Class information for: |
Basic class information |
Hierarchy of classes |
The table includes all classes above and classes immediately below the current class. |
Terms with highest relevance score |
| rank | Category | termType | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
|---|---|---|---|---|---|---|
| 1 | IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING | journal | 733403 | 11% | 22% | 351 |
| 2 | RUN TO RUN CONTROL | authKW | 406944 | 2% | 75% | 57 |
| 3 | VIRTUAL METROLOGY | authKW | 291536 | 1% | 88% | 35 |
| 4 | MARCH TEST | authKW | 230362 | 1% | 73% | 33 |
| 5 | MEMORY TESTING | authKW | 208018 | 2% | 43% | 51 |
| 6 | IEEE JOURNAL OF SOLID-STATE CIRCUITS | journal | 193367 | 13% | 5% | 414 |
| 7 | CRITICAL AREA | authKW | 177931 | 1% | 69% | 27 |
| 8 | BUILT IN SELF REPAIR BISR | authKW | 137457 | 1% | 76% | 19 |
| 9 | VIRTUAL METROLOGY VM | authKW | 133278 | 0% | 100% | 14 |
| 10 | BUILT IN REDUNDANCY ANALYSIS BIRA | authKW | 123758 | 0% | 100% | 13 |
Web of Science journal categories |
| chi_square_rank | Category | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
|---|---|---|---|---|---|
| 1 | Engineering, Electrical & Electronic | 45521 | 68% | 0% | 2243 |
| 2 | Engineering, Manufacturing | 32378 | 17% | 1% | 576 |
| 3 | Computer Science, Hardware & Architecture | 30885 | 17% | 1% | 575 |
| 4 | Physics, Applied | 4225 | 25% | 0% | 824 |
| 5 | Physics, Condensed Matter | 2165 | 15% | 0% | 501 |
| 6 | Computer Science, Software Engineering | 1801 | 6% | 0% | 193 |
| 7 | Computer Science, Theory & Methods | 1423 | 6% | 0% | 209 |
| 8 | Engineering, Industrial | 1365 | 4% | 0% | 125 |
| 9 | Operations Research & Management Science | 1333 | 5% | 0% | 165 |
| 10 | Computer Science, Information Systems | 783 | 5% | 0% | 153 |
Address terms |
| chi_square_rank | term | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
|---|---|---|---|---|---|
| 1 | PROBE TEST ENGN TEAM | 38079 | 0% | 100% | 4 |
| 2 | SECT COMP ENGN | 30462 | 0% | 80% | 4 |
| 3 | DEFECT REDUCT TECHNOL | 28560 | 0% | 100% | 3 |
| 4 | ENGN ADV ELECT MAT PROC | 28560 | 0% | 100% | 3 |
| 5 | MICROMECHATRON | 26356 | 0% | 46% | 6 |
| 6 | ADV RELIABLE SYST | 25384 | 0% | 67% | 4 |
| 7 | MFG INFORMAT SYST | 19740 | 1% | 12% | 18 |
| 8 | ADV TEST CHIP | 19040 | 0% | 100% | 2 |
| 9 | ALGORITHM LANGUAGES | 19040 | 0% | 100% | 2 |
| 10 | AUTOMATED PRECIS MFG | 19040 | 0% | 100% | 2 |
Journals |
| chi_square_rank | term | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
|---|---|---|---|---|---|
| 1 | IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING | 733403 | 11% | 22% | 351 |
| 2 | IEEE JOURNAL OF SOLID-STATE CIRCUITS | 193367 | 13% | 5% | 414 |
| 3 | IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY | 50644 | 3% | 6% | 83 |
| 4 | JOURNAL OF ELECTRONIC TESTING-THEORY AND APPLICATIONS | 36310 | 2% | 6% | 65 |
| 5 | IEEE DESIGN & TEST OF COMPUTERS | 33464 | 2% | 6% | 59 |
| 6 | SOLID STATE TECHNOLOGY | 27149 | 2% | 4% | 73 |
| 7 | IBM JOURNAL OF RESEARCH AND DEVELOPMENT | 22689 | 2% | 3% | 69 |
| 8 | IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING | 20850 | 1% | 8% | 29 |
| 9 | IEEE TRANSACTIONS ON COMPUTERS | 18202 | 3% | 2% | 101 |
| 10 | IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS | 16088 | 3% | 2% | 92 |
Author Key Words |
Core articles |
The table includes core articles in the class. The following variables is taken into account for the relevance score of an article in a cluster c: (1) Number of references referring to publications in the class. (2) Share of total number of active references referring to publications in the class. (3) Age of the article. New articles get higher score than old articles. (4) Citation rate, normalized to year. |
Classes with closest relation at Level 2 |