Class information for: |
Basic class information |
Hierarchy of classes |
The table includes all classes above and classes immediately below the current class. |
| Cluster id | Level | Cluster label | #P |
|---|---|---|---|
| 1 | 4 | PHYSICS, CONDENSED MATTER//PHYSICS, APPLIED//MATERIALS SCIENCE, MULTIDISCIPLINARY | 2188495 |
| 396 | 3 | LEAD FREE SOLDER//SOLDER//ELECTROMIGRATION | 32184 |
| 535 | 2 | LEAD FREE SOLDER//SOLDER//SOLDERING & SURFACE MOUNT TECHNOLOGY | 15297 |
| 20699 | 1 | POPCORN CRACKING//LEADFRAME//FAILURE PATH | 473 |
Terms with highest relevance score |
| rank | Category | termType | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
|---|---|---|---|---|---|---|
| 1 | POPCORN CRACKING | authKW | 333154 | 1% | 100% | 5 |
| 2 | LEADFRAME | authKW | 333144 | 2% | 50% | 10 |
| 3 | FAILURE PATH | authKW | 239866 | 1% | 60% | 6 |
| 4 | EPOXY MOLDING COMPOUND | authKW | 237112 | 2% | 32% | 11 |
| 5 | POPCORNING | authKW | 213217 | 1% | 80% | 4 |
| 6 | HYGROSCOPIC SWELLING | authKW | 208217 | 1% | 63% | 5 |
| 7 | BLACK OXIDE COATING | authKW | 199892 | 1% | 100% | 3 |
| 8 | COPPER BASED LEADFRAME | authKW | 199892 | 1% | 100% | 3 |
| 9 | CU BASED LEADFRAME | authKW | 199892 | 1% | 100% | 3 |
| 10 | DIE BONDING MATERIAL | authKW | 199892 | 1% | 100% | 3 |
Web of Science journal categories |
| chi_square_rank | Category | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
|---|---|---|---|---|---|
| 1 | Engineering, Manufacturing | 3423 | 15% | 0% | 71 |
| 2 | Engineering, Electrical & Electronic | 2849 | 46% | 0% | 217 |
| 3 | Materials Science, Multidisciplinary | 2052 | 47% | 0% | 221 |
| 4 | Nanoscience & Nanotechnology | 1171 | 18% | 0% | 84 |
| 5 | Mechanics | 772 | 15% | 0% | 70 |
| 6 | Engineering, Mechanical | 604 | 12% | 0% | 58 |
| 7 | Physics, Applied | 537 | 24% | 0% | 112 |
| 8 | Materials Science, Characterization, Testing | 172 | 3% | 0% | 12 |
| 9 | Materials Science, Composites | 168 | 3% | 0% | 14 |
| 10 | Engineering, Chemical | 112 | 8% | 0% | 37 |
Address terms |
| chi_square_rank | term | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
|---|---|---|---|---|---|
| 1 | ATO INNOVAT | 99943 | 1% | 50% | 3 |
| 2 | PACKAGING DEV TEAM | 88840 | 0% | 67% | 2 |
| 3 | ADV MAT RD TEAM | 66631 | 0% | 100% | 1 |
| 4 | BACKEND TECHNOL | 66631 | 0% | 100% | 1 |
| 5 | CORP ASSEMBLY TESTING | 66631 | 0% | 100% | 1 |
| 6 | CORP BACKENDS QUAL MANAGEMENT QUAL RELIABIL | 66631 | 0% | 100% | 1 |
| 7 | ERICH MID MAT SCI ESI | 66631 | 0% | 100% | 1 |
| 8 | GERATEWERK AMBERG | 66631 | 0% | 100% | 1 |
| 9 | GRENZFLACHENCHEM | 66631 | 0% | 100% | 1 |
| 10 | ISEFC | 66631 | 0% | 100% | 1 |
Journals |
| chi_square_rank | term | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
|---|---|---|---|---|---|
| 1 | JOURNAL OF ELECTRONIC PACKAGING | 84132 | 8% | 3% | 40 |
| 2 | IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES | 66971 | 7% | 3% | 34 |
| 3 | IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING | 62767 | 4% | 5% | 19 |
| 4 | MICROELECTRONICS RELIABILITY | 45620 | 15% | 1% | 71 |
| 5 | IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART A | 24706 | 3% | 3% | 12 |
| 6 | IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY | 20605 | 4% | 2% | 20 |
| 7 | JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY | 16101 | 6% | 1% | 29 |
| 8 | IEEE TRANSACTIONS ON ADVANCED PACKAGING | 7945 | 2% | 1% | 11 |
| 9 | IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING | 6046 | 1% | 2% | 6 |
| 10 | IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY | 4640 | 2% | 1% | 10 |
Author Key Words |
| chi_square_rank | term | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass | LCSH search | Wikipedia search |
|---|---|---|---|---|---|---|---|
| 1 | POPCORN CRACKING | 333154 | 1% | 100% | 5 | Search POPCORN+CRACKING | Search POPCORN+CRACKING |
| 2 | LEADFRAME | 333144 | 2% | 50% | 10 | Search LEADFRAME | Search LEADFRAME |
| 3 | FAILURE PATH | 239866 | 1% | 60% | 6 | Search FAILURE+PATH | Search FAILURE+PATH |
| 4 | EPOXY MOLDING COMPOUND | 237112 | 2% | 32% | 11 | Search EPOXY+MOLDING+COMPOUND | Search EPOXY+MOLDING+COMPOUND |
| 5 | POPCORNING | 213217 | 1% | 80% | 4 | Search POPCORNING | Search POPCORNING |
| 6 | HYGROSCOPIC SWELLING | 208217 | 1% | 63% | 5 | Search HYGROSCOPIC+SWELLING | Search HYGROSCOPIC+SWELLING |
| 7 | BLACK OXIDE COATING | 199892 | 1% | 100% | 3 | Search BLACK+OXIDE+COATING | Search BLACK+OXIDE+COATING |
| 8 | COPPER BASED LEADFRAME | 199892 | 1% | 100% | 3 | Search COPPER+BASED+LEADFRAME | Search COPPER+BASED+LEADFRAME |
| 9 | CU BASED LEADFRAME | 199892 | 1% | 100% | 3 | Search CU+BASED+LEADFRAME | Search CU+BASED+LEADFRAME |
| 10 | DIE BONDING MATERIAL | 199892 | 1% | 100% | 3 | Search DIE+BONDING+MATERIAL | Search DIE+BONDING+MATERIAL |
Core articles |
The table includes core articles in the class. The following variables is taken into account for the relevance score of an article in a cluster c: (1) Number of references referring to publications in the class. (2) Share of total number of active references referring to publications in the class. (3) Age of the article. New articles get higher score than old articles. (4) Citation rate, normalized to year. |
Classes with closest relation at Level 1 |