Class information for: |
Basic class information |
Hierarchy of classes |
The table includes all classes above and classes immediately below the current class. |
Cluster id | Level | Cluster label | #P |
---|---|---|---|
1 | 4 | PHYSICS, CONDENSED MATTER//PHYSICS, APPLIED//MATERIALS SCIENCE, MULTIDISCIPLINARY | 2188495 |
396 | 3 | LEAD FREE SOLDER//SOLDER//ELECTROMIGRATION | 32184 |
535 | 2 | LEAD FREE SOLDER//SOLDER//SOLDERING & SURFACE MOUNT TECHNOLOGY | 15297 |
16702 | 1 | MOIRE INTERFEROMETRY//ELECTRON BEAM MOIRE//SHADOW MOIRE | 665 |
Terms with highest relevance score |
rank | Category | termType | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
---|---|---|---|---|---|---|
1 | MOIRE INTERFEROMETRY | authKW | 678558 | 8% | 26% | 56 |
2 | ELECTRON BEAM MOIRE | authKW | 290277 | 1% | 88% | 7 |
3 | SHADOW MOIRE | authKW | 233294 | 2% | 31% | 16 |
4 | ELECTRON MOIRE | authKW | 189570 | 1% | 100% | 4 |
5 | GEOMETRIC PHASE ANALYSIS | authKW | 166434 | 2% | 29% | 12 |
6 | MICROSCOPIC MOIRE INTERFEROMETRY | authKW | 151654 | 1% | 80% | 4 |
7 | NANO MOIRE | authKW | 151654 | 1% | 80% | 4 |
8 | FAR INFRARED FIZEAU INTERFEROMETRY | authKW | 142177 | 0% | 100% | 3 |
9 | SEM MOIRE | authKW | 142177 | 0% | 100% | 3 |
10 | SPOT CENTROID | authKW | 142177 | 0% | 100% | 3 |
Web of Science journal categories |
chi_square_rank | Category | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
---|---|---|---|---|---|
1 | Materials Science, Characterization, Testing | 13169 | 18% | 0% | 118 |
2 | Optics | 2962 | 28% | 0% | 189 |
3 | Mechanics | 2272 | 21% | 0% | 139 |
4 | Engineering, Mechanical | 1208 | 14% | 0% | 96 |
5 | Materials Science, Multidisciplinary | 1056 | 30% | 0% | 199 |
6 | Engineering, Manufacturing | 616 | 6% | 0% | 37 |
7 | Engineering, Electrical & Electronic | 416 | 17% | 0% | 112 |
8 | Instruments & Instrumentation | 348 | 8% | 0% | 53 |
9 | Materials Science, Composites | 172 | 3% | 0% | 17 |
10 | Nanoscience & Nanotechnology | 170 | 6% | 0% | 43 |
Address terms |
chi_square_rank | term | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
---|---|---|---|---|---|
1 | OPENING VACUUM PHYS | 94785 | 0% | 100% | 2 |
2 | MA INENWESEN | 94781 | 1% | 50% | 4 |
3 | AML | 82820 | 5% | 5% | 36 |
4 | ENG MECH | 53313 | 0% | 38% | 3 |
5 | 853 | 47392 | 0% | 100% | 1 |
6 | AILUN ASSOC IST | 47392 | 0% | 100% | 1 |
7 | ASSEMBLY TECHNOL DEV GRP | 47392 | 0% | 100% | 1 |
8 | BACHUS WORKS ADV METHODS GRP | 47392 | 0% | 100% | 1 |
9 | COMPOS COATINGS | 47392 | 0% | 100% | 1 |
10 | CRYSTALLINE SILICON RD | 47392 | 0% | 100% | 1 |
Journals |
chi_square_rank | term | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
---|---|---|---|---|---|
1 | EXPERIMENTAL MECHANICS | 91033 | 11% | 3% | 73 |
2 | JOURNAL OF ELECTRONIC PACKAGING | 48446 | 5% | 3% | 36 |
3 | OPTICS AND LASERS IN ENGINEERING | 46579 | 9% | 2% | 59 |
4 | IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES | 18149 | 3% | 2% | 21 |
5 | EXPERIMENTAL TECHNIQUES | 12554 | 2% | 2% | 16 |
6 | IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART A | 9876 | 1% | 2% | 9 |
7 | OPTICAL ENGINEERING | 4726 | 6% | 0% | 38 |
8 | STRAIN | 3965 | 1% | 1% | 8 |
9 | IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING | 2982 | 1% | 1% | 5 |
10 | IEEE TRANSACTIONS ON ADVANCED PACKAGING | 2981 | 1% | 1% | 8 |
Author Key Words |
Core articles |
The table includes core articles in the class. The following variables is taken into account for the relevance score of an article in a cluster c: (1) Number of references referring to publications in the class. (2) Share of total number of active references referring to publications in the class. (3) Age of the article. New articles get higher score than old articles. (4) Citation rate, normalized to year. |
Classes with closest relation at Level 1 |