Class information for:
Level 2: PLASMA ETCHING//ELECT DEVICES MAT TECHNOL//JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A

Basic class information
Bar chart of Publication_year

Last years might be incomplete

Hierarchy of classes
The table includes all classes above and classes immediately below the current class.


Cluster id Level Cluster label #P
15 4 METALLURGY & METALLURGICAL ENGINEERING//MATERIALS SCIENCE, MULTIDISCIPLINARY//MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING 827627
419 3       PLASMA SOURCES SCIENCE & TECHNOLOGY//REVIEW OF SCIENTIFIC INSTRUMENTS//JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A 30297
1480 2             PLASMA ETCHING//ELECT DEVICES MAT TECHNOL//JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A 7897
1654 1                   SIO2 ETCHING//PLASMA ETCHING//JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A 2575
6201 1                   FUJIMI KU//JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B//DRY ETCHING 1542
7198 1                   SOLID STATE TECHNOLOGY//AFTER CORROSION//AL SI CU ETCHING 1421
16132 1                   ELECT DEVICES MAT TECHNOL//ETCH MECHANISM//MICROELECT DEVICES MAT TECHNOL 698
17105 1                   ATOMIC LAYER ETCHING//GATE CHARGING//NEUTRAL BEAM ETCHING 645
22057 1                   POST ETCHING TREATMENTS//111 SPLIT INTERSTITIAL//AL1 WT PERCENT SI 418
27042 1                   INDUCTIVELY COUPLED PLASMA REACTIVE ION ETCHING//TI HARD MASK//MAGNETIC TUNNEL JUNCTION MATERIALS 259
28137 1                   WET ETCHING OF GLASS//EBEP//CURRENT BALANCE EQUATION 233
35843 1                   EXCIMER LASER MODIFICATION//AL ANODIZING//AMBIENT GAS SENSITIVITY 106

Terms with highest relevance score


rank Category termType chi_square shrOfCwithTerm shrOfTermInClass termInClass
1 PLASMA ETCHING authKW 259996 3% 30% 216
2 ELECT DEVICES MAT TECHNOL address 209030 1% 92% 57
3 JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A journal 197530 11% 6% 841
4 JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B journal 183547 11% 5% 880
5 DRY ETCHING authKW 174283 2% 31% 142
6 ETCHING authKW 158993 4% 12% 336
7 SIO2 ETCHING authKW 96517 0% 73% 33
8 PHYSICS, APPLIED WoSSC 94246 69% 0% 5432
9 REACTIVE ION ETCHING authKW 88829 1% 19% 116
10 RIE LAG authKW 83097 0% 83% 25

Web of Science journal categories


chi_square_rank Category chi_square shrOfCwithTerm shrOfTermInClass termInClass
1 Physics, Applied 94246 69% 0% 5432
2 Materials Science, Coatings & Films 74063 22% 1% 1754
3 Nanoscience & Nanotechnology 21121 18% 0% 1454
4 Engineering, Electrical & Electronic 14161 26% 0% 2086
5 Physics, Condensed Matter 6053 16% 0% 1278
6 Electrochemistry 2996 6% 0% 463
7 Materials Science, Multidisciplinary 1963 14% 0% 1134
8 Physics, Fluids & Plasmas 990 3% 0% 259
9 Instruments & Instrumentation 551 4% 0% 277
10 Chemistry, Physical 357 8% 0% 624

Address terms


chi_square_rank term chi_square shrOfCwithTerm shrOfTermInClass termInClass
1 ELECT DEVICES MAT TECHNOL 209030 1% 92% 57
2 TECHNOL MICROELECT 45570 1% 25% 45
3 FUJIMI KU 31912 0% 100% 8
4 ADV PLASMA SUR E TECHNOL 28006 1% 14% 50
5 MICROELECT DEVICES MAT TECHNOL 24963 0% 52% 12
6 LSI BASIC 24849 0% 69% 9
7 CONTROL RUMENTAT ENGN 21584 1% 9% 60
8 ELECT DEVICE SYST BUSINESS GRP 19945 0% 100% 5
9 MAT MACHINERY GRP 19945 0% 100% 5
10 SI SYST S 15956 0% 100% 4

