Class information for: |
Basic class information |
Hierarchy of classes |
The table includes all classes above and classes immediately below the current class. |
Cluster id | Level | Cluster label | #P |
---|---|---|---|
1 | 4 | PHYSICS, CONDENSED MATTER//PHYSICS, APPLIED//MATERIALS SCIENCE, MULTIDISCIPLINARY | 2188495 |
396 | 3 | LEAD FREE SOLDER//SOLDER//ELECTROMIGRATION | 32184 |
535 | 2 | LEAD FREE SOLDER//SOLDER//SOLDERING & SURFACE MOUNT TECHNOLOGY | 15297 |
21049 | 1 | INTERFACIAL SHEARS//NON LOCAL STRESS CURVATURE RELATIONS//NON UNIFORM MISFIT STRAIN | 458 |
Terms with highest relevance score |
rank | Category | termType | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
---|---|---|---|---|---|---|
1 | INTERFACIAL SHEARS | authKW | 619317 | 2% | 100% | 9 |
2 | NON LOCAL STRESS CURVATURE RELATIONS | authKW | 481691 | 2% | 100% | 7 |
3 | NON UNIFORM MISFIT STRAIN | authKW | 481691 | 2% | 100% | 7 |
4 | STRESS CURVATURE RELATIONS | authKW | 275252 | 1% | 100% | 4 |
5 | COHERENT GRADIENT SENSING | authKW | 253346 | 2% | 41% | 9 |
6 | STONEYS FORMULA | authKW | 191143 | 1% | 56% | 5 |
7 | NON UNIFORM FILM THICKNESS | authKW | 137626 | 0% | 100% | 2 |
8 | NON UNIFORM WAFER CURVATURES | authKW | 137626 | 0% | 100% | 2 |
9 | NONUNIFORM FILM TEMPERATURES AND STRESSES | authKW | 137626 | 0% | 100% | 2 |
10 | WARPAGE ORIENTATION | authKW | 137626 | 0% | 100% | 2 |
Web of Science journal categories |
chi_square_rank | Category | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
---|---|---|---|---|---|
1 | Mechanics | 2386 | 26% | 0% | 117 |
2 | Physics, Applied | 1485 | 38% | 0% | 172 |
3 | Materials Science, Multidisciplinary | 1068 | 35% | 0% | 162 |
4 | Materials Science, Characterization, Testing | 966 | 6% | 0% | 27 |
5 | Materials Science, Coatings & Films | 651 | 9% | 0% | 41 |
6 | Engineering, Electrical & Electronic | 415 | 20% | 0% | 90 |
7 | Materials Science, Composites | 334 | 4% | 0% | 19 |
8 | Engineering, Mechanical | 276 | 9% | 0% | 40 |
9 | Physics, Condensed Matter | 211 | 13% | 0% | 60 |
10 | Nanoscience & Nanotechnology | 141 | 7% | 0% | 32 |
Address terms |
chi_square_rank | term | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
---|---|---|---|---|---|
1 | AEM GRP | 91749 | 0% | 67% | 2 |
2 | CIVIL ENGN MECH MECH DISASTER EN | 68813 | 0% | 100% | 1 |
3 | COUNCIL ITALY ISTI | 68813 | 0% | 100% | 1 |
4 | GEN ASSEMBLY COMPONENTS ENGN | 68813 | 0% | 100% | 1 |
5 | GEN ASSEMBLY TECH ENGN | 68813 | 0% | 100% | 1 |
6 | ILUMINATING ENGN LIGHT SOURCES | 68813 | 0% | 100% | 1 |
7 | PACKAGING DEV ASSEMBLEY | 68813 | 0% | 100% | 1 |
8 | QUAL ASSURANCE REB | 68813 | 0% | 100% | 1 |
9 | SANTA CATARINA STATE UNIV | 68813 | 0% | 100% | 1 |
10 | SHANGHAI LASER MAT PROC MODIFICAT | 68813 | 0% | 100% | 1 |
Journals |
chi_square_rank | term | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
---|---|---|---|---|---|
1 | JOURNAL OF ELECTRONIC PACKAGING | 33923 | 5% | 2% | 25 |
2 | JOURNAL OF APPLIED MECHANICS-TRANSACTIONS OF THE ASME | 6850 | 5% | 0% | 24 |
3 | EXPERIMENTAL MECHANICS | 4841 | 3% | 1% | 14 |
4 | INTERNATIONAL JOURNAL OF SOLIDS AND STRUCTURES | 2775 | 4% | 0% | 20 |
5 | MICROELECTRONICS RELIABILITY | 2080 | 3% | 0% | 15 |
6 | JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS | 2052 | 4% | 0% | 17 |
7 | ZAMM-ZEITSCHRIFT FUR ANGEWANDTE MATHEMATIK UND MECHANIK | 1801 | 1% | 1% | 5 |
8 | JOURNAL OF THE MECHANICS AND PHYSICS OF SOLIDS | 1564 | 2% | 0% | 9 |
9 | OPTICS AND LASERS IN ENGINEERING | 1560 | 2% | 0% | 9 |
10 | JOURNAL OF APPLIED PHYSICS | 1247 | 10% | 0% | 45 |
Author Key Words |
Core articles |
The table includes core articles in the class. The following variables is taken into account for the relevance score of an article in a cluster c: (1) Number of references referring to publications in the class. (2) Share of total number of active references referring to publications in the class. (3) Age of the article. New articles get higher score than old articles. (4) Citation rate, normalized to year. |
Classes with closest relation at Level 1 |