Class information for: |
Basic class information |
Hierarchy of classes |
The table includes all classes above and classes immediately below the current class. |
Terms with highest relevance score |
rank | Category | termType | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
---|---|---|---|---|---|---|
1 | MASTERSLICE | authKW | 2075196 | 7% | 89% | 8 |
2 | 3D MMIC | authKW | 583649 | 2% | 100% | 2 |
3 | MICROWAVE POWER TRANSISTOR | authKW | 389098 | 2% | 67% | 2 |
4 | THREE DIMENSIONAL MMIC | authKW | 389098 | 2% | 67% | 2 |
5 | 1 9 GHZ CELLULAR PHONE SYSTEM | authKW | 291825 | 1% | 100% | 1 |
6 | 2 BAND ELIMINATION FILTER | authKW | 291825 | 1% | 100% | 1 |
7 | 3D MILLIMETER WAVE INTEGRATED CIRCUIT | authKW | 291825 | 1% | 100% | 1 |
8 | ADV INTEGRATED CIRCUIT PACKAGING GRP | address | 291825 | 1% | 100% | 1 |
9 | C4 GRP LOG TECHNOL DEV LTD | address | 291825 | 1% | 100% | 1 |
10 | CLOSED CHANNEL MICROFLUIDICS | authKW | 291825 | 1% | 100% | 1 |
Web of Science journal categories |
chi_square_rank | Category | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
---|---|---|---|---|---|
1 | Engineering, Electrical & Electronic | 1743 | 73% | 0% | 79 |
2 | Physics, Applied | 116 | 23% | 0% | 25 |
3 | Nanoscience & Nanotechnology | 96 | 11% | 0% | 12 |
4 | Telecommunications | 37 | 6% | 0% | 6 |
5 | Materials Science, Coatings & Films | 37 | 5% | 0% | 5 |
6 | Electrochemistry | 36 | 6% | 0% | 6 |
7 | Instruments & Instrumentation | 24 | 6% | 0% | 6 |
8 | Social Work | 22 | 2% | 0% | 2 |
9 | Gerontology | 18 | 2% | 0% | 2 |
10 | Materials Science, Multidisciplinary | 12 | 11% | 0% | 12 |
Address terms |
chi_square_rank | term | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
---|---|---|---|---|---|
1 | ADV INTEGRATED CIRCUIT PACKAGING GRP | 291825 | 1% | 100% | 1 |
2 | C4 GRP LOG TECHNOL DEV LTD | 291825 | 1% | 100% | 1 |
3 | ELECT COMPONENTS TECHNOL MAT ECTM DIMES | 291825 | 1% | 100% | 1 |
4 | GRP STRATEGY PLANNING | 291825 | 1% | 100% | 1 |
5 | YOKOSUKA ELECT COMMUN S RADIO COMMUN SYST | 291825 | 1% | 100% | 1 |
6 | WIRELESS NETWORK TECHNOL GRP | 194547 | 2% | 33% | 2 |
7 | EDUC ESTAB | 145911 | 1% | 50% | 1 |
8 | WIRELESS SYST S | 115436 | 6% | 7% | 6 |
9 | MICRO SYST DEVICES | 97274 | 1% | 33% | 1 |
10 | HITAKA WORKS | 58363 | 1% | 20% | 1 |
Journals |
chi_square_rank | term | chi_square | shrOfCwithTerm | shrOfTermInClass | termInClass |
---|---|---|---|---|---|
1 | IEEE MICROWAVE AND GUIDED WAVE LETTERS | 17009 | 6% | 1% | 7 |
2 | IEICE TRANSACTIONS ON ELECTRONICS | 9439 | 13% | 0% | 14 |
3 | IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES | 5770 | 15% | 0% | 16 |
4 | IEEE TRANSACTIONS ON ADVANCED PACKAGING | 4606 | 4% | 0% | 4 |
5 | AGEING AND SOCIETY | 3136 | 1% | 1% | 1 |
6 | SCANDINAVIAN JOURNAL OF SOCIAL WELFARE | 1918 | 1% | 1% | 1 |
7 | INTERNATIONAL JOURNAL OF MICROWAVE AND MILLIMETER-WAVE COMPUTER-AIDED ENGINEERING | 1229 | 1% | 0% | 1 |
8 | ELECTRONICS AND COMMUNICATIONS IN JAPAN PART II-ELECTRONICS | 917 | 2% | 0% | 2 |
9 | IEEE JOURNAL OF SOLID-STATE CIRCUITS | 858 | 5% | 0% | 5 |
10 | MICROELECTRONICS RELIABILITY | 628 | 4% | 0% | 4 |
Author Key Words |
Core articles |
The table includes core articles in the class. The following variables is taken into account for the relevance score of an article in a cluster c: (1) Number of references referring to publications in the class. (2) Share of total number of active references referring to publications in the class. (3) Age of the article. New articles get higher score than old articles. (4) Citation rate, normalized to year. |
Classes with closest relation at Level 1 |