Class information for: |
Basic class information |
Hierarchy of classes |
The table includes all classes above and classes immediately below the current class. |
| Cluster id | Level | Cluster label | #P |
|---|---|---|---|
| 1 | 4 | PHYSICS, CONDENSED MATTER//PHYSICS, APPLIED//MATERIALS SCIENCE, MULTIDISCIPLINARY | 2188495 |
| 396 | 3 | LEAD FREE SOLDER//SOLDER//ELECTROMIGRATION | 32184 |
| 535 | 2 | LEAD FREE SOLDER//SOLDER//SOLDERING & SURFACE MOUNT TECHNOLOGY | 15297 |
| 27661 | 1 | PLASTIC ENCAPSULATED MICROCIRCUIT//DORMANT STORAGE//NONHERMETIC | 244 |
Terms with highest relevance score |
| rank | Category | termType | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
|---|---|---|---|---|---|---|
| 1 | PLASTIC ENCAPSULATED MICROCIRCUIT | authKW | 804805 | 4% | 69% | 9 |
| 2 | DORMANT STORAGE | authKW | 387501 | 1% | 100% | 3 |
| 3 | NONHERMETIC | authKW | 387501 | 1% | 100% | 3 |
| 4 | EPOXY COMPOSITIONS | authKW | 172222 | 1% | 67% | 2 |
| 5 | RELIABILITY COMPARISON | authKW | 172222 | 1% | 67% | 2 |
| 6 | 980 NM DIODES | authKW | 129167 | 0% | 100% | 1 |
| 7 | 980 NM LASER DIODE | authKW | 129167 | 0% | 100% | 1 |
| 8 | ACCELERATION FACTOR DETERMINATION | authKW | 129167 | 0% | 100% | 1 |
| 9 | ADHESION DELAMINATION | authKW | 129167 | 0% | 100% | 1 |
| 10 | ADV INTERCONNET | address | 129167 | 0% | 100% | 1 |
Web of Science journal categories |
| chi_square_rank | Category | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
|---|---|---|---|---|---|
| 1 | Engineering, Manufacturing | 3193 | 20% | 0% | 49 |
| 2 | Engineering, Electrical & Electronic | 1924 | 52% | 0% | 127 |
| 3 | Materials Science, Multidisciplinary | 465 | 32% | 0% | 79 |
| 4 | Computer Science, Hardware & Architecture | 390 | 7% | 0% | 18 |
| 5 | Nanoscience & Nanotechnology | 198 | 11% | 0% | 26 |
| 6 | Materials Science, Coatings & Films | 178 | 7% | 0% | 16 |
| 7 | Physics, Applied | 178 | 20% | 0% | 48 |
| 8 | Computer Science, Software Engineering | 149 | 6% | 0% | 15 |
| 9 | Electrochemistry | 119 | 7% | 0% | 16 |
| 10 | Engineering, General | 115 | 6% | 0% | 14 |
Address terms |
| chi_square_rank | term | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
|---|---|---|---|---|---|
| 1 | ADV INTERCONNET | 129167 | 0% | 100% | 1 |
| 2 | COMMERCIAL COMPONENT INSERT | 129167 | 0% | 100% | 1 |
| 3 | DENS ELECT | 129167 | 0% | 100% | 1 |
| 4 | M MCM GRP | 129167 | 0% | 100% | 1 |
| 5 | MATSUMOTO TORY ANALYT | 129167 | 0% | 100% | 1 |
| 6 | MATSUMOTO TORY IC FABRICAT | 129167 | 0% | 100% | 1 |
| 7 | OPTOELECT ORG | 129167 | 0% | 100% | 1 |
| 8 | PORTSMOUTH IL | 129167 | 0% | 100% | 1 |
| 9 | SACRAMENTO ENGN S | 129167 | 0% | 100% | 1 |
| 10 | SEMICOND FABRICAT MAT GRP | 129167 | 0% | 100% | 1 |
Journals |
| chi_square_rank | term | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
|---|---|---|---|---|---|
| 1 | IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY | 115594 | 14% | 3% | 34 |
| 2 | JOHNS HOPKINS APL TECHNICAL DIGEST | 13552 | 4% | 1% | 9 |
| 3 | MICROELECTRONICS RELIABILITY | 9263 | 9% | 0% | 23 |
| 4 | IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING | 8421 | 2% | 1% | 5 |
| 5 | IEEE TRANSACTIONS ON RELIABILITY | 8211 | 6% | 0% | 14 |
| 6 | INDUSTRIAL RESEARCH & DEVELOPMENT | 6978 | 1% | 3% | 2 |
| 7 | IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES | 5495 | 3% | 1% | 7 |
| 8 | IEEE ELECTRICAL INSULATION MAGAZINE | 3884 | 2% | 1% | 4 |
| 9 | CONNECTOR SPECIFIER | 3489 | 0% | 3% | 1 |
| 10 | IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART A | 2990 | 1% | 1% | 3 |
Author Key Words |
Core articles |
The table includes core articles in the class. The following variables is taken into account for the relevance score of an article in a cluster c: (1) Number of references referring to publications in the class. (2) Share of total number of active references referring to publications in the class. (3) Age of the article. New articles get higher score than old articles. (4) Citation rate, normalized to year. |
Classes with closest relation at Level 1 |