---|---|---|---|
| 1 | MICROELECTRONICS RELIABILITY | 61850 | 12% | 2% | 118 |
| 2 | MICROELECTRONICS INTERNATIONAL | 33243 | 2% | 5% | 19 |
| 3 | IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY | 21262 | 3% | 2% | 29 |
| 4 | IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES | 19203 | 3% | 2% | 26 |
| 5 | JOURNAL OF ELECTRONIC PACKAGING | 18792 | 3% | 2% | 27 |
| 6 | IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING | 18566 | 2% | 4% | 15 |
| 7 | IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY | 15420 | 3% | 2% | 26 |
| 8 | JOURNAL OF ELECTRONIC MATERIALS | 11402 | 6% | 1% | 60 |
| 9 | GOLD BULLETIN | 7318 | 1% | 2% | 10 |
| 10 | IEEE TRANSACTIONS ON ADVANCED PACKAGING | 6311 | 1% | 1% | 14 |
Author Key Words |
| chi_square_rank | term | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass | LCSH search | Wikipedia search |
|---|---|---|---|---|---|---|---|
| 1 | WIRE BONDING | 2236326 | 13% | 55% | 124 | Search WIRE+BONDING | Search WIRE+BONDING |
| 2 | THERMOSONIC WIRE BONDING | 525436 | 2% | 94% | 17 | Search THERMOSONIC+WIRE+BONDING | Search THERMOSONIC+WIRE+BONDING |
| 3 | ULTRASONIC WIRE BONDING | 525436 | 2% | 94% | 17 | Search ULTRASONIC+WIRE+BONDING | Search ULTRASONIC+WIRE+BONDING |
| 4 | ULTRASONIC BONDING | 496043 | 2% | 63% | 24 | Search ULTRASONIC+BONDING | Search ULTRASONIC+BONDING |
| 5 | COPPER WIRE BONDING | 490893 | 2% | 100% | 15 | Search COPPER+WIRE+BONDING | Search COPPER+WIRE+BONDING |
| 6 | ULTRASONIC PLASTIC WELDING | 465436 | 2% | 89% | 16 | Search ULTRASONIC+PLASTIC+WELDING | Search ULTRASONIC+PLASTIC+WELDING |
| 7 | THERMOSONIC BONDING | 368712 | 1% | 87% | 13 | Search THERMOSONIC+BONDING | Search THERMOSONIC+BONDING |
| 8 | ULTRASONIC WEDGE BONDING | 359988 | 1% | 100% | 11 | Search ULTRASONIC+WEDGE+BONDING | Search ULTRASONIC+WEDGE+BONDING |
| 9 | FREE AIR BALL | 327262 | 1% | 100% | 10 | Search FREE+AIR+BALL | Search FREE+AIR+BALL |
| 10 | THERMOSONIC | 263986 | 1% | 73% | 11 | Search THERMOSONIC | Search THERMOSONIC |
Core articles |
The table includes core articles in the class. The following variables is taken into account for the relevance score of an article in a cluster c: (1) Number of references referring to publications in the class. (2) Share of total number of active references referring to publications in the class. (3) Age of the article. New articles get higher score than old articles. (4) Citation rate, normalized to year. |
Classes with closest relation at Level 1 |