Class information for: |
Basic class information |
Hierarchy of classes |
The table includes all classes above and classes immediately below the current class. |
Terms with highest relevance score |
| rank | Category | termType | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
|---|---|---|---|---|---|---|
| 1 | 11494 | authKW | 556181 | 2% | 100% | 3 |
| 2 | HIGH PINCOUNT BOARD CONNECTORS | authKW | 556181 | 2% | 100% | 3 |
| 3 | PACKAGE AND PRINTED CIRCUIT BOARD PCB EFFECTS | authKW | 370787 | 1% | 100% | 2 |
| 4 | RFIC PACKAGES | authKW | 370787 | 1% | 100% | 2 |
| 5 | THINK SHRINK SMALL OUTLINE PACKAGES | authKW | 370787 | 1% | 100% | 2 |
| 6 | ELECTRONICS TESTING | authKW | 247190 | 1% | 67% | 2 |
| 7 | GHZ FREQUENCY | authKW | 247190 | 1% | 67% | 2 |
| 8 | PCB TESTING | authKW | 247190 | 1% | 67% | 2 |
| 9 | 11494 ANALOGUE BOUNDARY SCAN | authKW | 185394 | 1% | 100% | 1 |
| 10 | ACF FLIP CHIP INTERCONNECTION | authKW | 185394 | 1% | 100% | 1 |
Web of Science journal categories |
| chi_square_rank | Category | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
|---|---|---|---|---|---|
| 1 | Engineering, Electrical & Electronic | 2591 | 71% | 0% | 121 |
| 2 | Engineering, Manufacturing | 1597 | 17% | 0% | 29 |
| 3 | Materials Science, Multidisciplinary | 351 | 34% | 0% | 57 |
| 4 | Telecommunications | 212 | 10% | 0% | 17 |
| 5 | Engineering, Industrial | 61 | 4% | 0% | 6 |
| 6 | Operations Research & Management Science | 31 | 4% | 0% | 6 |
| 7 | Computer Science, Interdisciplinary Applications | 19 | 4% | 0% | 6 |
| 8 | Optics | 14 | 5% | 0% | 9 |
| 9 | Physics, Applied | 6 | 7% | 0% | 12 |
| 10 | Computer Science, Software Engineering | 5 | 2% | 0% | 3 |
Address terms |
| chi_square_rank | term | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
|---|---|---|---|---|---|
| 1 | ADV CONCEPTS GR | 185394 | 1% | 100% | 1 |
| 2 | ADV SEMICOND PACKAGING ASPAC | 185394 | 1% | 100% | 1 |
| 3 | ADV SEMICOND PACKAGING ASPAC GRP | 185394 | 1% | 100% | 1 |
| 4 | CLIN IMMUNOL S PEDIAT | 185394 | 1% | 100% | 1 |
| 5 | DIGITAL HOME BU | 185394 | 1% | 100% | 1 |
| 6 | OME OPERAT | 185394 | 1% | 100% | 1 |
| 7 | OPTOELE ON MEASUREMENT TECH | 185394 | 1% | 100% | 1 |
| 8 | RF ANALOG DESIGN TRANSMISS TEST PROD LINE | 185394 | 1% | 100% | 1 |
| 9 | SUBMICRON IL IND AFFILIATES PROGRAM | 185394 | 1% | 100% | 1 |
| 10 | TEST MEASUREMENT S | 185394 | 1% | 100% | 1 |
Journals |
| chi_square_rank | term | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
|---|---|---|---|---|---|
| 1 | IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING | 94848 | 8% | 4% | 14 |
| 2 | IEEE TRANSACTIONS ON ADVANCED PACKAGING | 66096 | 11% | 2% | 19 |
| 3 | IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY | 11614 | 5% | 1% | 9 |
| 4 | JOURNAL OF ELECTRONIC TESTING-THEORY AND APPLICATIONS | 10732 | 5% | 1% | 8 |
| 5 | MICROWAVE JOURNAL | 6639 | 5% | 0% | 8 |
| 6 | IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES | 4127 | 10% | 0% | 17 |
| 7 | INTERNATIONAL JOURNAL OF RF AND MICROWAVE COMPUTER-AIDED ENGINEERING | 3547 | 3% | 0% | 5 |
| 8 | JOURNAL OF ELECTRONIC PACKAGING | 2335 | 2% | 0% | 4 |
| 9 | IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING | 1869 | 1% | 1% | 2 |
| 10 | IEE PROCEEDINGS-H MICROWAVES ANTENNAS AND PROPAGATION | 1617 | 2% | 0% | 3 |
Author Key Words |
Core articles |
The table includes core articles in the class. The following variables is taken into account for the relevance score of an article in a cluster c: (1) Number of references referring to publications in the class. (2) Share of total number of active references referring to publications in the class. (3) Age of the article. New articles get higher score than old articles. (4) Citation rate, normalized to year. |
Classes with closest relation at Level 1 |