Class information for: |
Basic class information |
Hierarchy of classes |
The table includes all classes above and classes immediately below the current class. |
Terms with highest relevance score |
rank | Category | termType | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
---|---|---|---|---|---|---|
1 | SIMULTANEOUS SWITCHING NOISE | authKW | 1947481 | 7% | 85% | 70 |
2 | SIMULTANEOUS SWITCHING NOISE SSN | authKW | 1461781 | 6% | 77% | 58 |
3 | POWER INTEGRITY | authKW | 888765 | 5% | 58% | 47 |
4 | SIGNAL INTEGRITY | authKW | 729110 | 9% | 25% | 89 |
5 | DECOUPLING CAPACITOR | authKW | 660028 | 4% | 51% | 40 |
6 | SIGNAL INTEGRITY SI | authKW | 659933 | 4% | 56% | 36 |
7 | POWER DISTRIBUTION NETWORK PDN | authKW | 614089 | 3% | 61% | 31 |
8 | POWER BUS | authKW | 554044 | 2% | 100% | 17 |
9 | ELECTROMAGNETIC BANDGAP EBG | authKW | 505065 | 6% | 25% | 62 |
10 | POWER PLANE | authKW | 490778 | 2% | 94% | 16 |
Web of Science journal categories |
chi_square_rank | Category | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
---|---|---|---|---|---|
1 | Engineering, Electrical & Electronic | 20213 | 83% | 0% | 801 |
2 | Telecommunications | 11681 | 30% | 0% | 287 |
3 | Engineering, Manufacturing | 5676 | 14% | 0% | 131 |
4 | Materials Science, Multidisciplinary | 1131 | 26% | 0% | 254 |
5 | Computer Science, Hardware & Architecture | 279 | 3% | 0% | 32 |
6 | Optics | 105 | 6% | 0% | 56 |
7 | Computer Science, Information Systems | 18 | 2% | 0% | 17 |
8 | Physics, Applied | 16 | 6% | 0% | 58 |
9 | Computer Science, Interdisciplinary Applications | 8 | 1% | 0% | 14 |
10 | Computer Science, Theory & Methods | 5 | 1% | 0% | 13 |
Address terms |
chi_square_rank | term | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
---|---|---|---|---|---|
1 | ELE OMAGNET COMPATIBIL | 202240 | 3% | 21% | 30 |
2 | TERAHERTZ INTERCONNECT PACKAGE | 187711 | 1% | 48% | 12 |
3 | UAQ EMC | 175889 | 2% | 23% | 23 |
4 | THEORET ELEKTROTECH | 175574 | 2% | 28% | 19 |
5 | ELECT CAD | 130339 | 2% | 25% | 16 |
6 | GRP COMPATIBILITAT ELE OMAGNET | 104289 | 0% | 80% | 4 |
7 | MASTER PROGRAM COMMUN ENGN | 104289 | 0% | 80% | 4 |
8 | ADV ASSEMBLY | 97773 | 0% | 100% | 3 |
9 | PACKAGING CORE COMPETENCE | 97773 | 0% | 100% | 3 |
10 | ELECT COMP AIDED DESIGN | 86906 | 0% | 67% | 4 |
Journals |
chi_square_rank | term | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
---|---|---|---|---|---|
1 | IEEE TRANSACTIONS ON ADVANCED PACKAGING | 433137 | 12% | 11% | 116 |
2 | IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY | 378913 | 20% | 6% | 196 |
3 | IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY | 160654 | 9% | 6% | 84 |
4 | IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING | 92607 | 3% | 9% | 33 |
5 | IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS | 20266 | 5% | 1% | 50 |
6 | IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES | 19871 | 9% | 1% | 89 |
7 | PROGRESS IN ELECTROMAGNETICS RESEARCH-PIER | 4288 | 2% | 1% | 19 |
8 | MICROWAVE AND OPTICAL TECHNOLOGY LETTERS | 4284 | 5% | 0% | 45 |
9 | IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY | 3611 | 1% | 1% | 12 |
10 | JOURNAL OF ELECTROMAGNETIC WAVES AND APPLICATIONS | 2873 | 2% | 0% | 19 |
Author Key Words |
Core articles |
The table includes core articles in the class. The following variables is taken into account for the relevance score of an article in a cluster c: (1) Number of references referring to publications in the class. (2) Share of total number of active references referring to publications in the class. (3) Age of the article. New articles get higher score than old articles. (4) Citation rate, normalized to year. |
Classes with closest relation at Level 1 |