Class information for:
Level 1: ELECT DEVICES MAT TECHNOL//ETCH MECHANISM//MICROELECT DEVICES MAT TECHNOL

Basic class information
Bar chart of Publication_year

Last years might be incomplete

Hierarchy of classes
The table includes all classes above and classes immediately below the current class.


Cluster id Level Cluster label #P
15 4 METALLURGY & METALLURGICAL ENGINEERING//MATERIALS SCIENCE, MULTIDISCIPLINARY//MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING 827627
419 3       PLASMA SOURCES SCIENCE & TECHNOLOGY//REVIEW OF SCIENTIFIC INSTRUMENTS//JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A 30297
1480 2             PLASMA ETCHING//ELECT DEVICES MAT TECHNOL//JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A 7897
16132 1                   ELECT DEVICES MAT TECHNOL//ETCH MECHANISM//MICROELECT DEVICES MAT TECHNOL 698

Terms with highest relevance score


rank Category termType chi_square shrOfCwithTerm shrOfTermInClass termInClass
1 ELECT DEVICES MAT TECHNOL address 1677873 7% 77% 48
2 ETCH MECHANISM authKW 491646 2% 78% 14
3 MICROELECT DEVICES MAT TECHNOL address 282677 2% 52% 12
4 ETCH RATE authKW 266113 4% 21% 28
5 CL 2 AR PLASMA authKW 232207 1% 86% 6
6 CL 2 AR authKW 180603 1% 67% 6
7 CONTROL RUMENTAT ENGN address 157055 7% 7% 48
8 HBR AR PLASMA authKW 135455 0% 100% 3
9 HFALO3 authKW 135455 0% 100% 3
10 MEMS PATTERNING authKW 135455 0% 100% 3

Web of Science journal categories


chi_square_rank Category chi_square shrOfCwithTerm shrOfTermInClass termInClass
1 Materials Science, Coatings & Films 11691 30% 0% 206
2 Physics, Applied 8808 71% 0% 493
3 Physics, Condensed Matter 1189 23% 0% 160
4 Nanoscience & Nanotechnology 1186 15% 0% 104
5 Engineering, Electrical & Electronic 829 22% 0% 154
6 Materials Science, Multidisciplinary 710 25% 0% 173
7 Electrochemistry 210 5% 0% 37
8 Optics 79 6% 0% 41
9 Physics, Fluids & Plasmas 63 3% 0% 20
10 Physics, Multidisciplinary 57 6% 0% 41

Address terms


chi_square_rank term chi_square shrOfCwithTerm shrOfTermInClass termInClass
1 ELECT DEVICES MAT TECHNOL 1677873 7% 77% 48
2 MICROELECT DEVICES MAT TECHNOL 282677 2% 52% 12
3 CONTROL RUMENTAT ENGN 157055 7% 7% 48
4 DEVICE MAT RD GRP 90303 0% 100% 2
5 COMP PL PHYS 86814 1% 19% 10
6 DONGJAK GU 85345 2% 13% 15
7 MAT DEVICE SECTOR 53950 1% 17% 7
8 EDUC TRAINING CETREE 45152 0% 100% 1
9 ELECT DEV MAT TECHNOL 45152 0% 100% 1
10 HEATING LIGHTING 45152 0% 100% 1

Journals


chi_square_rank term chi_square shrOfCwithTerm shrOfTermInClass termInClass
1 JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A 25063 13% 1% 89
2 INTEGRATED FERROELECTRICS 18109 6% 1% 40
3 MICROELECTRONIC ENGINEERING 6252 5% 0% 38
4 HIGH ENERGY CHEMISTRY 5759 3% 1% 19
5 JOURNAL OF THE KOREAN PHYSICAL SOCIETY 4122 5% 0% 38
6 PLASMA CHEMISTRY AND PLASMA PROCESSING 3645 2% 1% 11
7 THIN SOLID FILMS 3022 7% 0% 50
8 VACUUM 2637 3% 0% 24
9 JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B 2540 4% 0% 31
10 JOURNAL OF THE ELECTROCHEMICAL SOCIETY 1649 5% 0% 34

Author Key Words


chi_square_rank term chi_square shrOfCwithTerm shrOfTermInClass termInClass LCSH search Wikipedia search
1 ETCH MECHANISM 491646 2% 78% 14 Search ETCH+MECHANISM Search ETCH+MECHANISM
2 ETCH RATE 266113 4% 21% 28 Search ETCH+RATE Search ETCH+RATE
3 CL 2 AR PLASMA 232207 1% 86% 6 Search CL+2+AR+PLASMA Search CL+2+AR+PLASMA
4 CL 2 AR 180603 1% 67% 6 Search CL+2+AR Search CL+2+AR
5 HBR AR PLASMA 135455 0% 100% 3 Search HBR+AR+PLASMA Search HBR+AR+PLASMA
6 HFALO3 135455 0% 100% 3 Search HFALO3 Search HFALO3
7 MEMS PATTERNING 135455 0% 100% 3 Search MEMS+PATTERNING Search MEMS+PATTERNING
8 ETCHING DAMAGE 125629 1% 35% 8 Search ETCHING+DAMAGE Search ETCHING+DAMAGE
9 ETCHING MECHANISM 121897 1% 30% 9 Search ETCHING+MECHANISM Search ETCHING+MECHANISM
10 ETCHING 115434 12% 3% 85 Search ETCHING Search ETCHING

Core articles
The table includes core articles in the class. The following variables is taken into account for the relevance score of an article in a cluster c:
(1) Number of references referring to publications in the class.
(2) Share of total number of active references referring to publications in the class.
(3) Age of the article. New articles get higher score than old articles.
(4) Citation rate, normalized to year.

Classes with closest relation at Level 1


rank cluster_id2 link
1 27042 INDUCTIVELY COUPLED PLASMA REACTIVE ION ETCHING//TI HARD MASK//MAGNETIC TUNNEL JUNCTION MATERIALS
2 1654 SIO2 ETCHING//PLASMA ETCHING//JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A
3 21385 FORMING GAS ANNEALING//MEMORY DEVICES//025 MU M DESIGN RULE
4 19124 SOCIOTECHNO SCI TECHNOL//MAT STUDY TESTING//NAT MAT STUDY TESTING
5 28566 NISHI YODOGAWA KU//MEMS NANOTECHNOL EXCHANGE//FLETCHER
6 17999 RUTHENIUM FILMS//RUO2//RU
7 7198 SOLID STATE TECHNOLOGY//AFTER CORROSION//AL SI CU ETCHING
8 31719 PT TI LAYER//PT BOTTOM ELECTRODE//ADHESION LAYER
9 6538 PZT//PZT THICK FILM//PZT THICK FILMS
10 741 PLASMA SOURCES SCIENCE & TECHNOLOGY//CAPACITIVELY COUPLED PLASMA//PLASMA ATOM PHYS

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