Class information for: |
Basic class information |
Hierarchy of classes |
The table includes all classes above and classes immediately below the current class. |
Terms with highest relevance score |
| rank | Category | termType | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
|---|---|---|---|---|---|---|
| 1 | IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY | journal | 336894 | 19% | 6% | 73 |
| 2 | THERMAL ENGN TECHNOL | address | 163298 | 1% | 100% | 2 |
| 3 | IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING | journal | 133192 | 6% | 7% | 25 |
| 4 | IPEM | authKW | 108864 | 1% | 67% | 2 |
| 5 | IBM JOURNAL OF RESEARCH AND DEVELOPMENT | journal | 90725 | 12% | 2% | 47 |
| 6 | ACTIVE EDGE STRIP SENSORS | authKW | 81649 | 0% | 100% | 1 |
| 7 | ACTIVE SUBSTRATE TEST STRUCTURES | authKW | 81649 | 0% | 100% | 1 |
| 8 | ADAPTIVE POWER RATE SCHEDULING | authKW | 81649 | 0% | 100% | 1 |
| 9 | ADHENS MECH | address | 81649 | 0% | 100% | 1 |
| 10 | AFFNIFTY | authKW | 81649 | 0% | 100% | 1 |
Web of Science journal categories |
| chi_square_rank | Category | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
|---|---|---|---|---|---|
| 1 | Engineering, Manufacturing | 10076 | 28% | 0% | 109 |
| 2 | Engineering, Electrical & Electronic | 4869 | 65% | 0% | 251 |
| 3 | Computer Science, Hardware & Architecture | 4772 | 20% | 0% | 77 |
| 4 | Computer Science, Software Engineering | 1798 | 16% | 0% | 62 |
| 5 | Computer Science, Information Systems | 956 | 13% | 0% | 52 |
| 6 | Computer Science, Theory & Methods | 899 | 14% | 0% | 53 |
| 7 | Materials Science, Multidisciplinary | 777 | 33% | 0% | 128 |
| 8 | Physics, Applied | 155 | 16% | 0% | 60 |
| 9 | Physics, Condensed Matter | 40 | 8% | 0% | 29 |
| 10 | Instruments & Instrumentation | 35 | 4% | 0% | 15 |
Address terms |
| chi_square_rank | term | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
|---|---|---|---|---|---|
| 1 | THERMAL ENGN TECHNOL | 163298 | 1% | 100% | 2 |
| 2 | ADHENS MECH | 81649 | 0% | 100% | 1 |
| 3 | ASME ADV THERMAL | 81649 | 0% | 100% | 1 |
| 4 | DENSEN WORKS | 81649 | 0% | 100% | 1 |
| 5 | DISCRETE DEVICES DEV | 81649 | 0% | 100% | 1 |
| 6 | ENGN 4TH | 81649 | 0% | 100% | 1 |
| 7 | HIGH END POWER SYST DEV | 81649 | 0% | 100% | 1 |
| 8 | ICC DIAGONAL | 81649 | 0% | 100% | 1 |
| 9 | MECH DESIGN COOLING | 81649 | 0% | 100% | 1 |
| 10 | MIDRANGE SYST | 81649 | 0% | 100% | 1 |
Journals |
| chi_square_rank | term | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
|---|---|---|---|---|---|
| 1 | IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY | 336894 | 19% | 6% | 73 |
| 2 | IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING | 133192 | 6% | 7% | 25 |
| 3 | IBM JOURNAL OF RESEARCH AND DEVELOPMENT | 90725 | 12% | 2% | 47 |
| 4 | JOURNAL OF ELECTRONIC TESTING-THEORY AND APPLICATIONS | 18902 | 4% | 1% | 16 |
| 5 | SOLID STATE TECHNOLOGY | 15818 | 5% | 1% | 19 |
| 6 | IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART A | 10298 | 2% | 2% | 7 |
| 7 | NEC RESEARCH & DEVELOPMENT | 6730 | 2% | 1% | 6 |
| 8 | IEEE TRANSACTIONS ON ADVANCED PACKAGING | 6517 | 2% | 1% | 9 |
| 9 | ELECTRONICS | 5171 | 1% | 1% | 5 |
| 10 | GEC JOURNAL OF RESEARCH | 4266 | 1% | 2% | 3 |
Author Key Words |
Core articles |
The table includes core articles in the class. The following variables is taken into account for the relevance score of an article in a cluster c: (1) Number of references referring to publications in the class. (2) Share of total number of active references referring to publications in the class. (3) Age of the article. New articles get higher score than old articles. (4) Citation rate, normalized to year. |
Classes with closest relation at Level 1 |