Journals


chi_square_rank term chi_square shrOfCwithTerm shrOfTermInClass termInClass
1 JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A 197530 11% 6% 841
2 JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B 183547 11% 5% 880
3 JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS 31580 6% 2% 501
4 SOLID STATE TECHNOLOGY 27673 1% 6% 114
5 JOURNAL OF THE ELECTROCHEMICAL SOCIETY 25689 6% 1% 450
6 MICROELECTRONIC ENGINEERING 20564 3% 2% 233
7 VACUUM 10623 2% 2% 163
8 PLASMA CHEMISTRY AND PLASMA PROCESSING 10173 1% 4% 62
9 PLASMA SOURCES SCIENCE & TECHNOLOGY 9931 1% 3% 85
10 JOURNAL OF APPLIED PHYSICS 7841 6% 0% 479

Author Key Words


chi_square_rank term chi_square shrOfCwithTerm shrOfTermInClass termInClass LCSH search Wikipedia search
1 PLASMA ETCHING 259996 3% 30% 216 Search PLASMA+ETCHING Search PLASMA+ETCHING
2 DRY ETCHING 174283 2% 31% 142 Search DRY+ETCHING Search DRY+ETCHING
3 ETCHING 158993 4% 12% 336 Search ETCHING Search ETCHING
4 SIO2 ETCHING 96517 0% 73% 33 Search SIO2+ETCHING Search SIO2+ETCHING
5 REACTIVE ION ETCHING 88829 1% 19% 116 Search REACTIVE+ION+ETCHING Search REACTIVE+ION+ETCHING
6 RIE LAG 83097 0% 83% 25 Search RIE+LAG Search RIE+LAG
7 ETCH RATE 77948 1% 38% 51 Search ETCH+RATE Search ETCH+RATE
8 INDUCTIVELY COUPLED PLASMA REACTIVE ION ETCHING 67652 0% 81% 21 Search INDUCTIVELY+COUPLED+PLASMA+REACTIVE+ION+ETCHING Search INDUCTIVELY+COUPLED+PLASMA+REACTIVE+ION+ETCHING
9 RIE 66962 1% 31% 55 Search RIE Search RIE
10 ATOMIC LAYER ETCHING 57637 0% 85% 17 Search ATOMIC+LAYER+ETCHING Search ATOMIC+LAYER+ETCHING

Core articles
The table includes core articles in the class. The following variables is taken into account for the relevance score of an article in a cluster c:
(1) Number of references referring to publications in the class.
(2) Share of total number of active references referring to publications in the class.
(3) Age of the article. New articles get higher score than old articles.
(4) Citation rate, normalized to year.

Classes with closest relation at Level 2


rank cluster_id2 link
1 1265 PLASMA SOURCES SCIENCE & TECHNOLOGY//PLASMA SHEATHS//PHYSICS, FLUIDS & PLASMAS
2 3314 CLEANROOM//PHOTORESIST REMOVAL//MINIENVIRONMENT
3 1393 PLASMA POLYMERIZATION//LOW K//PLASMA PROCESSES AND POLYMERS
4 806 JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B//CHEMICALLY AMPLIFIED RESIST//JOURNAL OF PHOTOPOLYMER SCIENCE AND TECHNOLOGY
5 2801 IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING//RUN TO RUN CONTROL//VIRTUAL METROLOGY
6 3509 ELECTRON BEAM ANNEALING//ION SPUTTERING//NANORIPPLES
7 2467 HIPIMS//PNCA//HPPMS
8 3133 NUCLEAR INSTRUMENTS & METHODS IN PHYSICS RESEARCH SECTION B-BEAM INTERACTIONS WITH MATERIALS AND ATOMS//ION PHOTON EMISSION//SPUTTERING
9 1092 GALLIUM ARSENIDE//GAAS//SURFACE SCIENCE
10 1116 SILICON OXYNITRIDE//BORON PENETRATION//SILICON NITRIDE

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